SCHEMBL836696

SCHEMBL836696

Cc1cc(C(C)(C)c2cc(C)c(O)c(CO)c2)cc(CO)c1O

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SHBG P04278 1/20 0.57
KLF10 Q13118 1/20 0.55
ALOX15 P16050 3/20 0.50
HTT P42858 2/20 0.50
MAPK1 P28482 1/20 0.50
ALOX12 P18054 2/20 0.43
ALDH1A1 P00352 2/20 0.43
HPGD P15428 2/20 0.43
HSD17B10 Q99714 2/20 0.43
CYP3A4 P08684 1/20 0.43
TSHR P16473 1/20 0.43
CASP1 P29466 1/20 0.43
RECQL P46063 1/20 0.43
HIF1A Q16665 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
ESR1 P03372 2/20 0.42
ESR2 Q92731 1/20 0.42
CYP2C19 P33261 3/20 0.41
CYP1A2 P05177 2/20 0.41
CYP2C9 P11712 2/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL209020 0.94 KLF10 (0.59) SHBGKLF10ALOX15HTTMAPK1
SCHEMBL14159080 0.93 SHBG (0.50) SHBGKLF10ALOX15HTTMAPK1
SCHEMBL8352666 0.89 KLF10 (0.50) SHBGKLF10ALOX15HTTMAPK1
SCHEMBL26134510 0.89 ALOX15 (0.61) SHBGKLF10ALOX15HTTMAPK1
SCHEMBL224429 0.89 ALOX15 (0.61) SHBGKLF10ALOX15HTTMAPK1
SCHEMBL25446800 0.88 KLF10 (0.53) SHBGKLF10ALOX15HTTMAPK1
SCHEMBL249904 0.88 KLF10 (0.53) SHBGKLF10ALOX15HTTMAPK1
SCHEMBL31530701 0.88 SHBG (0.57) SHBGKLF10ALOX15HTTMAPK1
SCHEMBL11040770 0.88 SHBG (0.57) SHBGKLF10ALOX15HTTMAPK1
SCHEMBL14028985 0.87 ALOX15 (0.59) SHBGKLF10ALOX15HTTMAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025095045-A1 TRANSPARENT RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT 太陽ホールディングス株式会社 2025-05-08 WO disclosed
WO-2025095046-A1 RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND LIGHT EMITTING ELEMENT MOUNTED SUBSTRATE 太陽ホールディングス株式会社 2025-05-08 WO disclosed
WO-2025047700-A1 COMPOSITION FOR FORMING WAVELENGTH CONVERSION FILM AND USE THEREOF 日産化学株式会社 2025-03-06 WO disclosed
WO-2025047702-A1 COMPOSITION FOR PATTERNING AND USE OF SAME 日産化学株式会社 2025-03-06 WO disclosed
US-11767452-B2 Curable composition, especially as crystallizing rubber to substrate bonding primer HENKEL AG & CO. KGAA (DE) 2023-09-26 US disclosed
EP-3369770-B1 CURABLE COMPOSITION, ESPECIALLY AS CRYSTALLIZING RUBBER TO SUBSTRATE BONDING PRIMER HENKEL AG & CO KGAA (DE) 2021-12-22 EP disclosed
US-11194252-B2 Cured film-forming composition NISSAN CHEMICAL CORPORATION (JP) 2021-12-07 US disclosed
US-10669376-B2 Cured film-forming composition NISSAN CHEMICAL CORPORATION (JP) 2020-06-02 US disclosed
CN-110431177-A Curable composition, in particular as primer for the adhesion of crystalline rubbers to substrates HENKEL AG & CO KGAA 2019-11-08 CN disclosed
US-20190085130-A1 CURED FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2019-03-21 US disclosed
EP-1542273-A1 Circuit-connecting material and circuit terminal connected structure and connecting method Hitachi Chemical Co., Ltd. (JP) 2005-06-15 EP disclosed
US-20040222408-A1 SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE HITACHI CHEMICAL COMPANY, LTD. (JP) 2004-11-11 US disclosed
US-6777464-B1 ELECTRONIC CIRCUIT-CONNECTING MATERIAL HAVING A SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE HITACHI CHEMICAL COMPANY, LTD. (JP) 2004-08-17 US disclosed
EP-0997777-B1 Photosensitive polymer composition, method for forming relief patterns, and electronic parts HITACHI CHEM DUPONT MICROSYS (JP) 2003-06-04 EP disclosed
US-6514658-B2 Polyimide or precursor thereof soluble in alkaline solution, a photosensitive acid generator, and a compound having a phenolic hydroxyl group; positive-type, heat resistance HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2003-02-04 US disclosed
US-6329110-B1 POSITIVES, POLYIMIDE SOLUBLE IN AN AQUEOUS ALKALINE SOLUTION; QUINONEDIAZIDE CAPABLE OF GENERATING AN ACID WHEN EXPOSED TO LIGHT; COMPOUND HAVING A PHENOLIC HYDROXYL GROUP; HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) 2001-12-11 US disclosed
US-20010031419-A1 Photosensitive polymer composition, method for forming relief patterns, and electronic parts NUNOMURA MASATAKA (JP) 2001-10-18 US disclosed
US-6235842-B1 USEFUL AS ADHESIVES, FILM MATERIALS, AND MOLDING MATERIALS FOR ENCAPSULATING ELECTRONIC COMPONENTS. HITACHI CHEMICAL COMPANY, LTD. (JP) 2001-05-22 US disclosed
EP-0997777-A1 Photosensitive polymer composition, method for forming relief patterns, and electronic parts Hitachi Chemical DuPont MicroSystems Ltd. (JP) 2000-05-03 EP disclosed
EP-0979854-A1 CIRCUIT CONNECTING MATERIAL, AND STRUCTURE AND METHOD OF CONNECTING CIRCUIT TERMINAL HITACHI CHEMICAL COMPANY, LTD. (JP) 2000-02-16 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-10669376-B2 Cured film-forming composition AFF1, KDM1A, KDM7A SHBG 3868/4885KLF10 316/4885ALOX15 709/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.