SCHEMBL19258321

SCHEMBL19258321

COC(COC(C)=O)CN(C)C

nearest known ligand 0.41

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.41
ALDH1A1 P00352 2/20 0.34
LMNA P02545 1/20 0.34
HSD17B10 Q99714 1/20 0.34
PRKCA P17252 1/20 0.31
ENPP2 Q13822 8/20 0.31
LPAR6 P43657 3/20 0.30
LPAR1 Q92633 3/20 0.30
LPAR4 Q99677 3/20 0.30
LPAR5 Q9H1C0 3/20 0.30
LPAR2 Q9HBW0 3/20 0.30
LPAR3 Q9UBY5 3/20 0.30
AR P10275 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13393923 0.84 TDP1 (0.46) TDP1ALDH1A1LMNAHSD17B10PRKCA
SCHEMBL25628009 0.83 TDP1 (0.45) TDP1ALDH1A1LMNAHSD17B10PRKCA
SCHEMBL13393925 0.81 ALDH1A1 (0.41) TDP1ALDH1A1LMNAHSD17B10PRKCA
SCHEMBL7705538 0.77 TDP1 (0.41) TDP1ALDH1A1LMNAHSD17B10PRKCA
SCHEMBL10338761 0.77 PRKCA (0.43) TDP1ALDH1A1LMNAHSD17B10PRKCA
SCHEMBL139623 0.77 ALDH1A1 (0.44) TDP1ALDH1A1LMNAHSD17B10PRKCA
SCHEMBL144017 0.73 TDP1 (0.42) TDP1ALDH1A1LMNAHSD17B10PRKCA
SCHEMBL27380230 0.73 LMNA (0.43) TDP1ALDH1A1LMNAHSD17B10PRKCA
SCHEMBL12083595 0.73 PIK3CD (0.34)
SCHEMBL12212556 0.73 PIK3CD (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2960245-B1 EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD FOR MANUFACTURING SAME, COMPOSITION AND CURED PRODUCT INCLUDING SAME, AND USE THEREOF KOREA INST IND TECH (KR) 2019-07-31 EP disclosed
US-9732182-B2 Epoxy compound having alkoxysilyl group, method of preparing the same, composition and cured product comprising the same, and use thereof KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY (KR) 2017-08-15 US disclosed