⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6472847 | 0.88 | — | — | |
| SCHEMBL11705925 | 0.85 | — | — | |
| SCHEMBL305971 | 0.81 | — | — | |
| SCHEMBL391495 | 0.73 | TSHR (0.36) | — | |
| SCHEMBL9486472 | 0.71 | — | — | |
| SCHEMBL392034 | 0.69 | — | — | |
| SCHEMBL11706070 | 0.69 | — | — | |
| SCHEMBL390205 | 0.68 | — | — | |
| SCHEMBL304628 | 0.64 | — | — | |
| SCHEMBL17159504 | 0.63 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2284611-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, RESIST PATTERN MANUFACTURING METHOD, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD | HITACHI CHEMICAL CO LTD (JP) | 2013-11-20 | — | — | EP | disclosed |
| US-8501392-B2 | Photosensitive element, method for formation of resist pattern, and method for production of print circuit board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-08-06 | — | — | US | disclosed |
| US-8460853-B2 | Photosensitive resin composition, photosensitive element, resist pattern manufacturing method, and printed circuit board manufacturing method | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-06-11 | — | — | US | disclosed |
| US-8460852-B2 | Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for manufacturing printed wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-06-11 | — | — | US | disclosed |
| US-20120040290-A1 | PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE ELEMENT, RESIST PATTERN FORMATION METHOD AND PRINTED CIRCUIT BOARD PRODUCTION METHOD EACH UTILIZING SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-02-16 | — | — | US | disclosed |
| US-8101339-B2 | Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-01-24 | — | — | US | disclosed |
| US-8007983-B2 | Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, and method for producing printed wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-08-30 | — | — | US | disclosed |
| US-20110111344-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-05-12 | — | — | US | disclosed |
| US-20110081616-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, RESIST PATTERN MANUFACTURING METHOD, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-04-07 | — | — | US | disclosed |
| EP-2284611-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, RESIST PATTERN MANUFACTURING METHOD, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD | Hitachi Chemical Company, Ltd. (JP) | 2011-02-16 | — | — | EP | disclosed |
| US-20070185287-A1 | Modified epoxy resin, process for its production, photosensitive resin composition and photsensitive element | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2007-08-09 | — | — | US | disclosed |
| US-7067226-B2 | Photosensitive film for circuit formation and process for producing printed wiring board | HITACHI CHEMICAL CO., LTD. (JP) | 2006-06-27 | — | — | US | disclosed |
| US-20060051698-A1 | Photosensitive resin composition and photosensitive element employing using the same | MIYOSHI HIROKO | 2006-03-09 | — | — | US | disclosed |
| EP-1569213-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT USING THE SAME | Hitachi Chemical Co., Ltd. (JP) | 2005-08-31 | — | — | EP | disclosed |
| WO-2005016983-A1 | COATING SYSTEM CONTAINING (METH)ACRYLATE | SIKA TECHNOLOGY AG (CH) | 2005-02-24 | — | — | WO | disclosed |
| US-20040112859-A1 | Photosensitive film for circuit formation and process for producing printed wiring board | HITACHI CHEMICAL CO., LTD. (JP) | 2004-06-17 | — | — | US | disclosed |
| EP-0769038-B1 | SYNTHETIC MORTAR RESIN COMPOSITIONS | CRAY VALLEY SA (FR) | 1998-03-04 | — | — | EP | disclosed |
| EP-0769038-A1 | SYNTHETIC MORTAR RESIN COMPOSITIONS | CRAY VALLEY SA (FR) | 1997-04-23 | — | — | EP | disclosed |
| WO-1996001876-A1 | SYNTHETIC MORTAR RESIN COMPOSITIONS | CRAY VALLEY S.A. (FR) | 1996-01-25 | — | — | WO | disclosed |
| US-4055542-A | PEROXIDE | THREE BOND CO., LTD. (JA) | 1977-10-25 | — | — | US | disclosed |