SCHEMBL1789302

SCHEMBL1789302

CC(O)Oc1ccc(C(=O)c2ccc(Sc3ccc([S+](c4ccc(OC(C)O)cc4)c4ccc(OC(C)O)cc4)cc3)cc2)cc1

nearest known ligand 0.42

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
HPGD P15428 4/20 0.42
LMNA P02545 4/20 0.42
L3MBTL1 Q9Y468 1/20 0.42
ELANE P08246 5/20 0.41
PARP10 Q53GL7 1/20 0.41
KMT2A Q03164 2/20 0.38
ALDH1A1 P00352 1/20 0.38
SMN1; SMN2 Q16637 3/20 0.37
SRD5A2 P31213 1/20 0.36
NPSR1 Q6W5P4 2/20 0.36
GAA P10253 1/20 0.36
PTGIR P43119 1/20 0.35
MEN1 O00255 1/20 0.34
MAPT P10636 1/20 0.34
MAPK1 P28482 1/20 0.34
RAB9A P51151 1/20 0.34
RXFP1 Q9HBX9 1/20 0.34
THRB P10828 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1792904 0.95 HPGD (0.44) HPGDLMNAL3MBTL1ELANEPARP10
SCHEMBL1788546 0.95 ELANE (0.47) HPGDLMNAL3MBTL1ELANEKMT2A
SCHEMBL1789123 0.94 KMT2A (0.40) HPGDLMNAL3MBTL1ELANEPARP10
SCHEMBL1791275 0.83 ELANE (0.46) HPGDLMNAL3MBTL1ELANEALDH1A1
SCHEMBL10591230 0.81 ELANE (0.57) HPGDLMNAELANEPARP10KMT2A
SCHEMBL890769 0.79 LMNA (0.42) HPGDLMNAL3MBTL1PARP10KMT2A
SCHEMBL13401274 0.77 CES2 (0.53) HPGDLMNAL3MBTL1ELANEKMT2A
SCHEMBL1792638 0.76 ALDH1A1 (0.47) HPGDLMNAL3MBTL1ELANEKMT2A
SCHEMBL1789029 0.76 PTGIR (0.47) HPGDLMNAL3MBTL1KMT2AALDH1A1
SCHEMBL13134777 0.76 ALDH1A1 (0.51) HPGDLMNAL3MBTL1ELANEKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8617795-B2 Photosensitive resin composition and pattern forming method using the same TOKYO OHKA KOGYO CO., LTD. (JP) 2013-12-31 US disclosed
EP-2512779-A1 SUBSTRATE-BASED ADDITIVE FABRICATION PROCESS DSM IP Assets B.V. (NL) 2012-10-24 EP disclosed
WO-2011084578-A1 SUBSTRATE-BASED ADDITIVE FABRICATION PROCESS DSM IP ASSETS, B.V. (NL) 2011-07-14 WO disclosed
US-20110123928-A1 Photosensitive Resin Composition and Pattern Forming Method Using the Same TOKYO OHKA KOGYO CO., LTD. (JP) 2011-05-26 US disclosed