Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.38 |
| ▸ | MEN1 | O00255 | 1/20 | 0.38 |
| ▸ | USP2 | O75604 | 1/20 | 0.38 |
| ▸ | MAPT | P10636 | 1/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11528283 | 0.80 | ZDHHC20 (0.43) | — | |
| SCHEMBL7203269 | 0.80 | SMN1; SMN2 (0.42) | ALDH1A1MAPTKMT2A | |
| SCHEMBL11296232 | 0.75 | MEN1 (0.43) | ALDH1A1MEN1USP2MAPTKMT2A | |
| SCHEMBL16166598 | 0.74 | — | — | |
| SCHEMBL10906554 | 0.72 | ALDH1A1 (0.33) | ALDH1A1 | |
| SCHEMBL11591883 | 0.71 | SMN1; SMN2 (0.41) | ALDH1A1MAPTKMT2A | |
| SCHEMBL11338587 | 0.69 | — | — | |
| SCHEMBL15265892 | 0.68 | — | — | |
| SCHEMBL2790089 | 0.68 | — | — | |
| SCHEMBL11814080 | 0.67 | NAAA (0.41) | ALDH1A1MEN1MAPTKMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7713859-B2 | Tin-silver solder bumping in electronics manufacture | ENTHONE INC. (US) | 2010-05-11 | — | — | US | claimed |
| US-20070037377-A1 | TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE | ENTHONE INC. (US) | 2007-02-15 | — | — | US | claimed |
| US-10774425-B2 | Elimination of H2S in immersion tin plating solution | MACDERMID ENTHONE INC. (US) | 2020-09-15 | — | — | US | disclosed |
| US-20180347038-A1 | Elimination of H2S in Immersion Tin Plating Solution | CITIBANK, N.A. | 2018-12-06 | — | — | US | disclosed |
| EP-2494094-B1 | IMMERSION TIN SILVER PLATING IN ELECTRONICS MANUFACTURE | MACDERMID ENTHONE INC (US) | 2018-12-05 | — | — | EP | disclosed |
| US-9175400-B2 | Immersion tin silver plating in electronics manufacture | ENTHONE INC. (US) | 2015-11-03 | — | — | US | disclosed |
| EP-1946362-B1 | TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE | ENTHONE (US) | 2012-01-11 | — | — | EP | disclosed |
| US-20110097597-A1 | IMMERSION TIN SILVER PLATING IN ELECTRONICS MANUFACTURE | ENTHONE INC. (US) | 2011-04-28 | — | — | US | disclosed |
| US-7713859-B2 | Tin-silver solder bumping in electronics manufacture | ENTHONE INC. (US) | 2010-05-11 | — | — | US | disclosed |
| US-20070099810-A1 | Cleaning liquid and cleaning method | MATSUNAGA HIROSHI | 2007-05-03 | — | — | US | disclosed |
| US-20070037377-A1 | TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE | ENTHONE INC. (US) | 2007-02-15 | — | — | US | disclosed |