Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PRKCE | Q02156 | 3/20 | 0.44 |
| ▸ | MYLK | Q15746 | 2/20 | 0.44 |
| ▸ | MAPT | P10636 | 2/20 | 0.44 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.44 |
| ▸ | MEN1 | O00255 | 1/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.44 |
| ▸ | PRKCG | P05129 | 1/20 | 0.44 |
| ▸ | PRKCA | P17252 | 1/20 | 0.44 |
| ▸ | APEX1 | P27695 | 1/20 | 0.44 |
| ▸ | RECQL | P46063 | 1/20 | 0.44 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.44 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.36 |
| ▸ | GAA | P10253 | 2/20 | 0.36 |
| ▸ | HSD17B3 | P37058 | 1/20 | 0.35 |
| ▸ | IDH1 | O75874 | 1/20 | 0.33 |
| ▸ | NPC1 | O15118 | 1/20 | 0.33 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.33 |
| ▸ | HTT | P42858 | 1/20 | 0.33 |
| ▸ | RAB9A | P51151 | 1/20 | 0.33 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12152954 | 0.94 | PRKCE (0.48) | PRKCEMYLKMAPTTDP1MEN1 | |
| SCHEMBL17356541 | 0.93 | PRKCE (0.40) | PRKCEMYLKMAPTTDP1MEN1 | |
| SCHEMBL20683924 | 0.91 | PRKCE (0.41) | PRKCEMYLKMAPTTDP1MEN1 | |
| SCHEMBL17354945 | 0.90 | PRKCE (0.38) | PRKCEMYLKMAPTTDP1MEN1 | |
| SCHEMBL12133572 | 0.90 | PRKCE (0.38) | PRKCEMYLKMAPTTDP1MEN1 | |
| SCHEMBL23919618 | 0.90 | PRKCE (0.43) | PRKCEMYLKMAPTTDP1MEN1 | |
| SCHEMBL15450550 | 0.87 | PRKCE (0.36) | PRKCEMYLKMAPTTDP1MEN1 | |
| SCHEMBL17356551 | 0.87 | PRKCE (0.43) | PRKCEMYLKMAPTTDP1MEN1 | |
| SCHEMBL14028989 | 0.86 | PRKCE (0.43) | PRKCEMYLKMAPTTDP1MEN1 | |
| SCHEMBL25446805 | 0.85 | PRKCE (0.42) | PRKCEMYLKMAPTTDP1MEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024018957-A1 | COMPOSITION FOR FORMING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2024-01-25 | — | — | WO | disclosed |
| US-20230350294-A1 | Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-11-02 | — | — | US | disclosed |
| EP-4067999-B1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHINETSU CHEMICAL CO (JP) | 2023-10-04 | — | — | EP | disclosed |
| EP-4063954-B1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING POSITIVE PHOTOSENSITIVE DRY FILM, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHINETSU CHEMICAL CO (JP) | 2023-10-04 | — | — | EP | disclosed |
| EP-3398983-B1 | POLYMER OF POLYIMIDE PRECURSOR, POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS | SHINETSU CHEMICAL CO (JP) | 2023-09-27 | — | — | EP | disclosed |
| US-11768434-B2 | Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-09-26 | — | — | US | disclosed |
| US-11572442-B2 | Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2023-02-07 | — | — | US | disclosed |
| EP-4067999-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2022-10-05 | — | — | EP | disclosed |
| US-11333975-B2 | Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2022-05-17 | — | — | US | disclosed |
| EP-3974904-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2022-03-30 | — | — | EP | disclosed |
| US-9557645-B2 | Positive photosensitive resin composition, photo-curable dry film and method for producing same, layered product, patterning process, and substrate | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-01-31 | — | — | US | disclosed |
| EP-2980172-B1 | SILICONE STRUCTURE-BEARING POLYMER, NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART-PROTECTING FILM | SHINETSU CHEMICAL CO (JP) | 2016-11-02 | — | — | EP | disclosed |
| US-20160200877-A1 | SILICONE SKELETON-CONTAINING POLYMER COMPOUND, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, PATTERNING PROCESS, LAYERED PRODUCT, SUBSTRATE, AND SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-07-14 | — | — | US | disclosed |
| US-9377689-B2 | Silicone structure-bearing polymer, negative resist composition, photo-curable dry film, patterning process, and electric/electronic part-protecting film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-06-28 | — | — | US | disclosed |
| US-20160147154-A1 | PATTERN FORMATION METHOD, ACTIVE LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PRODUCTION METHOD FOR ELECTRONIC DEVICE USING SAME, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2016-05-26 | — | — | US | disclosed |
| US-20160147154-A1 | PATTERN FORMATION METHOD, ACTIVE LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PRODUCTION METHOD FOR ELECTRONIC DEVICE USING SAME, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2016-05-26 | — | — | US | disclosed |
| US-20160097973-A1 | SILICONE SKELETON-CONTAINING POLYMER COMPOUND AND METHOD FOR PRODUCING SAME, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, PATTERNING PROCESS, LAYERED PRODUCT, AND SUBSTRATE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-04-07 | — | — | US | disclosed |
| US-20160033865-A1 | SILICONE STRUCTURE-BEARING POLYMER, NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART-PROTECTING FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-02-04 | — | — | US | disclosed |
| EP-2980172-A1 | SILICONE STRUCTURE-BEARING POLYMER, NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART-PROTECTING FILM | Shin-Etsu Chemical Co., Ltd. (JP) | 2016-02-03 | — | — | EP | disclosed |
| US-20150370166-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, LAYERED PRODUCT, PATTERNING PROCESS, AND SUBSTRATE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2015-12-24 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20160033865-A1 | SILICONE STRUCTURE-BEARING POLYMER, NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART-PROTECTING FILM | SMC4, SMC3, PUF60 | PRKCE 1092/4885MYLK 460/4885MAPT 804/4885 |
| US-11572442-B2 | Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component | BRIX1, RBX1, HAX1 | PRKCE 3921/4885MYLK 3966/4885MAPT 3586/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.