SCHEMBL17159504

SCHEMBL17159504

CCCOc1c(OC(=O)C(=C(OCC)OCC)C(OCC)(OCC)OCC)c(OCCC)c(OC(OCC)(OCC)C(OCC)(OCC)C(OCC)(OCC)OCC)c(C(C)(C)c2c(OCCC)c(OCCC)c(OC(=O)C(=C(OCC)OCC)C(OCC)(OCC)OCC)c(OCCC)c2OC(OCC)(OCC)C(OCC)(OCC)C(OCC)(OCC)OCC)c1OCCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9486472 0.66
SCHEMBL391495 0.66 TSHR (0.36)
SCHEMBL304628 0.65
SCHEMBL393926 0.63
SCHEMBL305971 0.61
SCHEMBL390205 0.61
SCHEMBL65415 0.59 THRB (0.36)
SCHEMBL21373882 0.57 NPC1 (0.41)
SCHEMBL6292018 0.56 THRB (0.51)
SCHEMBL306060 0.55

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10564543-B2 Photosensitive resin composition, photosensitive element, method for producing substrate with resist pattern, and method for producing printed wiring board HITACHI CHEMICAL COMPANY, LTD. (JP) 2020-02-18 US disclosed
US-20170261851-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR PRODUCING SUBSTRATE WITH RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD RESONAC CORPORATION (JP) 2017-09-14 US disclosed
US-20150293443-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD HITACHI CHEMICAL COMPANY, LTD. (JP) 2015-10-15 US disclosed