SCHEMBL5573883

SCHEMBL5573883

CCCC[SiH2]OC(CCC)CCC

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
CTSK P43235 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5570833 0.95 CTSK (0.33) CTSK
SCHEMBL5575130 0.93 OPRM1 (0.34)
SCHEMBL713106 0.92
SCHEMBL707242 0.92
SCHEMBL5574580 0.91 DNM1 (0.37)
SCHEMBL5573935 0.91
SCHEMBL705226 0.91 CTSK (0.33) CTSK
SCHEMBL5572095 0.91 DNM1 (0.37)
SCHEMBL703536 0.91 CTSK (0.33) CTSK
SCHEMBL3241047 0.90

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7169327-B2 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof JSR CORPORATION (JP) 2007-01-30 US disclosed
EP-1566368-A2 Glass powder-containing resin composition, transfer film and process for manufacturing a plasma display panel comprising the transfer film JSR Corporation (JP) 2005-08-24 EP disclosed
EP-1387367-A1 COMPOSITE PARTICLE FOR DIELECTRICS, ULTRAMICROPARTICULATE COMPOSITE RESIN PARTICLE, COMPOSITION FOR FORMING DIELECTRICS AND USE THEREOF JSR Corporation (JP) 2004-02-04 EP disclosed
US-20030151032-A1 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof JSR CORPORATION (JP) 2003-08-14 US disclosed