SCHEMBL5667262

SCHEMBL5667262

C#Cc1cc(-c2ccc(C(=O)O)c(C#C)c2)ccc1C(=O)O

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ACMSD Q8TDX5 3/20 0.46
HNF4A P41235 2/20 0.46
KMT2A Q03164 2/20 0.45
KDM4E B2RXH2 1/20 0.45
GFER P55789 1/20 0.45
RXFP1 Q9HBX9 1/20 0.45
MCL1 Q07820 3/20 0.41
DHFR P00374 1/20 0.41
CYP1A2 P05177 1/20 0.41
DCLRE1A Q6PJP8 1/20 0.41
DCLRE1B Q9H816 1/20 0.41
PPM1B O75688 1/20 0.41
XDH P47989 2/20 0.40
SLC22A12 Q96S37 2/20 0.40
CFD P00746 1/20 0.39
LCK P06239 1/20 0.39
RXRB P28702 2/20 0.39
MEN1 O00255 1/20 0.38
APP P05067 1/20 0.38
THRB P10828 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1095325 0.93 ACMSD (0.58) ACMSDHNF4AMCL1DHFRDCLRE1A
Hydrochloric Acid SCHEMBL4352423 0.91 ACMSD (0.56) ACMSDHNF4AMCL1DHFRDCLRE1A
SCHEMBL9425798 0.85 RXRB (0.50) ACMSDHNF4AXDHSLC22A12RXRB
SCHEMBL5668188 0.83 KMT2A (0.50) ACMSDHNF4AKMT2AKDM4EGFER
SCHEMBL9425970 0.82 RXRB (0.58) ACMSDHNF4AXDHSLC22A12RXRB
SCHEMBL1713016 0.82 KDM4E (0.47) KDM4ECYP1A2TDP1CA12ALDH1A1
SCHEMBL689510 0.82 CYP1A2 (0.39) HNF4AKMT2AKDM4ECYP1A2MEN1
SCHEMBL4440190 0.81 KMO (0.51) ACMSDHNF4AKDM4EDCLRE1ADCLRE1B
SCHEMBL8576509 0.80 SMN1; SMN2 (0.57) KMT2AKDM4ECYP1A2MEN1TDP1
Hydrochloric Acid SCHEMBL3453575 0.80 KDM4E (0.46) KDM4ECYP1A2TDP1CA12ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1333050-B1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO (JP) 2006-12-27 EP disclosed
US-7049371-B2 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2006-05-23 US disclosed
US-20040002572-A1 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2004-01-01 US disclosed
EP-1333050-A1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2003-08-06 EP disclosed
EP-1327653-A1 HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2003-07-16 EP disclosed
US-6518390-B2 Polybenzoxazole and crosslinking agent SUMITOMO BAKELITE COMPANY, LTD. (JP) 2003-02-11 US disclosed
US-20020013443-A1 Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2002-01-31 US disclosed