SCHEMBL20580214

SCHEMBL20580214

CO[Si](Cl)(OC)c1ccc(C(F)(F)F)cc1

nearest known ligand 0.40

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
KIF11 P52732 5/20 0.40
ALDH1A1 P00352 1/20 0.37
TSHR P16473 1/20 0.37
IDO1 P14902 2/20 0.36
AHR P35869 1/20 0.36
CES2 O00748 1/20 0.35
CES1 P23141 1/20 0.35
ORAI1 Q96D31 1/20 0.35
ORAI2 Q96SN7 1/20 0.35
ORAI3 Q9BRQ5 1/20 0.35
TRPV6 Q9H1D0 1/20 0.35
MGLL Q99685 1/20 0.35
CA1 P00915 1/20 0.34
CA2 P00918 1/20 0.34
CA9 Q16790 1/20 0.34
NR1H2 P55055 1/20 0.34
NR1H3 Q13133 1/20 0.34
ACHE P22303 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28231186 0.83 KIF11 (0.40) KIF11ALDH1A1TSHRIDO1AHR
SCHEMBL20579948 0.82 NR1H2 (0.39) KIF11IDO1NR1H2NR1H3
SCHEMBL4898228 0.77 KIF11 (0.43) KIF11ALDH1A1TSHRIDO1AHR
SCHEMBL15736269 0.76 KIF11 (0.41) KIF11ALDH1A1TSHRIDO1AHR
SCHEMBL15734116 0.76 KIF11 (0.41) KIF11ALDH1A1TSHRIDO1AHR
SCHEMBL23152422 0.75 LMNA (0.40) ALDH1A1IDO1
SCHEMBL17835366 0.75 ACHE (0.40) ALDH1A1TSHRCA1CA2CA9
SCHEMBL15736394 0.74 KIF11 (0.40) KIF11ALDH1A1TSHRIDO1AHR
SCHEMBL15733956 0.74 KIF11 (0.40) KIF11ALDH1A1TSHRIDO1AHR
SCHEMBL3175501 0.74 KIF11 (0.48) KIF11ALDH1A1TSHRAHRCES2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112739776-B Curable composition, cured product, and method for using curable composition 琳得科株式会社 2022-10-28 CN disclosed
US-11315899-B2 Die bonding material, light-emitting device, and method for producing light-emitting device LINTEC CORPORATION (JP) 2022-04-26 US disclosed
US-10920117-B2 Curable composition, method for producing curable composition, cured product, use of curable composition, and optical device LINTEC CORPORATION (JP) 2021-02-16 US disclosed
US-20200335471-A1 DIE BONDING MATERIAL, LIGHT-EMITTING DEVICE, AND METHOD FOR PRODUCING LIGHT-EMITTING DEVICE LINTEC CORPORATION (JP) 2020-10-22 US disclosed
US-20180355111-A1 CURABLE COMPOSITION, METHOD FOR PRODUCING CURABLE COMPOSITION, CURED PRODUCT, USE OF CURABLE COMPOSITION, AND OPTICAL DEVICE LINTEC CORPORATION (JP) 2018-12-13 US disclosed