SCHEMBL17744841

SCHEMBL17744841

Cc1c(NC(=O)c2ccc(N)cc2)cccc1NC(=O)c1ccc(N)cc1

nearest known ligand 0.65

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 3/20 0.65
POLB P06746 3/20 0.56
MEN1 O00255 1/20 0.56
LMNA P02545 1/20 0.56
PKM P14618 1/20 0.56
APEX1 P27695 1/20 0.56
KMT2A Q03164 1/20 0.56
TDP1 Q9NUW8 1/20 0.56
CYP1A2 P05177 1/20 0.55
CYP2C9 P11712 1/20 0.55
CYP2C19 P33261 1/20 0.55
NPC1 O15118 4/20 0.55
RAB9A P51151 4/20 0.55
GAA P10253 2/20 0.55
SMN1; SMN2 Q16637 3/20 0.52
HDAC1 Q13547 5/20 0.51
HDAC3 O15379 3/20 0.51
HDAC2 Q92769 3/20 0.51
MAPK1 P28482 2/20 0.51
HPGD P15428 1/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17744864 0.85 MEN1 (0.66) MAPTPOLBMEN1LMNAPKM
SCHEMBL683706 0.84 POLB (0.74) MAPTPOLBMEN1LMNAPKM
SCHEMBL16330055 0.83 POLB (0.72) MAPTPOLBMEN1PKMKMT2A
SCHEMBL1705539 0.82 HDAC1 (0.61) MAPTPOLBMEN1LMNAPKM
SCHEMBL10373756 0.81 GAA (0.57) MAPTPOLBMEN1LMNAPKM
Dinaline SCHEMBL93636 0.80 HDAC1 (0.79) NPC1RAB9AHDAC1HDAC3HDAC2
Dinaline SCHEMBL29354254 0.80 HDAC1 (0.79) NPC1RAB9AHDAC1HDAC3HDAC2
SCHEMBL27527542 0.79 HDAC2 (0.72) MAPTPOLBMEN1KMT2ACYP1A2
SCHEMBL28260594 0.79 MEN1 (0.53) MAPTPOLBMEN1LMNAPKM
SCHEMBL19303092 0.79 NPC1 (0.52) MAPTPOLBMEN1LMNAPKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10400076-B2 Epoxy resin composition, prepreg, and carbon fiber-reinforced composite material TORAY INDUSTRIES, INC. (JP) 2019-09-03 US disclosed
EP-3020763-B1 EPOXY RESIN COMPOSITION, PREPREG, AND CARBON FIBER-REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES (JP) 2018-08-29 EP disclosed
US-20160152785-A1 EPOXY RESIN COMPOSITION, PREPREG, AND CARBON FIBER-REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES, INC. (JP) 2016-06-02 US disclosed
EP-3020763-A1 EPOXY RESIN COMPOSITION, PREPREG, AND CARBON FIBER-REINFORCED COMPOSITE MATERIAL Toray Industries, Inc. (JP) 2016-05-18 EP disclosed