SCHEMBL18648020

SCHEMBL18648020

Cc1ccc(S(=O)(=O)O/N=C(/c2ccccc2)c2nc3ccccc3s2)cc1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ KDM4E B2RXH2 3/20 0.45
▸ TDP1 Q9NUW8 2/20 0.45
▸ GLO1 Q04760 1/20 0.44
▸ KMT2A Q03164 6/20 0.44
▸ MAPT P10636 5/20 0.44
▸ MEN1 O00255 5/20 0.44
▸ RAB9A P51151 5/20 0.44
▸ CYP3A4 P08684 2/20 0.44
▸ CYP2C9 P11712 2/20 0.44
▸ NPC1 O15118 2/20 0.44
▸ CYP1A2 P05177 1/20 0.44
▸ CYP2C19 P33261 1/20 0.44
▸ KCNH2 Q12809 1/20 0.44
▸ L3MBTL1 Q9Y468 1/20 0.44
▸ GAA P10253 2/20 0.43
▸ ALDH1A1 P00352 4/20 0.43
▸ SMN1; SMN2 Q16637 3/20 0.43
▸ HTT P42858 3/20 0.41
▸ TSHR P16473 2/20 0.41
▸ TP53 P04637 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6127764 1.00 KDM4E (0.45) KDM4ETDP1GLO1KMT2AMAPT
SCHEMBL6124089 0.95 GLO1 (0.44) KDM4ETDP1GLO1KMT2AMAPT
SCHEMBL16381787 0.86 GLO1 (0.44) KDM4ETDP1GLO1KMT2AMAPT
SCHEMBL18648019 0.84 CNR1 (0.42) KDM4ETDP1GLO1KMT2AMAPT
SCHEMBL6127765 0.84 CNR1 (0.42) KDM4ETDP1GLO1KMT2AMAPT
SCHEMBL6124088 0.83 ALDH1A1 (0.49) GLO1KMT2AMAPTMEN1RAB9A
SCHEMBL17364364 0.83 ALDH1A1 (0.47) KDM4ETDP1GLO1KMT2AMAPT
SCHEMBL12629324 0.81 ALDH1A1 (0.47) KDM4ETDP1KMT2AMAPTMEN1
SCHEMBL19285999 0.81 SMN1; SMN2 (0.49) KDM4ETDP1GLO1KMT2AMAPT
SCHEMBL6127763 0.81 SMN1; SMN2 (0.49) KDM4ETDP1GLO1KMT2AMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230213858-A1 MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2023-07-06 — — US disclosed
US-9929376-B2 Laminate, kit for manufacturing organic semiconductor, and resist composition for manufacturing organic semiconductor FUJIFILM CORPORATION (JP) 2018-03-27 — — US disclosed
US-9601706-B2 Resin composition for forming protective film, protective film, pattern forming method, method for manufacturing electronic device, and electronic device FUJIFILM CORPORATION (JP) 2017-03-21 — — US disclosed
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