SCHEMBL17763369

SCHEMBL17763369

CO[Si](F)(F)c1ccccc1

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA4 P22748 2/20 0.38
ESR1 P03372 1/20 0.34
ESR2 Q92731 1/20 0.34
POLB P06746 2/20 0.33
CA12 O43570 1/20 0.33
CA1 P00915 1/20 0.33
CA2 P00918 1/20 0.33
CA7 P43166 1/20 0.33
CA9 Q16790 1/20 0.33
CA14 Q9ULX7 1/20 0.33
NR1H2 P55055 2/20 0.32
NR1H3 Q13133 2/20 0.32
ALDH1A1 P00352 2/20 0.32
LTA4H P09960 1/20 0.32
CYP1A2 P05177 1/20 0.32
CYP2C19 P33261 1/20 0.32
TSHR P16473 3/20 0.31
MEN1 O00255 1/20 0.31
MAPT P10636 1/20 0.31
KMT2A Q03164 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17763400 0.79 CA4 (0.38) CA4ESR1ESR2POLBCA12
SCHEMBL646249 0.75 CA4 (0.43) CA4ESR1ESR2POLBCA12
SCHEMBL17763357 0.73 LTA4H (0.34) ESR1ESR2NR1H2NR1H3ALDH1A1
SCHEMBL49088 0.72 CA4 (0.41) CA4ESR1ESR2POLBCA12
SCHEMBL648335 0.72 CA4 (0.41) CA4ESR1ESR2POLBCA12
SCHEMBL37986 0.72 CA4 (0.41) CA4ESR1ESR2POLBCA12
SCHEMBL49008 0.72 CA4 (0.41) CA4ESR1ESR2POLBCA12
SCHEMBL27596877 0.72 CA4 (0.41) CA4ESR1ESR2POLBCA12
Ammonia Solution, Strong SCHEMBL2330946 0.70 POLB (0.39) CA4ESR1ESR2POLBCA12
SCHEMBL705043 0.70 ESR1 (0.41) CA4ESR1ESR2POLBCA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109415494-B Two-pack type epoxy resin composition 思美定株式会社 2021-11-09 CN disclosed
CN-107148453-B Photocurable composition 思美定株式会社 2021-08-17 CN disclosed
CN-107428891-B Curable composition 施敏打硬株式会社 2021-04-20 CN disclosed
US-10920068-B2 Two-pack type epoxy resin composition CEMEDINE CO., LTD. (JP) 2021-02-16 US disclosed
CN-108431157-B Bonding method using photocurable adhesive 思美定株式会社 2021-02-05 CN disclosed
EP-3480238-B1 TWO-PACK TYPE EPOXY RESIN COMPOSITION CEMEDINE CO LTD (JP) 2020-12-02 EP disclosed
US-10844251-B2 Pressure-sensitive adhesive CEMEDINE CO., LTD. (JP) 2020-11-24 US disclosed
CN-105392845-B Photocurable composition 思美定株式会社 2020-10-20 CN disclosed
CN-107532061-B Pressure-sensitive adhesive 思美定株式会社 2020-03-03 CN disclosed
US-20190225795-A1 TWO-PACK TYPE EPOXY RESIN COMPOSITION CEMEDINE CO., LTD. (JP) 2019-07-25 US disclosed
EP-3480238-A1 TWO-PACK TYPE EPOXY RESIN COMPOSITION Cemedine Co., Ltd. (JP) 2019-05-08 EP disclosed
EP-3081612-B1 PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES CEMEDINE CO LTD (JP) 2018-11-14 EP disclosed
US-20180298239-A1 PRESSURE-SENSITIVE ADHESIVE CEMEDINE CO., LTD. (JP) 2018-10-18 US disclosed
EP-3287501-A1 PRESSURE-SENSITIVE ADHESIVE Cemedine Co., Ltd. (JP) 2018-02-28 EP disclosed
US-9718999-B2 Photocurable composition having adhesive properties CEMEDINE CO., LTD (JP) 2017-08-01 US disclosed
US-20160312089-A1 PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES CEMEDINE CO., LTD. (JP) 2016-10-27 US disclosed
EP-3081612-A1 PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES Cemedine Co., Ltd. (JP) 2016-10-19 EP disclosed
US-20160152783-A1 PHOTOCURABLE COMPOSITION CEMEDINE CO., LTD. (JP) 2016-06-02 US disclosed
EP-3023462-A1 PHOTOCURABLE COMPOSITION Cemedine Co., Ltd. (JP) 2016-05-25 EP disclosed