SCHEMBL17835366

SCHEMBL17835366

CO[Si](Cl)(OC)c1ccc(C)cc1

nearest known ligand 0.40

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
ACHE P22303 6/20 0.40
TDP1 Q9NUW8 2/20 0.40
CA1 P00915 1/20 0.38
CA2 P00918 1/20 0.38
CA7 P43166 1/20 0.38
CA9 Q16790 1/20 0.38
KMT2A Q03164 3/20 0.33
MEN1 O00255 1/20 0.33
RELA Q04206 1/20 0.32
ALDH1A1 P00352 2/20 0.32
NPC1 O15118 1/20 0.31
RAB9A P51151 1/20 0.31
CYP3A4 P08684 1/20 0.30
TSHR P16473 1/20 0.30
TEAD4 Q15561 1/20 0.30
AGXT P21549 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17835349 0.80 ACHE (0.40) ACHETDP1CA1CA2CA7
SCHEMBL23152422 0.80 LMNA (0.40) KMT2AMEN1ALDH1A1NPC1RAB9A
SCHEMBL28422604 0.78 TDP1 (0.42) ACHETDP1KMT2AMEN1RELA
SCHEMBL22472159 0.78 CA1 (0.52) ACHETDP1CA1CA2CA7
SCHEMBL1224540 0.77 CA4 (0.38) ACHECA1CA2CA7CA9
SCHEMBL20580214 0.75 KIF11 (0.40) ACHECA1CA2CA9ALDH1A1
SCHEMBL106097 0.74 ACHE (0.44) ACHETDP1CA1CA2CA7
SCHEMBL3867444 0.74 ACHE (0.44) ACHETDP1CA1CA2CA7
SCHEMBL297138 0.74 ACHE (0.44) ACHETDP1CA1CA2CA7
SCHEMBL301896 0.73 ACHE (0.50) ACHETDP1CA1CA2CA7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2022202119-A1 CURABLE COMPOSITION AND CURED OBJECT リンテック株式会社 2022-09-29 WO disclosed
CN-114402036-A Curable composition, cured product, and method for using curable composition 琳得科株式会社 2022-04-26 CN disclosed
CN-114402037-A Curable composition, cured product, and method for using curable composition 琳得科株式会社 2022-04-26 CN disclosed
WO-2021060562-A1 CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION リンテック株式会社 2021-04-01 WO disclosed
WO-2021060561-A1 CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION リンテック株式会社 2021-04-01 WO disclosed
EP-3034543-B1 CURABLE COMPOSITION, CURING PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION LINTEC CORP (JP) 2021-03-31 EP disclosed
US-9670326-B2 Curable composition, curing product, and method for using curable composition LINTEC CORPORATION (JP) 2017-06-06 US disclosed
US-9540490-B2 Curable composition, curing product, and method for using curable composition LINTEC CORPORATION (JP) 2017-01-10 US disclosed
US-20160229961-A1 CURABLE COMPOSITION, CURING PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION LINTEC CORPORATION (JP) 2016-08-11 US disclosed
US-20160208054-A1 CURABLE COMPOSITION, CURING PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION LINTEC CORPORATION (JP) 2016-07-21 US disclosed
EP-3034560-A1 CURABLE COMPOSITION, CURING PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION Lintec Corporation (JP) 2016-06-22 EP disclosed
EP-3034543-A1 CURABLE COMPOSITION, CURING PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION Lintec Corporation (JP) 2016-06-22 EP disclosed