SCHEMBL195164

SCHEMBL195164

CCCOC(=O)C(C)OC

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HCAR2 Q8TDS4 1/20 0.39
ALDH1A1 P00352 4/20 0.38
LMNA P02545 1/20 0.36
ESR1 P03372 1/20 0.35
CHRM1 P11229 1/20 0.35
TSHR P16473 1/20 0.35
SLC6A2 P23975 1/20 0.35
KDR P35968 1/20 0.35
TDP1 Q9NUW8 1/20 0.35
HSD17B10 Q99714 1/20 0.34
CA1 P00915 1/20 0.33
CA2 P00918 1/20 0.33
MAPK1 P28482 1/20 0.33
KDM4E B2RXH2 2/20 0.33
POLB P06746 1/20 0.33
ATM Q13315 1/20 0.32
HPGD P15428 1/20 0.32
HDAC3 O15379 1/20 0.32
HDAC4 P56524 1/20 0.32
HDAC1 Q13547 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL446183 0.86 ALDH1A1 (0.52) HCAR2ALDH1A1LMNAESR1TSHR
SCHEMBL31210051 0.85 CA1 (0.33) HCAR2ALDH1A1TSHRHSD17B10CA1
SCHEMBL6938703 0.83 NAAA (0.53) HCAR2ALDH1A1LMNATSHRNAAA
SCHEMBL18357107 0.81 TSHR (0.41) ALDH1A1TSHRCA1CA2
SCHEMBL6934591 0.81 TSHR (0.41) ALDH1A1TSHRCA1CA2
SCHEMBL3027521 0.81 HCAR2 (0.39) HCAR2ALDH1A1LMNAESR1CHRM1
SCHEMBL15788324 0.80 ALDH1A1 (0.34) ALDH1A1LMNATSHRTDP1HSD17B10
SCHEMBL9936438 0.80 ALDH1A1 (0.54) ALDH1A1LMNATSHRTDP1HSD17B10
SCHEMBL8223259 0.80
SCHEMBL195331 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2270 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10705424-B2 Negative-working photoresist compositions for laser ablation and use thereof MERCK PATENT GMBH (DE) 2020-07-07 US claimed
EP-0948553-B1 FRACTIONATED NOVOLAK RESIN FROM CRESOL-FORMALDEHYDE REACTION MIXTURE AND PHOTORESIST COMPOSITION THEREFROM CLARIANT FINANCE BVI LTD (VG) 2001-04-11 EP claimed
EP-0211667-B1 RADIATION-SENSITIVE RESIN COMPOSITION JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1992-03-11 EP claimed
EP-0457367-A1 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1991-11-21 EP claimed
EP-0211667-A2 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1987-02-25 EP claimed
US-12637529-B2 Resin composition and display device using the same SAMSUNG DISPLAY CO., LTD. (KR) 2026-05-26 US disclosed
WO-2026100508-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN 富士フイルム株式会社 2026-05-15 WO disclosed
WO-2026100734-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PATTERNED CURED PRODUCT PRODUCTION METHOD, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2026-05-15 WO disclosed
WO-2026100662-A1 LIQUID CRYSTAL ALIGNING AGENT AND LIQUID CRYSTAL DISPLAY ELEMENT 日産化学株式会社 2026-05-15 WO disclosed
WO-2026100713-A1 COMPOSITION, SILVER HALIDE PHOTOGRAPHIC SENSITIVE MATERIAL, DIFFUSION-TRANSFER-TYPE SILVER HALIDE PHOTOGRAPHIC SENSITIVE MATERIAL, DISPLAY MATERIAL, AND PRINTING PLATE MATERIAL 富士フイルム株式会社 2026-05-15 WO disclosed
WO-2026100079-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PATTERNED CURED PRODUCT PRODUCTION METHOD, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2026-05-15 WO disclosed
EP-3893054-B1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORP (JP) 2026-05-06 EP disclosed
EP-0645678-A1 Radiation-sensitive composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1995-03-29 EP disclosed
US-5368976-A Liquid crystal display. charge coupled device JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1994-11-29 US disclosed
EP-0564168-A2 Pigment-dispersed color-filter composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1993-10-06 EP disclosed
US-5238774-A Photoresists, integrated circuits JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1993-08-24 US disclosed
US-5215857-A Resists for making integrated circuits JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1993-06-01 US disclosed
EP-0211667-B1 RADIATION-SENSITIVE RESIN COMPOSITION JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1992-03-11 EP disclosed
EP-0457367-A1 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1991-11-21 EP disclosed
EP-0211667-A2 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1987-02-25 EP disclosed