⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15136051 | 0.91 | TSHR (0.36) | — | |
| SCHEMBL30000573 | 0.91 | TSHR (0.36) | — | |
| SCHEMBL1224564 | 0.84 | — | — | |
| SCHEMBL6064169 | 0.78 | — | — | |
| SCHEMBL1225423 | 0.77 | — | — | |
| SCHEMBL704129 | 0.77 | — | — | |
| SCHEMBL5573883 | 0.75 | CTSK (0.31) | — | |
| SCHEMBL5575133 | 0.75 | — | — | |
| SCHEMBL1225241 | 0.75 | — | — | |
| SCHEMBL1224983 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116981751-A | Adhesive paste, method for using adhesive paste, and method for manufacturing semiconductor device | 琳得科株式会社 | 2023-10-31 | — | — | CN | disclosed |
| CN-112739775-B | Curable composition, cured product, and method for using curable composition | 琳得科株式会社 | 2022-11-01 | — | — | CN | disclosed |
| CN-112739776-B | Curable composition, cured product, and method for using curable composition | 琳得科株式会社 | 2022-10-28 | — | — | CN | disclosed |
| WO-2022209064-A1 | ADHESIVE PASTE, METHOD FOR USING ADHESIVE PASTE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | リンテック株式会社 | 2022-10-06 | — | — | WO | disclosed |
| EP-3196254-B1 | CURABLE COMPOSITION, METHOD OF PRODUCING CURABLE COMPOSITION, CURED MATERIAL, METHOD OF USING CURABLE COMPOSITION, AND OPTICAL DEVICE | LINTEC CORP (JP) | 2022-07-13 | — | — | EP | disclosed |
| EP-3187546-B1 | CURABLE COMPOSITION, METHOD OF PRODUCING CURABLE COMPOSITION, CURED MATERIAL, METHOD OF USING CURABLE COMPOSITION, AND OPTICAL DEVICE | LINTEC CORP (JP) | 2022-07-13 | — | — | EP | disclosed |
| CN-112739748-B | Curable polysilsesquioxane compound, curable composition, cured product, and method for using curable composition | 琳得科株式会社 | 2022-07-12 | — | — | CN | disclosed |
| US-11315899-B2 | Die bonding material, light-emitting device, and method for producing light-emitting device | LINTEC CORPORATION (JP) | 2022-04-26 | — | — | US | disclosed |
| CN-108473767-B | Curable composition, method for producing curable composition, cured product, and method for using curable composition | 琳得科株式会社 | 2021-07-13 | — | — | CN | disclosed |
| CN-108368346-B | Curable composition, method for producing curable composition, cured product, method for using curable composition, and optical device | 琳得科株式会社 | 2021-07-13 | — | — | CN | disclosed |
| EP-3196254-A1 | CURABLE COMPOSITION, METHOD OF PRODUCING CURABLE COMPOSITION, CURED MATERIAL, METHOD OF USING CURABLE COMPOSITION, AND OPTICAL DEVICE | Lintec Corporation (JP) | 2017-07-26 | — | — | EP | disclosed |
| EP-3187546-A1 | CURABLE COMPOSITION, METHOD OF PRODUCING CURABLE COMPOSITION, CURED MATERIAL, METHOD OF USING CURABLE COMPOSITION, AND OPTICAL DEVICE | Lintec Corporation (JP) | 2017-07-05 | — | — | EP | disclosed |
| EP-3187547-A1 | CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE | Lintec Corporation (JP) | 2017-07-05 | — | — | EP | disclosed |
| EP-3187545-A1 | CURABLE COMPOSITION, METHOD FOR PRODUCING CURABLE COMPOSITION, CURED OBJECT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE | Lintec Corporation (JP) | 2017-07-05 | — | — | EP | disclosed |
| US-9670326-B2 | Curable composition, curing product, and method for using curable composition | LINTEC CORPORATION (JP) | 2017-06-06 | — | — | US | disclosed |
| EP-3173445-A1 | CURABLE COMPOSITION, METHOD FOR MANUFACTURING CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE | LINTEC Corporation (JP) | 2017-05-31 | — | — | EP | disclosed |
| US-9540490-B2 | Curable composition, curing product, and method for using curable composition | LINTEC CORPORATION (JP) | 2017-01-10 | — | — | US | disclosed |
| US-20160229961-A1 | CURABLE COMPOSITION, CURING PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION | LINTEC CORPORATION (JP) | 2016-08-11 | — | — | US | disclosed |
| US-20160208054-A1 | CURABLE COMPOSITION, CURING PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION | LINTEC CORPORATION (JP) | 2016-07-21 | — | — | US | disclosed |
| EP-3034560-A1 | CURABLE COMPOSITION, CURING PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION | Lintec Corporation (JP) | 2016-06-22 | — | — | EP | disclosed |