SCHEMBL19295712

SCHEMBL19295712

C=CC(=O)OCCCCOc1ccc(C(=O)Oc2ccc(OC(=O)c3ccc(COc4cccc(B(O)O)c4)cc3)c(C)c2C)cc1

nearest known ligand 0.40

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
▸ ENPP2 Q13822 1/20 0.40
▸ L3MBTL1 Q9Y468 3/20 0.39
▸ TDP1 Q9NUW8 2/20 0.39
▸ THRB P10828 1/20 0.39
▸ MAPT P10636 3/20 0.36
▸ MAOB P27338 1/20 0.36
▸ SMPD1 P17405 1/20 0.36
▸ RAB9A P51151 3/20 0.35
▸ NPC1 O15118 2/20 0.35
▸ LMNA P02545 1/20 0.35
▸ NR1H4 Q96RI1 1/20 0.35
▸ TLR4 O00206 1/20 0.34
▸ TLR2 O60603 1/20 0.34
▸ NR4A1 P22736 1/20 0.34
▸ NR4A2 P43354 1/20 0.34
▸ NR4A3 Q92570 1/20 0.34
▸ KDM4E B2RXH2 1/20 0.34
▸ ALDH1A1 P00352 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22361792 0.92 ENPP2 (0.35) ENPP2L3MBTL1TDP1THRBMAPT
SCHEMBL17833478 0.91 THRB (0.38) THRBMAPTMAOBRAB9ANPC1
SCHEMBL16945726 0.91 THRB (0.38) THRBMAPTMAOBRAB9ANPC1
SCHEMBL19295727 0.89 NPC1 (0.38) THRBMAPTMAOBRAB9ANPC1
SCHEMBL19295714 0.89 NPC1 (0.38) THRBMAPTMAOBRAB9ANPC1
SCHEMBL19295720 0.85 THRB (0.41) L3MBTL1TDP1THRBMAPTNPC1
SCHEMBL14826285 0.85 THRB (0.43) L3MBTL1TDP1THRBMAPTNPC1
SCHEMBL17929711 0.85 THRB (0.48) L3MBTL1TDP1THRBMAPTRAB9A
SCHEMBL19295738 0.85 LIPE (0.42) ENPP2L3MBTL1TDP1THRBMAPT
SCHEMBL23045949 0.84 MAPT (0.35) ENPP2L3MBTL1THRBMAPTMAOB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10774212-B2 Thermally conductive material, resin composition, and device FUJIFILM CORPORATION (JP) 2020-09-15 — — US disclosed
US-10294372-B2 Surface-modified inorganic substance, method for manufacturing surface-modified inorganic substance, method for modifying surface of inorganic substance with organic substance, heat dissipation material, thermally conductive material, and lubricant FUJIFILM CORPORATION (JP) 2019-05-21 — — US disclosed
US-20170247546-A1 SURFACE-MODIFIED INORGANIC SUBSTANCE, METHOD FOR MANUFACTURING SURFACE-MODIFIED INORGANIC SUBSTANCE, METHOD FOR MODIFYING SURFACE OF INORGANIC SUBSTANCE WITH ORGANIC SUBSTANCE, HEAT DISSIPATION MATERIAL, THERMALLY CONDUCTIVE MATERIAL, AND LUBRICANT FUJIFILM CORPORATION (JP) 2017-08-31 — — US disclosed
US-20170247546-A1 SURFACE-MODIFIED INORGANIC SUBSTANCE, METHOD FOR MANUFACTURING SURFACE-MODIFIED INORGANIC SUBSTANCE, METHOD FOR MODIFYING SURFACE OF INORGANIC SUBSTANCE WITH ORGANIC SUBSTANCE, HEAT DISSIPATION MATERIAL, THERMALLY CONDUCTIVE MATERIAL, AND LUBRICANT FUJIFILM CORPORATION (JP) 2017-08-31 — — US disclosed
Send feedback