SCHEMBL19600594

SCHEMBL19600594

CCc1cc(COC)cc(CCO)c1O

nearest known ligand 0.37

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.37
POLB P06746 1/20 0.37
L3MBTL1 Q9Y468 1/20 0.37
PRKCE Q02156 3/20 0.37
MYLK Q15746 2/20 0.37
MEN1 O00255 1/20 0.37
ALDH1A1 P00352 1/20 0.37
PRKCG P05129 1/20 0.37
MAPT P10636 1/20 0.37
PRKCA P17252 1/20 0.37
APEX1 P27695 1/20 0.37
RECQL P46063 1/20 0.37
KMT2A Q03164 1/20 0.37
DHFR P00374 2/20 0.37
GABRA1 P14867 1/20 0.35
GABRB2 P47870 1/20 0.35
ALOX5 P09917 4/20 0.35
PTGS2 P35354 3/20 0.34
BACE1 P56817 1/20 0.34
TNKS2 Q9H2K2 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19600596 0.89 PRKCE (0.43) TDP1POLBL3MBTL1PRKCEMYLK
SCHEMBL19600598 0.86 PRKCE (0.41) TDP1POLBL3MBTL1PRKCEMYLK
SCHEMBL16850507 0.86 PRKCE (0.41) TDP1POLBL3MBTL1PRKCEMYLK
SCHEMBL16854090 0.85 PRKCE (0.46) TDP1POLBL3MBTL1PRKCEMYLK
SCHEMBL14997925 0.85 PRKCE (0.40) TDP1POLBL3MBTL1PRKCEMYLK
SCHEMBL12653882 0.85 ALOX5 (0.47) TDP1POLBL3MBTL1MEN1MAPT
SCHEMBL19600585 0.83 SHBG (0.49) TDP1PRKCEMYLKMEN1ALDH1A1
SCHEMBL14997926 0.81 PRKCE (0.37) TDP1POLBL3MBTL1PRKCEMYLK
SCHEMBL16207219 0.81 SHBG (0.46) TDP1POLBL3MBTL1PRKCEMYLK
SCHEMBL15686504 0.81 SHBG (0.46) TDP1POLBL3MBTL1PRKCEMYLK

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230350305-A1 MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND TREATMENT LIQUID FUJIFILM CORPORATION (JP) 2023-11-02 US disclosed
US-20170327644-A1 RESIN AND PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2017-11-16 US disclosed