SCHEMBL17827630

SCHEMBL17827630

CNC(=O)c1ccc(-c2ccc(C(=O)Nc3ccc(-c4ccc(C)cc4C)c(C(F)(F)F)c3)c(C(=O)O)c2)cc1C(=O)O

nearest known ligand 0.45

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
▸ S1PR1 P21453 8/20 0.45
▸ S1PR3 Q99500 5/20 0.45
▸ HTT P42858 2/20 0.43
▸ LMNA P02545 1/20 0.43
▸ SMN1; SMN2 Q16637 1/20 0.43
▸ SORT1 Q99523 5/20 0.42
▸ MEN1 O00255 2/20 0.41
▸ KMT2A Q03164 2/20 0.41
▸ NPC1 O15118 1/20 0.41
▸ MAPT P10636 1/20 0.41
▸ RAB9A P51151 1/20 0.41
▸ NPSR1 Q6W5P4 1/20 0.41
▸ NR1H4 Q96RI1 1/20 0.40
▸ CYP1A2 P05177 1/20 0.40
▸ ALDH1A1 P00352 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16263581 0.92 S1PR1 (0.46) S1PR1S1PR3HTTLMNASMN1; SMN2
SCHEMBL12994272 0.91 S1PR1 (0.47) S1PR1S1PR3HTTMEN1KMT2A
SCHEMBL12994264 0.87 S1PR1 (0.39) S1PR1S1PR3HTTLMNASMN1; SMN2
SCHEMBL17298044 0.85 KMT2A (0.46) SORT1MEN1KMT2ANPC1MAPT
SCHEMBL15445486 0.82 MAPT (0.56) HTTLMNASMN1; SMN2MEN1KMT2A
SCHEMBL15445485 0.81 MEN1 (0.59) HTTLMNASMN1; SMN2MEN1KMT2A
SCHEMBL12172804 0.79 TAS2R14 (0.55) S1PR1S1PR3HTTLMNASMN1; SMN2
SCHEMBL10024745 0.79 SORT1 (0.44) S1PR1S1PR3HTTSORT1MEN1
SCHEMBL12605304 0.79 POLB (0.43) S1PR1S1PR3KMT2AMAPTCYP1A2
SCHEMBL17268315 0.79 TDP1 (0.50) HTTLMNASMN1; SMN2SORT1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9676662-B2 Supported resin substrate and method for producing the same and electronic device in which the supported resin substrate is used PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2017-06-13 — — US disclosed
US-9397001-B2 Method for manufacturing electronic device comprising a resin substrate and an electronic component PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2016-07-19 — — US disclosed
US-20160172244-A1 METHOD FOR MANUFACTURING ELECTRONIC DEVICE COMPRISING A RESIN SUBSTRATE AND AN ELECTRONIC COMPONENT SAMSUNG DISPLAY CO., LTD. (KR) 2016-06-16 — — US disclosed
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