SCHEMBL18222986

SCHEMBL18222986

O=C(CCCCC(=O)NN=C1CCCCC1)NN=C1CCCCC1

nearest known ligand 0.61

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 8/20 0.61
ALDH1A1 P00352 6/20 0.61
RXFP1 Q9HBX9 1/20 0.59
KMT2A Q03164 4/20 0.54
MEN1 O00255 2/20 0.54
SMN1; SMN2 Q16637 1/20 0.54
RECQL P46063 1/20 0.53
HTT P42858 1/20 0.50
LMNA P02545 1/20 0.50
GAA P10253 1/20 0.50
MAPT P10636 1/20 0.49
POLB P06746 1/20 0.49
RAB9A P51151 2/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18222976 0.98 KDM4E (0.59) KDM4EALDH1A1RXFP1KMT2AMEN1
SCHEMBL18222989 0.98 KDM4E (0.59) KDM4EALDH1A1RXFP1KMT2AMEN1
SCHEMBL28656502 0.96 ALDH1A1 (0.56) KDM4EALDH1A1RXFP1KMT2AMEN1
SCHEMBL1278773 0.89 ALDH1A1 (0.50) KDM4EALDH1A1RXFP1KMT2AMEN1
SCHEMBL11458438 0.80 RXFP1 (0.55) KDM4EALDH1A1RXFP1KMT2AMEN1
SCHEMBL80049 0.76 KDM4E (0.71) KDM4EALDH1A1RXFP1KMT2AMEN1
SCHEMBL7351663 0.74 KDM4E (0.53) KDM4EALDH1A1RXFP1KMT2AMEN1
SCHEMBL9356896 0.72 KDM4E (0.52) KDM4EALDH1A1RXFP1KMT2AMEN1
SCHEMBL23016872 0.72 LMNA (0.51) KDM4EALDH1A1SMN1; SMN2LMNAGAA
SCHEMBL7354510 0.72 KDM4E (0.50) KDM4EALDH1A1RXFP1KMT2ARECQL

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3330317-B1 POLYACETAL RESIN COMPOSITION AND POLYACETAL RESIN MOLDED ARTICLE MITSUBISHI ENG PLASTICS CORP (JP) 2021-10-06 EP disclosed
EP-3330317-A1 POLYACETAL RESIN COMPOSITION AND POLYACETAL RESIN MOLDED ARTICLE Mitsubishi Engineering-Plastics Corporation (JP) 2018-06-06 EP disclosed
EP-3101067-B1 POLYACETAL RESIN COMPOSITION, AND RESIN MOLDED ARTICLE MITSUBISHI ENG PLASTICS CORP (JP) 2018-05-16 EP disclosed
US-9850367-B2 Polyacetal resin composition and resin molded article MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2017-12-26 US disclosed
EP-3101067-A1 POLYACETAL RESIN COMPOSITION, AND RESIN MOLDED ARTICLE Mitsubishi Engineering-Plastics Corporation (JP) 2016-12-07 EP disclosed
US-20160333170-A1 POLYACETAL RESIN COMPOSITION AND RESIN MOLDED ARTICLE MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2016-11-17 US disclosed