Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TXNRD1 | Q16881 | 3/20 | 0.34 |
| ▸ | SLC6A3 | Q01959 | 1/20 | 0.32 |
| ▸ | SMO | Q99835 | 2/20 | 0.31 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.31 |
| ▸ | DNMT1 | P26358 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27547767 | 0.85 | NPC1 (0.38) | SLC6A3SMOPTGS2 | |
| SCHEMBL18920871 | 0.85 | MAPT (0.38) | TXNRD1SLC6A3SMOPTGS2DNMT1 | |
| SCHEMBL13886823 | 0.85 | MAPT (0.38) | TXNRD1SLC6A3SMOPTGS2DNMT1 | |
| SCHEMBL18920870 | 0.85 | MAPT (0.38) | TXNRD1SLC6A3SMOPTGS2DNMT1 | |
| SCHEMBL29112208 | 0.77 | NPC1 (0.32) | — | |
| SCHEMBL25401542 | 0.76 | DNMT1 (0.39) | TXNRD1DNMT1 | |
| SCHEMBL13870141 | 0.75 | USP18 (0.37) | TXNRD1SLC6A3PTGS2DNMT1 | |
| SCHEMBL13886822 | 0.75 | CA1 (0.35) | TXNRD1SLC6A3PTGS2DNMT1 | |
| SCHEMBL28556832 | 0.75 | NPC1 (0.30) | SMO | |
| SCHEMBL13886821 | 0.74 | CA1 (0.34) | TXNRD1PTGS2DNMT1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111123649-B | Negative photoresist composition containing high heat resistance carboxyl phenolic resin | 苏州瑞红电子化学品有限公司 | 2024-01-30 | — | — | CN | disclosed |
| CN-116880126-A | Preparation and application of branched benzocyclobutenyl polysiloxane low dielectric loss photosensitive resin | 西南科技大学 | 2023-10-13 | — | — | CN | disclosed |
| CN-111123649-A | Negative photoresist composition containing high-heat-resistance carboxyl phenolic resin | 苏州瑞红电子化学品有限公司 | 2020-05-08 | — | — | CN | disclosed |