SCHEMBL19600598

SCHEMBL19600598

CCc1cc(CCO)c(O)c(COC)c1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PRKCE Q02156 3/20 0.41
MYLK Q15746 2/20 0.41
TDP1 Q9NUW8 2/20 0.41
MEN1 O00255 1/20 0.41
ALDH1A1 P00352 1/20 0.41
PRKCG P05129 1/20 0.41
MAPT P10636 1/20 0.41
PRKCA P17252 1/20 0.41
APEX1 P27695 1/20 0.41
RECQL P46063 1/20 0.41
KMT2A Q03164 1/20 0.41
HSPA5 P11021 1/20 0.38
POLB P06746 1/20 0.37
L3MBTL1 Q9Y468 1/20 0.37
CA2 P00918 1/20 0.35
ALOX5 P09917 4/20 0.35
PTGS2 P35354 4/20 0.34
SHBG P04278 1/20 0.33
TNKS2 Q9H2K2 1/20 0.33
CYP4F2 P78329 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19600596 0.89 PRKCE (0.43) PRKCEMYLKTDP1MEN1ALDH1A1
SCHEMBL18810424 0.89 PRKCE (0.48) PRKCEMYLKTDP1MEN1ALDH1A1
SCHEMBL15686504 0.88 SHBG (0.46) PRKCEMYLKTDP1MEN1ALDH1A1
SCHEMBL16207219 0.88 SHBG (0.46) PRKCEMYLKTDP1MEN1ALDH1A1
SCHEMBL16850507 0.86 PRKCE (0.41) PRKCEMYLKTDP1MEN1ALDH1A1
SCHEMBL19600594 0.86 TDP1 (0.37) PRKCEMYLKTDP1MEN1ALDH1A1
SCHEMBL16850503 0.85 PRKCE (0.46) PRKCEMYLKTDP1MEN1ALDH1A1
SCHEMBL26248981 0.85 PRKCE (0.46) PRKCEMYLKTDP1MEN1ALDH1A1
SCHEMBL14997925 0.85 PRKCE (0.40) PRKCEMYLKTDP1MEN1ALDH1A1
SCHEMBL10114775 0.84 PRKCE (0.44) PRKCEMYLKTDP1MEN1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230350305-A1 MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND TREATMENT LIQUID FUJIFILM CORPORATION (JP) 2023-11-02 US disclosed
US-20170327644-A1 RESIN AND PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2017-11-16 US disclosed