SCHEMBL19600586

SCHEMBL19600586

COCc1cc(Cc2cc(C)c(O)c(CCO)c2)cc(C)c1O

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SHBG P04278 1/20 0.59
HMGB1 P09429 1/20 0.40
CXCL12 P48061 1/20 0.40
PRKCE Q02156 3/20 0.39
MYLK Q15746 2/20 0.39
ALDH1A1 P00352 2/20 0.39
MEN1 O00255 1/20 0.39
PRKCG P05129 1/20 0.39
MAPT P10636 1/20 0.39
PRKCA P17252 1/20 0.39
APEX1 P27695 1/20 0.39
RECQL P46063 1/20 0.39
KMT2A Q03164 1/20 0.39
TDP1 Q9NUW8 1/20 0.39
ESR1 P03372 1/20 0.34
ESR2 Q92731 1/20 0.34
PTGS1 P23219 2/20 0.33
PTGS2 P35354 2/20 0.33
TNKS2 Q9H2K2 1/20 0.32
CYP2D6 P10635 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16207219 0.92 SHBG (0.46) SHBGHMGB1CXCL12PRKCEMYLK
SCHEMBL15686504 0.92 SHBG (0.46) SHBGHMGB1CXCL12PRKCEMYLK
SCHEMBL19600585 0.90 SHBG (0.49) SHBGHMGB1CXCL12PRKCEMYLK
SCHEMBL30416054 0.90 SHBG (0.66) SHBGHMGB1CXCL12PRKCEMYLK
SCHEMBL13090303 0.90 SHBG (0.66) SHBGHMGB1CXCL12PRKCEMYLK
SCHEMBL16850509 0.88 SHBG (0.50) SHBGHMGB1CXCL12PRKCEMYLK
SCHEMBL19600596 0.83 PRKCE (0.43) SHBGPRKCEMYLKALDH1A1MEN1
SCHEMBL16854091 0.81 SHBG (0.52) SHBGHMGB1CXCL12PRKCEMYLK
SCHEMBL25446790 0.81 SHBG (0.54) SHBGHMGB1CXCL12PRKCEMYLK
SCHEMBL1919545 0.80 PRKCE (0.50) SHBGHMGB1CXCL12PRKCEMYLK

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230350305-A1 MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND TREATMENT LIQUID FUJIFILM CORPORATION (JP) 2023-11-02 US disclosed
US-20170327644-A1 RESIN AND PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2017-11-16 US disclosed