SCHEMBL1836418

SCHEMBL1836418

CN1CCN(Cc2ccccc2)C1

nearest known ligand 0.78

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
MC4R P32245 1/20 0.78
SIGMAR1 Q99720 6/20 0.65
LMNA P02545 2/20 0.58
POLB P06746 1/20 0.58
NPC1 O15118 1/20 0.57
TP53 P04637 1/20 0.57
RAB9A P51151 1/20 0.57
CHKA P35790 1/20 0.56
DRD4 P21917 1/20 0.53
CCR3 P51677 1/20 0.53
ACHE P22303 1/20 0.52
HRH4 Q9H3N8 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19562227 0.89 MC4R (0.61) MC4RSIGMAR1LMNAPOLBCHKA
SCHEMBL2316820 0.88 MC4R (1.00) MC4RSIGMAR1LMNAPOLBNPC1
SCHEMBL1044943 0.88 MC4R (1.00) MC4RSIGMAR1LMNAPOLBNPC1
SCHEMBL221139 0.88 MC4R (1.00) MC4RSIGMAR1LMNAPOLBNPC1
Ammonia Solution, Strong SCHEMBL4261945 0.86 MC4R (0.96) MC4RSIGMAR1LMNAPOLBNPC1
Hydrochloric Acid SCHEMBL28900426 0.86 MC4R (0.96) MC4RSIGMAR1LMNAPOLBNPC1
Hydrochloric Acid SCHEMBL11277255 0.86 MC4R (0.96) MC4RSIGMAR1LMNAPOLBNPC1
SCHEMBL301699 0.85 SIGMAR1 (0.81) MC4RSIGMAR1LMNAPOLBDRD4
Hydrochloric Acid SCHEMBL15162706 0.84 MC4R (0.92) MC4RSIGMAR1LMNAPOLBNPC1
Methylamine SCHEMBL27923497 0.84 MC4R (0.92) MC4RSIGMAR1LMNAPOLBNPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 86 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118726960-B Colloid palladium activator and preparation method thereof and electroless copper plating process 惠州市荣安达化工有限公司 2025-03-21 CN claimed
CN-118600404-B Horizontal electroless copper plating solution and preparation method thereof 惠州市荣安达化工有限公司 2024-12-20 CN claimed
CN-118726960-A Colloid palladium activator and preparation method thereof and electroless copper plating process 惠州市荣安达化工有限公司 2024-10-01 CN claimed
CN-118600404-A Horizontal electroless copper plating solution and preparation method thereof 惠州市荣安达化工有限公司 2024-09-06 CN claimed
CN-115418632-B High-speed high-ductility chemical copper suitable for horizontal line equipment and preparation method thereof 深圳市富利特科技有限公司 2023-11-17 CN claimed
CN-115160383-A Method for oxidative degradation of lignin 大连工业大学 2022-10-11 CN claimed
US-7460357-B2 Electrolyte for electrolytic capacitor and electrolytic capacitor using the same MITSUBISHI CHEMICAL CORPORATION (JP) 2008-12-02 US claimed
US-7072173-B2 Electrolyte for electrolytic capacitor and electrolytic capacitor using the same MITSUBISHI CHEMICAL CORPORATION (JP) 2006-07-04 US claimed
US-20060092597-A1 Electrolyte for electrolytic capacitor and electrolytic capacitor using the same MITSUBISHI CHEMICAL CORPORATION (JP) 2006-05-04 US claimed
US-20040095708-A1 Electrolyte for electolytic capacitor and electrolytic capacitor using the same MITSUBISHI CHEMICAL CORPORATION (JP) 2004-05-20 US claimed
EP-1394824-A1 ELECTROLYTIC SOLUTION FOR ELECTROLYTIC CAPACITOR AND ELECTROLYTIC CAPACITOR USING IT Mitsubishi Chemical Corporation (JP) 2004-03-03 EP claimed
US-12291506-B2 Method for producing amidate compound, and amidate compound KOEI CHEMICAL COMPANY, LIMITED (JP) 2025-05-06 US disclosed
CN-118726960-B Colloid palladium activator and preparation method thereof and electroless copper plating process 惠州市荣安达化工有限公司 2025-03-21 CN disclosed
CN-118600404-B Horizontal electroless copper plating solution and preparation method thereof 惠州市荣安达化工有限公司 2024-12-20 CN disclosed
CN-118600404-B Horizontal electroless copper plating solution and preparation method thereof 惠州市荣安达化工有限公司 2024-12-20 CN disclosed
US-20060092597-A1 Electrolyte for electrolytic capacitor and electrolytic capacitor using the same MITSUBISHI CHEMICAL CORPORATION (JP) 2006-05-04 US disclosed
US-20060007629-A1 Electrolyte for electrolytic capacitor, electrolytic capacitor and process for producing tetrafluoroaluminate salt of organic onium MITSUBISHI CHEMICAL CORPORATION (JP) 2006-01-12 US disclosed
EP-1564768-A1 ELECTROLYTE FOR ELECTROLYTIC CAPACITOR, ELECTROLYTIC CAPACITOR AND PROCESS FOR PRODUCING TETRAFLUOROALUMINATE SALT OF ORGANIC ONIUM Mitsubishi Chemical Corporation (JP) 2005-08-17 EP disclosed
US-20040095708-A1 Electrolyte for electolytic capacitor and electrolytic capacitor using the same MITSUBISHI CHEMICAL CORPORATION (JP) 2004-05-20 US disclosed
EP-1394824-A1 ELECTROLYTIC SOLUTION FOR ELECTROLYTIC CAPACITOR AND ELECTROLYTIC CAPACITOR USING IT Mitsubishi Chemical Corporation (JP) 2004-03-03 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12291506-B2 Method for producing amidate compound, and amidate compound NAAA, NIT2, PAM MC4R 498/4885SIGMAR1 2319/4885LMNA 3604/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.