Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NPC1 | O15118 | 1/20 | 0.45 |
| ▸ | S1PR2 | O95136 | 1/20 | 0.45 |
| ▸ | S1PR4 | O95977 | 1/20 | 0.45 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.45 |
| ▸ | LMNA | P02545 | 1/20 | 0.45 |
| ▸ | TP53 | P04637 | 1/20 | 0.45 |
| ▸ | POLB | P06746 | 1/20 | 0.45 |
| ▸ | MAPT | P10636 | 1/20 | 0.45 |
| ▸ | HPGD | P15428 | 1/20 | 0.45 |
| ▸ | XBP1 | P17861 | 1/20 | 0.45 |
| ▸ | S1PR1 | P21453 | 1/20 | 0.45 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.45 |
| ▸ | AGTR1 | P30556 | 1/20 | 0.45 |
| ▸ | HTT | P42858 | 1/20 | 0.45 |
| ▸ | RAB9A | P51151 | 1/20 | 0.45 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.45 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.45 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.45 |
| ▸ | FAAH | O00519 | 6/20 | 0.41 |
| ▸ | CA2 | P00918 | 6/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8357995 | 0.98 | FAAH (0.45) | NPC1S1PR2S1PR4ALDH1A1LMNA | |
| SCHEMBL27508414 | 0.98 | FAAH (0.45) | NPC1S1PR2S1PR4ALDH1A1LMNA | |
| SCHEMBL16829660 | 0.93 | ALDH1A1 (0.52) | NPC1S1PR2S1PR4ALDH1A1LMNA | |
| SCHEMBL27611668 | 0.76 | CA2 (0.34) | CA2 | |
| SCHEMBL28750745 | 0.72 | NPC1 (0.52) | NPC1S1PR2S1PR4ALDH1A1LMNA | |
| SCHEMBL66144 | 0.71 | FAAH (0.43) | NPC1S1PR2S1PR4ALDH1A1LMNA | |
| SCHEMBL10826545 | 0.70 | ALDH1A1 (0.86) | NPC1S1PR2S1PR4ALDH1A1LMNA | |
| SCHEMBL10446938 | 0.70 | FAAH (0.52) | NPC1S1PR2S1PR4ALDH1A1LMNA | |
| SCHEMBL11094414 | 0.70 | FAAH (0.52) | NPC1S1PR2S1PR4ALDH1A1LMNA | |
| SCHEMBL10826548 | 0.70 | ALDH1A1 (0.86) | NPC1S1PR2S1PR4ALDH1A1LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2021149542-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, PATTERN FORMATION METHOD | 信越化学工業株式会社 | 2021-07-29 | — | — | WO | disclosed |
| WO-2021111834-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, PATTERN FORMING METHOD, AND LIGHT EMITTING ELEMENT | 信越化学工業株式会社 | 2021-06-10 | — | — | WO | disclosed |
| CN-104281006-B | Radiation-ray sensitive composition | 三菱瓦斯化学株式会社 | 2019-01-22 | — | — | CN | disclosed |
| CN-108008600-A | Radiation-ray sensitive composition | 三菱瓦斯化学株式会社 | 2018-05-08 | — | — | CN | disclosed |
| CN-107949808-A | Lower layer film for lithography forms material, lower layer film for lithography is formed with composition, lower layer film for lithography and its manufacture method, pattern formation method, resin and purification process | 三菱瓦斯化学株式会社 | 2018-04-20 | — | — | CN | disclosed |
| CN-104981463-B | Compound, lower layer film for lithography form material, lower layer film for lithography and pattern formation method | 三菱瓦斯化学株式会社 | 2018-04-13 | — | — | CN | disclosed |
| CN-107556480-A | High-molecular compound containing silicone backbone, Photocurable resin composition, photo-curable dry film, laminate and pattern formation method | 信越化学工业株式会社 | 2018-01-09 | — | — | CN | disclosed |
| CN-107531597-A | Compound, resin, lower layer film for lithography form material, lower layer film for lithography, pattern formation method and the purification process of compound or resin | 三菱瓦斯化学株式会社 | 2018-01-02 | — | — | CN | disclosed |
| CN-107250089-A | Compound, resin, lower layer film for lithography formation material, lower layer film for lithography form the purification process with composition, lower layer film for lithography, corrosion-resisting pattern forming method, circuit pattern forming method and compound or resin | 三菱瓦斯化学株式会社 | 2017-10-13 | — | — | CN | disclosed |
| CN-106687009-A | Structure modification apparatus | 宝洁公司 | 2017-05-17 | — | — | CN | disclosed |
| CN-103907057-A | Nanocomposite negative photosensitive composition and use thereof | AZ ELECTRONIC MATERIALS USA | 2014-07-02 | — | — | CN | disclosed |
| CN-103869623-A | Coating composition | AZ ELECTRONIC MATERIALS USA | 2014-06-18 | — | — | CN | disclosed |
| CN-102209937-B | Coating composition | AZ ELECTRONIC MATERIALS USA | 2014-06-11 | — | — | CN | disclosed |
| CN-103733136-A | Underlayer film forming material for lithography, underlayer film for lithography, and pattern forming method | MITSUBISHI GAS CHEMICAL CO | 2014-04-16 | — | — | CN | disclosed |
| CN-101889247-B | Composition for forming underlayer film for lithography and method for forming multilayer resist pattern | MITSUBISHI GAS CHEMICAL CO | 2013-04-03 | — | — | CN | disclosed |
| CN-102754033-A | Underlayer film material and method for forming multilayer resist pattern | MITSUBISHI GAS CHEMICAL CO | 2012-10-24 | — | — | CN | disclosed |
| CN-101263429-B | pattern forming method using film-forming composition | TOKYO OHKA KOGYO CO.,LTD. (JP) | 2011-12-28 | — | — | CN | disclosed |
| CN-102209937-A | Coating composition | AZ ELECTRONIC MATERIALS USA | 2011-10-05 | — | — | CN | disclosed |
| CN-101889247-A | Composition for forming underlayer film for lithography and method for forming multilayer resist pattern | MITSUBISHI GAS CHEMICAL CO | 2010-11-17 | — | — | CN | disclosed |
| CN-101263429-A | Film-forming composition, pattern-forming method using the same, and three-dimensional mold | TOKYO OHKA KOGYO CO LTD (JP) | 2008-09-10 | — | — | CN | disclosed |