SCHEMBL19295738

SCHEMBL19295738

C=CC(=O)OCCCCOc1ccc(C(=O)Oc2ccc(OC(=O)c3ccc(COc4ccccc4B(O)O)cc3)c(C)c2C)cc1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ LIPE Q05469 2/20 0.42
▸ THRB P10828 1/20 0.41
▸ RAB9A P51151 4/20 0.39
▸ L3MBTL1 Q9Y468 3/20 0.39
▸ MAPT P10636 3/20 0.39
▸ LMNA P02545 1/20 0.39
▸ TDP1 Q9NUW8 2/20 0.37
▸ KMT2A Q03164 2/20 0.37
▸ MEN1 O00255 1/20 0.37
▸ POLB P06746 1/20 0.37
▸ PKM P14618 1/20 0.37
▸ BLM P54132 1/20 0.37
▸ RXRA P19793 2/20 0.36
▸ RXRB P28702 1/20 0.36
▸ RXRG P48443 1/20 0.36
▸ NPC1 O15118 3/20 0.36
▸ KDM4E B2RXH2 2/20 0.36
▸ ALDH1A1 P00352 2/20 0.36
▸ ENPP2 Q13822 1/20 0.35
▸ HTT P42858 2/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22361791 0.92 LIPE (0.36) LIPETHRBRAB9AL3MBTL1MAPT
SCHEMBL29419498 0.88 THRB (0.49) THRBRAB9AL3MBTL1MAPTLMNA
SCHEMBL22555934 0.88 THRB (0.49) THRBRAB9AL3MBTL1MAPTLMNA
SCHEMBL17833478 0.88 THRB (0.38) THRBRAB9AMAPTKMT2AMEN1
SCHEMBL16945726 0.88 THRB (0.38) THRBRAB9AMAPTKMT2AMEN1
SCHEMBL19295727 0.86 NPC1 (0.38) THRBRAB9AMAPTLMNAKMT2A
SCHEMBL19295714 0.86 NPC1 (0.38) THRBRAB9AMAPTLMNAKMT2A
SCHEMBL19295712 0.85 ENPP2 (0.40) THRBRAB9AL3MBTL1MAPTLMNA
SCHEMBL7268202 0.84 HTT (0.47) THRBL3MBTL1MAPTLMNATDP1
SCHEMBL15523698 0.84 HTT (0.47) THRBL3MBTL1MAPTLMNATDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10774212-B2 Thermally conductive material, resin composition, and device FUJIFILM CORPORATION (JP) 2020-09-15 — — US disclosed
US-10294372-B2 Surface-modified inorganic substance, method for manufacturing surface-modified inorganic substance, method for modifying surface of inorganic substance with organic substance, heat dissipation material, thermally conductive material, and lubricant FUJIFILM CORPORATION (JP) 2019-05-21 — — US disclosed
US-20170247546-A1 SURFACE-MODIFIED INORGANIC SUBSTANCE, METHOD FOR MANUFACTURING SURFACE-MODIFIED INORGANIC SUBSTANCE, METHOD FOR MODIFYING SURFACE OF INORGANIC SUBSTANCE WITH ORGANIC SUBSTANCE, HEAT DISSIPATION MATERIAL, THERMALLY CONDUCTIVE MATERIAL, AND LUBRICANT FUJIFILM CORPORATION (JP) 2017-08-31 — — US disclosed
US-20170247546-A1 SURFACE-MODIFIED INORGANIC SUBSTANCE, METHOD FOR MANUFACTURING SURFACE-MODIFIED INORGANIC SUBSTANCE, METHOD FOR MODIFYING SURFACE OF INORGANIC SUBSTANCE WITH ORGANIC SUBSTANCE, HEAT DISSIPATION MATERIAL, THERMALLY CONDUCTIVE MATERIAL, AND LUBRICANT FUJIFILM CORPORATION (JP) 2017-08-31 — — US disclosed
Send feedback