SCHEMBL1921836

SCHEMBL1921836

Cc1ccc(C)c(Oc2c(C)ccc(C)c2C)c1C

nearest known ligand 0.40

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
HSP90AA1 P07900 2/20 0.40
TDP2 O95551 1/20 0.40
NSD2 O96028 1/20 0.40
PAX8 Q06710 1/20 0.40
CYP1A2 P05177 2/20 0.35
TSHR P16473 2/20 0.35
CYP2A6 P11509 1/20 0.35
SCN5A Q14524 1/20 0.32
POLB P06746 1/20 0.32
TRPA1 O75762 1/20 0.32
ATM Q13315 1/20 0.32
SMN1; SMN2 Q16637 2/20 0.31
ALDH1A1 P00352 1/20 0.31
HTT P42858 1/20 0.31
PTPN1 P18031 1/20 0.31
NPC1 O15118 1/20 0.30
RAB9A P51151 1/20 0.30
ACHE P22303 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9488716 0.89 HSP90AA1 (0.43) HSP90AA1TDP2NSD2PAX8CYP1A2
SCHEMBL9488797 0.89 TDP2 (0.34) HSP90AA1TDP2NSD2PAX8CYP1A2
SCHEMBL9486844 0.80 LTA4H (0.48) CYP1A2TSHRCYP2A6POLBSMN1; SMN2
SCHEMBL30968870 0.79 ALDH1A1 (0.39) HSP90AA1TDP2NSD2PAX8CYP1A2
SCHEMBL146614 0.79 ALDH1A1 (0.39) HSP90AA1TDP2NSD2PAX8CYP1A2
SCHEMBL9487054 0.78 KEAP1 (0.46) CYP1A2POLBTRPA1ATMALDH1A1
SCHEMBL9487963 0.78 ALDH1A1 (0.47) HSP90AA1TDP2NSD2PAX8TSHR
SCHEMBL9487832 0.78 TSHR (0.50) CYP1A2TSHRCYP2A6SMN1; SMN2ALDH1A1
SCHEMBL8377251 0.77 ESR2 (0.52) SMN1; SMN2
SCHEMBL921892 0.77 TDP2 (0.30) HSP90AA1TDP2NSD2PAX8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0276327-B1 RESIN COMPOSITION AND PROCESS FOR ITS PREPARATION TORAY INDUSTRIES, INC. (JP) 1993-04-07 EP claimed
EP-0296408-B1 LOW DENSITY EXTRUDED FOAM HAVING HIGH COMPRESSIVE STRENGTH GENERAL ELECTRIC COMPANY (US) 1991-06-26 EP claimed
US-5006610-A Improved mechanical properties and solvent resistance TORAY INDUSTRIES, INC. (JP) 1991-04-09 US claimed
EP-0276327-A1 RESIN COMPOSITION AND PROCESS FOR ITS PREPARATION TORAY INDUSTRIES, INC. (JP) 1988-08-03 EP claimed
US-9617407-B2 Highly insulating film TEIJIN LIMITED (JP) 2017-04-11 US disclosed
CN-106459442-A Release film 帝人株式会社 2017-02-22 CN disclosed
EP-2712883-B1 HIGH-INSULATING FILM TEIJIN LTD (JP) 2016-02-24 EP disclosed
US-20140050913-A1 HIGHLY INSULATING FILM TEIJIN LIMITED (JP) 2014-02-20 US disclosed
EP-2055731-B1 Method of preparing a poly(arylene ether) and a poly(arylene ether) prepared thereby SABIC INNOVATIVE PLASTICS IP (NL) 2011-06-01 EP disclosed
EP-0276327-B1 RESIN COMPOSITION AND PROCESS FOR ITS PREPARATION TORAY INDUSTRIES, INC. (JP) 1993-04-07 EP disclosed
US-5017650-A Molding materials TORAY INDUSTRIES, INC. (JP) 1991-05-21 US disclosed
US-5006610-A Improved mechanical properties and solvent resistance TORAY INDUSTRIES, INC. (JP) 1991-04-09 US disclosed
EP-0276327-A1 RESIN COMPOSITION AND PROCESS FOR ITS PREPARATION TORAY INDUSTRIES, INC. (JP) 1988-08-03 EP disclosed
US-4011200-A NOVEL POLYPHENYLENE ETHER AND PROCESS FOR PREPARING THE SAME MITSUBISHI GAS CHEMICAL CO., LTD. (JA) 1977-03-08 US disclosed