Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.43 |
| ▸ | HPGD | P15428 | 2/20 | 0.43 |
| ▸ | POLB | P06746 | 2/20 | 0.38 |
| ▸ | LMNA | P02545 | 3/20 | 0.36 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.36 |
| ▸ | CHEK2 | O96017 | 1/20 | 0.35 |
| ▸ | EPHX2 | P34913 | 1/20 | 0.35 |
| ▸ | CTSK | P43235 | 1/20 | 0.35 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.35 |
| ▸ | EZH2 | Q15910 | 1/20 | 0.34 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.34 |
| ▸ | NPC1 | O15118 | 2/20 | 0.34 |
| ▸ | RAB9A | P51151 | 1/20 | 0.34 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL21333934 | 1.00 | ALDH1A1 (0.43) | ALDH1A1HPGDPOLBLMNAL3MBTL1 | |
| SCHEMBL28883558 | 0.99 | ALDH1A1 (0.42) | ALDH1A1HPGDPOLBLMNAL3MBTL1 | |
| SCHEMBL16371670 | 0.99 | ALDH1A1 (0.42) | ALDH1A1HPGDPOLBLMNAL3MBTL1 | |
| SCHEMBL17069996 | 0.99 | ALDH1A1 (0.42) | ALDH1A1HPGDPOLBLMNAL3MBTL1 | |
| SCHEMBL16371669 | 0.99 | ALDH1A1 (0.42) | ALDH1A1HPGDPOLBLMNAL3MBTL1 | |
| SCHEMBL21610318 | 0.95 | ALDH1A1 (0.38) | ALDH1A1HPGDPOLBLMNACHEK2 | |
| SCHEMBL17069999 | 0.89 | L3MBTL1 (0.44) | ALDH1A1HPGDLMNAL3MBTL1KMT2A | |
| SCHEMBL17070002 | 0.89 | POLB (0.37) | ALDH1A1HPGDPOLBLMNAL3MBTL1 | |
| SCHEMBL15960798 | 0.89 | POLB (0.37) | ALDH1A1HPGDPOLBLMNAL3MBTL1 | |
| SCHEMBL17644162 | 0.89 | POLB (0.37) | ALDH1A1HPGDPOLBLMNAL3MBTL1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240210827-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-06-27 | — | — | US | disclosed |
| US-20240210827-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-06-27 | — | — | US | disclosed |
| WO-2021125160-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PARTITION WALL, ORGANIC ELECTROLUMINESCENT ELEMENT AND IMAGE DISPLAY DEVICE | 三菱ケミカル株式会社 | 2021-06-24 | — | — | WO | disclosed |
| US-20200409263-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-12-31 | — | — | US | disclosed |
| US-10831101-B2 | Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-11-10 | — | — | US | disclosed |
| US-20190113845-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2019-04-18 | — | — | US | disclosed |
| WO-2017170600-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | 旭化成株式会社 | 2017-10-05 | — | — | WO | disclosed |
| US-9683150-B2 | Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-06-20 | — | — | US | disclosed |
| US-9683150-B2 | Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-06-20 | — | — | US | disclosed |
| US-20170115563-A1 | ENERGY-SENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-04-27 | — | — | US | disclosed |
| US-20170115563-A1 | ENERGY-SENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-04-27 | — | — | US | disclosed |
| EP-2930200-B1 | Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material | TOKYO OHKA KOGYO CO LTD (JP) | 2016-07-20 | — | — | EP | disclosed |
| WO-2015198887-A1 | ENERGY-SENSITIVE RESIN COMPOSITION | 東京応化工業株式会社 | 2015-12-30 | — | — | WO | disclosed |
| EP-2930200-A1 | Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material | TOKYO OHKA KOGYO CO., LTD. (JP) | 2015-10-14 | — | — | EP | disclosed |
| US-20150252229-A1 | CURABLE COMPOSITION, ADHESIVE, METHOD OF PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL | TOKYO OHKA KOGYO CO., LTD. (JP) | 2015-09-10 | — | — | US | disclosed |
| US-20150252229-A1 | CURABLE COMPOSITION, ADHESIVE, METHOD OF PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL | TOKYO OHKA KOGYO CO., LTD. (JP) | 2015-09-10 | — | — | US | disclosed |