SCHEMBL6127763

SCHEMBL6127763

Cc1ccc(S(=O)(=O)O/N=C(\C#N)c2nc3ccccc3s2)cc1

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ SMN1; SMN2 Q16637 4/20 0.49
▸ MEN1 O00255 9/20 0.47
▸ KMT2A Q03164 9/20 0.47
▸ MAPT P10636 8/20 0.47
▸ TSHR P16473 5/20 0.47
▸ HTT P42858 4/20 0.47
▸ TP53 P04637 3/20 0.47
▸ KDM4E B2RXH2 2/20 0.47
▸ HSD17B10 Q99714 2/20 0.47
▸ THRB P10828 1/20 0.47
▸ RECQL P46063 1/20 0.47
▸ TDP1 Q9NUW8 2/20 0.44
▸ RAB9A P51151 4/20 0.43
▸ NPC1 O15118 3/20 0.43
▸ CYP3A4 P08684 2/20 0.43
▸ CYP2C9 P11712 2/20 0.43
▸ CYP1A2 P05177 1/20 0.43
▸ CYP2C19 P33261 1/20 0.43
▸ KCNH2 Q12809 1/20 0.43
▸ L3MBTL1 Q9Y468 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19285999 1.00 SMN1; SMN2 (0.49) SMN1; SMN2MEN1KMT2AMAPTTSHR
SCHEMBL6124076 0.85 RECQL (0.55) SMN1; SMN2MEN1KMT2AMAPTTSHR
SCHEMBL17364364 0.82 ALDH1A1 (0.47) SMN1; SMN2MEN1KMT2AMAPTTSHR
SCHEMBL6127764 0.81 KDM4E (0.45) SMN1; SMN2MEN1KMT2AMAPTTSHR
SCHEMBL18648020 0.81 KDM4E (0.45) SMN1; SMN2MEN1KMT2AMAPTTSHR
SCHEMBL6124078 0.79 MAPT (0.38) SMN1; SMN2MEN1KMT2AMAPTTSHR
SCHEMBL6124089 0.79 GLO1 (0.44) SMN1; SMN2MEN1KMT2AMAPTTSHR
SCHEMBL16381778 0.78 MAPT (0.44) SMN1; SMN2MEN1KMT2AMAPTTSHR
SCHEMBL16381782 0.78 ALOX15 (0.46) SMN1; SMN2MEN1KMT2AMAPTTSHR
SCHEMBL16381787 0.78 GLO1 (0.44) SMN1; SMN2MEN1KMT2AMAPTTSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230213858-A1 MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2023-07-06 — — US disclosed
US-9929376-B2 Laminate, kit for manufacturing organic semiconductor, and resist composition for manufacturing organic semiconductor FUJIFILM CORPORATION (JP) 2018-03-27 — — US disclosed
US-9746771-B2 Laminate body FUJIFILM CORPORATION (JP) 2017-08-29 — — US disclosed
US-9601706-B2 Resin composition for forming protective film, protective film, pattern forming method, method for manufacturing electronic device, and electronic device FUJIFILM CORPORATION (JP) 2017-03-21 — — US disclosed
US-9601706-B2 Resin composition for forming protective film, protective film, pattern forming method, method for manufacturing electronic device, and electronic device FUJIFILM CORPORATION (JP) 2017-03-21 — — US disclosed
US-20160240816-A1 LAMINATE, KIT FOR MANUFACTURING ORGANIC SEMICONDUCTOR, AND RESIST COMPOSITION FOR MANUFACTURING ORGANIC SEMICONDUCTOR FUJIFILM CORPORATION (JP) 2016-08-18 — — US disclosed
US-20160170303-A1 LAMINATE BODY FUJIFILM CORPORATION (JP) 2016-06-16 — — US disclosed
US-20150221881-A1 RESIN COMPOSITION FOR FORMING PROTECTIVE FILM, PROTECTIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2015-08-06 — — US disclosed
US-20150221881-A1 RESIN COMPOSITION FOR FORMING PROTECTIVE FILM, PROTECTIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2015-08-06 — — US disclosed
US-8628907-B2 Positive photosensitive resin composition, method for forming cured film, cured film, organic el display device and liquid crystal display device FUJIFILM CORPORATION (JP) 2014-01-14 — — US disclosed
WO-2013141376-A1 PROTECTANT, METHOD FOR PRODUCING COMPOUND PROTECTED BY PROTECTANT, RESIN PROTECTED BY PROTECTANT, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING RESIN PROTECTED BY PROTECTANT, PATTERN-FORMING MATERIAL, PHOTOSENSITIVE FILM, CURED RELIEF PATTERN, METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 (JP) 2013-09-26 — — WO disclosed
WO-2013018524-A1 PHOTOSENSITIVE RESIN COMPOSITION, MATERIAL FOR FORMING RELIEF PATTERN, PHOTOSENSITIVE FILM, POLYIMIDE FILM, CURED RELIEF PATTERN AND METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 (JP) 2013-02-07 — — WO disclosed
US-20120107563-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN, MEMS STRUCTURE, METHOD FOR PRODUCING THE STRUCTURE, METHOD FOR DRY ETCHING, METHOD FOR WET ETCHING, MEMS SHUTTER DEVICE, AND IMAGE DISPLAY APPARATUS FUJIFILM CORPORATION (JP) 2012-05-03 — — US disclosed
US-20120045616-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING CURED FILM, CURED FILM, ORGANIC EL DISPLAY DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE FUJIFILM CORPORATION (JP) 2012-02-23 — — US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20120045616-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING CURED FILM, CURED FILM, ORGANIC EL DISPLAY DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE PELP1, EED, ARCN1 SMN1; SMN2 4316/4885MEN1 4568/4885KMT2A 915/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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