Glutarate

Glutarate

SCHEMBL170769

O=C([O-])CCCC(=O)[O-].O=C([O-])CCCC(=O)[O-].O=C([O-])CCCC(=O)[O-].O=C([O-])CCCC(=O)[O-].[O-2].[O-2].[Ti+4].[Ti+4].[Ti+4]

nearest known ligand 0.58

Full drug profile on Sugi Atlas →

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
CA1 P00915 3/20 0.58
HDAC3 O15379 3/20 0.50
HDAC1 Q13547 3/20 0.50
HDAC2 Q92769 3/20 0.50
HDAC8 Q9BY41 3/20 0.50
FFAR3 O14843 2/20 0.50
BBOX1 O75936 3/20 0.46
CA4 P22748 2/20 0.44
FABP3 P05413 2/20 0.42
HDAC4 P56524 1/20 0.42
HDAC7 Q8WUI4 1/20 0.42
HDAC10 Q969S8 1/20 0.42
HDAC11 Q96DB2 1/20 0.42
HDAC6 Q9UBN7 1/20 0.42
HDAC9 Q9UKV0 1/20 0.42
HDAC5 Q9UQL6 1/20 0.42
SLC22A6 Q4U2R8 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Glutarate SCHEMBL28508163 1.00 CA1 (0.58) CA1HDAC3HDAC1HDAC2HDAC8
Glutarate SCHEMBL106537 0.92 CA1 (0.58) CA1HDAC3HDAC1HDAC2HDAC8
Glutarate SCHEMBL5650126 0.92 CA1 (0.58) CA1HDAC3HDAC1HDAC2HDAC8
Glutarate SCHEMBL5142631 0.92 CA1 (0.58) CA1HDAC3HDAC1HDAC2HDAC8
Glutarate SCHEMBL5142628 0.92 CA1 (0.58) CA1HDAC3HDAC1HDAC2HDAC8
Glutarate SCHEMBL8618874 0.92 CA1 (0.58) CA1HDAC3HDAC1HDAC2HDAC8
Glutarate SCHEMBL5650130 0.92 CA1 (0.58) CA1HDAC3HDAC1HDAC2HDAC8
Glutarate SCHEMBL11453115 0.92 CA1 (0.58) CA1HDAC3HDAC1HDAC2HDAC8
Glutarate SCHEMBL3142994 0.92 CA1 (0.58) CA1HDAC3HDAC1HDAC2HDAC8
Glutarate SCHEMBL2067310 0.92 CA1 (0.58) CA1HDAC3HDAC1HDAC2HDAC8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 307 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9670069-B2 Methods of making metal-oxides and uses thereof for water treatment and energy applications THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) 2017-06-06 US claimed
US-9593027-B2 Porous metal oxide and metal oxide-organic nanocomposites, methods of making and uses thereof THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) 2017-03-14 US claimed
US-20140077425-A1 POROUS METAL OXIDE AND METAL OXIDE-ORGANIC NANOCOMPOSITES, METHODS OF MAKING AND USES THEREOF THE REGENTS OF THE UNIVERSITY OF CALIFORNIA 2014-03-20 US claimed
US-20120267321-A1 METHODS OF MAKING METAL-OXIDES AND USES THEREOF FOR WATER TREATMENT AND ENERGY APPLICATIONS THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) 2012-10-25 US claimed
US-20080206562-A1 METHODS OF GENERATING SUPPORTED NANOCATALYSTS AND COMPOSITIONS THEREOF THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) 2008-08-28 US claimed
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-28 US disclosed
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-09 US disclosed
US-20260063999-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-03-05 US disclosed
US-20260036904-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-02-05 US disclosed
US-20260003274-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2026-01-01 US disclosed
US-20260003281-A1 RESIN COMPOSITION, DIAMINE COMPOUND, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2026-01-01 US disclosed
US-20260003276-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2026-01-01 US disclosed
US-20030175619-A1 Multilayer; heat insulation layer, heat sensitive elements, ink repellent; offset printing; applying voltage to pin electrode TORAY INDUSTRIES, INC. (JP) 2003-09-18 US disclosed
EP-1338434-A2 Directly imageable waterless planographic printing plate precursor TORAY INDUSTRIES, INC. (JP) 2003-08-27 EP disclosed
US-6566028-B2 Toner particles each have a silicon compound-containing coating layer formed on the surface and are stuck to one another CANON KABUSHIKI KAISHA (JP) 2003-05-20 US disclosed
US-20020197551-A1 Toner, and process for producing toner TAZAWA YAYOI (JP) 2002-12-26 US disclosed
US-20020045131-A1 Applying laser beam to a plate precursor comprising at least a substrate, a thermo-sensitive layer and a ink-repelling layer in this order, removing the ink-repelling layer, and dyeing TORAY INDUSTRIES, INC. (JP) 2002-04-18 US disclosed
US-6358658-B1 COLOR TONERS AND BINDERS CANON KABUSHIKI KAISHA (JP) 2002-03-19 US disclosed
EP-1142709-A2 Directly imageable planographic printing plate and method of production thereof TORAY INDUSTRIES, INC. (JP) 2001-10-10 EP disclosed
EP-1003080-A1 Toner, and process for producing toner CANON KABUSHIKI KAISHA (JP) 2000-05-24 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (7 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ARCN1, GLRA1, PSMA1 CA1 332/4885HDAC3 981/4885HDAC1 622/4885
US-20260003281-A1 RESIN COMPOSITION, DIAMINE COMPOUND, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE SEM1, SAT1, ASIC1 CA1 2090/4885HDAC3 4810/4885HDAC1 3917/4885
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME CD79B, ITGA1, PTK2 CA1 204/4885HDAC3 4069/4885HDAC1 1766/4885
US-20260003274-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE SEM1, ASIC1, SMARCB1 CA1 1289/4885HDAC3 4243/4885HDAC1 3005/4885
US-20260036904-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE RER1, ASIC1, FRG1 CA1 193/4885HDAC3 2255/4885HDAC1 1073/4885
US-20260003276-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE RER1, SEM1, RAD51 CA1 3100/4885HDAC3 3824/4885HDAC1 2444/4885
US-20260063999-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM ARCN1, PBRM1, LCP1 CA1 634/4885HDAC3 3640/4885HDAC1 1700/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.