SCHEMBL1754885

SCHEMBL1754885

C#Cc1ccc(C#Cc2ccc(N)cc2)cc1

nearest known ligand 0.74

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
APP P05067 7/20 0.74
MAPT P10636 2/20 0.61
CA12 O43570 1/20 0.43
CA1 P00915 1/20 0.43
CA2 P00918 1/20 0.43
CA4 P22748 1/20 0.43
CA9 Q16790 1/20 0.43
CA14 Q9ULX7 1/20 0.43
MEN1 O00255 2/20 0.42
KMT2A Q03164 2/20 0.42
HDAC8 Q9BY41 2/20 0.40
PIK3CA P42336 1/20 0.39
MTOR P42345 1/20 0.39
PDK1 Q15118 1/20 0.39
ALDH1A1 P00352 1/20 0.36
TP53 P04637 1/20 0.36
CYP3A4 P08684 1/20 0.36
TDP1 Q9NUW8 1/20 0.36
NPC1 O15118 1/20 0.36
RAB9A P51151 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL106193 0.92
Hydrochloric Acid SCHEMBL2015334 0.89 APP (0.55) APPMAPTCA12CA1CA2
SCHEMBL9611200 0.86 APP (1.00) APPMAPTCA14MEN1KMT2A
SCHEMBL864945 0.86 APP (1.00) APPMAPTCA14MEN1KMT2A
SCHEMBL1306534 0.86 HDAC8 (0.50) APPMAPTCA12CA1CA2
SCHEMBL9659495 0.84 CYP3A4 (0.58) APPMAPTCA12CA1CA2
SCHEMBL21903463 0.80 APP (0.88) APPMAPTCA14MEN1KMT2A
SCHEMBL13625381 0.80 APP (0.47) APPMAPTCA12CA1CA2
SCHEMBL9658226 0.78 ALDH1A1 (0.64) APPMAPTMEN1KMT2AALDH1A1
SCHEMBL5488179 0.78 CYP3A4 (0.64) APPMAPTCA12CA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117186403-B Negative photosensitive resin, resin composition, and preparation method and application thereof 明士(北京)新材料开发有限公司 2024-04-02 CN claimed
CN-116836388-B Positive photosensitive resin, resin composition, preparation method and application thereof 明士(北京)新材料开发有限公司 2023-12-15 CN claimed
CN-117186403-A Negative photosensitive resin, resin composition, and preparation method and application thereof 明士(北京)新材料开发有限公司 2023-12-08 CN claimed
CN-116836388-A Positive photosensitive resin, resin composition, preparation method and application thereof 明士(北京)新材料开发有限公司 2023-10-03 CN claimed
CN-116149140-B Positive photosensitive resin composition with high chemical resistance and preparation method and application thereof 明士(北京)新材料开发有限公司 2023-07-14 CN claimed
CN-116068852-B Positive photosensitive resin composition and preparation method and application thereof 明士(北京)新材料开发有限公司 2023-07-14 CN claimed
CN-116149140-A Positive photosensitive resin composition with high chemical resistance and preparation method and application thereof 明士(北京)新材料开发有限公司 2023-05-23 CN claimed
CN-116068852-A Positive photosensitive resin composition and preparation method and application thereof 明士(北京)新材料开发有限公司 2023-05-05 CN claimed
CN-114995060-B Negative photosensitive resin composition capable of being cured at low temperature and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-11-01 CN claimed
CN-114995061-B Low-water-absorption positive photosensitive resin composition and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-11-01 CN claimed
CN-115220305-A Positive photosensitive resin composition and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-10-21 CN claimed
CN-114995060-A Negative photosensitive resin composition capable of being cured at low temperature and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-09-02 CN claimed
CN-114995061-A Low-water-absorption positive photosensitive resin composition and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-09-02 CN claimed
CN-117186403-B Negative photosensitive resin, resin composition, and preparation method and application thereof 明士(北京)新材料开发有限公司 2024-04-02 CN disclosed
CN-116836388-B Positive photosensitive resin, resin composition, preparation method and application thereof 明士(北京)新材料开发有限公司 2023-12-15 CN disclosed
CN-117186403-A Negative photosensitive resin, resin composition, and preparation method and application thereof 明士(北京)新材料开发有限公司 2023-12-08 CN disclosed
US-8158203-B2 Methods of attaching or grafting carbon nanotubes to silicon surfaces and composite structures derived therefrom WILLIAM MARSH RICE UNIVERSITY (US) 2012-04-17 US disclosed
US-8158203-B2 Methods of attaching or grafting carbon nanotubes to silicon surfaces and composite structures derived therefrom WILLIAM MARSH RICE UNIVERSITY (US) 2012-04-17 US disclosed
US-20090042136-A1 Carbon Nanotube-Silicon Composite Structures and Methods for Making Same NATIONAL SCIENCE FOUNDATION 2009-02-12 US disclosed
WO-2005114708-A2 CARBON NANOTUBE-SILICON COMPOSITE STRUCTURES AND METHODS FOR MAKING SAME WILLIAM MARSH RICE UNIVERSITY (US) 2005-12-01 WO disclosed