SCHEMBL1787786

SCHEMBL1787786

O=C(c1ccc(F)cc1)c1ccc(Sc2ccc([S+](c3ccc(F)cc3)c3ccc(F)cc3)cc2)cc1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LTA4H P09960 1/20 0.47
HPGD P15428 4/20 0.47
LMNA P02545 3/20 0.47
L3MBTL1 Q9Y468 2/20 0.47
CES2 O00748 1/20 0.42
CES1 P23141 1/20 0.42
ALDH1A1 P00352 5/20 0.42
MEN1 O00255 1/20 0.41
CYP1A2 P05177 1/20 0.41
CYP2C9 P11712 1/20 0.41
CYP2C19 P33261 1/20 0.41
KMT2A Q03164 1/20 0.41
NPC1 O15118 5/20 0.41
RAB9A P51151 4/20 0.41
KDM4E B2RXH2 2/20 0.41
MAPT P10636 2/20 0.41
SMN1; SMN2 Q16637 2/20 0.41
TP53 P04637 2/20 0.41
ALPG P10696 1/20 0.41
TSHR P16473 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1127927 0.94 ALDH1A1 (0.49) LTA4HHPGDLMNAL3MBTL1ALDH1A1
SCHEMBL1792992 0.92 ALDH1A1 (0.48) LTA4HHPGDLMNAL3MBTL1ALDH1A1
SCHEMBL29636376 0.89 ALDH1A1 (0.45) LTA4HHPGDLMNAL3MBTL1ALDH1A1
SCHEMBL29694221 0.89 ALDH1A1 (0.45) LTA4HHPGDLMNAL3MBTL1ALDH1A1
SCHEMBL8429008 0.89 LTA4H (0.57) LTA4HHPGDLMNAL3MBTL1CES2
SCHEMBL1789029 0.88 PTGIR (0.47) HPGDLMNAL3MBTL1CES2CES1
SCHEMBL31213298 0.85 VNN1 (0.46) LMNAMAPTTP53
SCHEMBL8386520 0.85 HPGD (0.44) HPGDLMNAL3MBTL1ALDH1A1SMN1; SMN2
SCHEMBL1791559 0.85 VNN1 (0.46) LMNAMAPTTP53
SCHEMBL1127750 0.84 MEN1 (0.40) HPGDLMNAL3MBTL1ALDH1A1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8617795-B2 Photosensitive resin composition and pattern forming method using the same TOKYO OHKA KOGYO CO., LTD. (JP) 2013-12-31 US disclosed
EP-2512779-A1 SUBSTRATE-BASED ADDITIVE FABRICATION PROCESS DSM IP Assets B.V. (NL) 2012-10-24 EP disclosed
WO-2011084578-A1 SUBSTRATE-BASED ADDITIVE FABRICATION PROCESS DSM IP ASSETS, B.V. (NL) 2011-07-14 WO disclosed
US-20110123928-A1 Photosensitive Resin Composition and Pattern Forming Method Using the Same TOKYO OHKA KOGYO CO., LTD. (JP) 2011-05-26 US disclosed