SCHEMBL196133

SCHEMBL196133

CCOC(C)C(=O)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14459543 1.00
SCHEMBL926431 1.00
Propylene Glycol SCHEMBL4591643 0.89 TDP1 (0.40)
SCHEMBL21777039 0.83 MGAM (0.37)
SCHEMBL31210051 0.83 CA1 (0.33)
SCHEMBL12234493 0.82 TSHR (0.40)
SCHEMBL27494399 0.82 LMNA (0.44)
SCHEMBL27494398 0.82 LMNA (0.44)
SCHEMBL13898920 0.82 SMN1; SMN2 (0.42)
SCHEMBL37035 0.82 ALDH1A1 (0.46)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 4053 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250388765-A1 Water Washable Ink or Paint CRAYOLA LLC (US) 2025-12-25 US claimed
EP-4615891-A1 DSA OF LIQUID CRYSTAL BLOCK COPOLYMERS FOR INTEGRATED CIRCUIT PATTERNING Merck Patent GmbH (DE) 2025-09-17 EP claimed
CN-110874025-B Diluent composition, substrate processing method and semiconductor element manufacturing method 易案爱富科技有限公司 2024-05-24 CN claimed
WO-2024100181-A1 DSA OF LIQUID CRYSTAL BLOCK COPOLYMERS FOR INTEGRATED CIRCUIT PATTERNING MERCK PATENT GMBH (DE) 2024-05-16 WO claimed
CN-117923503-A Hollow structure silicon dioxide dispersion liquid with aldehyde groups grafted on inner and outer surfaces and preparation method thereof 山东国瓷功能材料股份有限公司 2024-04-26 CN claimed
CN-117551259-A Epoxy resin composition, modified epoxy resin, alkali-soluble polyurethane resin composition, alkali-soluble polyurethane resin, and solder resist 杭州福斯特电子材料有限公司 2024-02-13 CN claimed
US-11220659-B2 Thinner composition ENF TECHNOLOGY CO., LTD. (KR) 2022-01-11 US claimed
CN-108350303-B Novel compositions and their use for modifying the surface of substrates 默克专利有限公司 2021-07-23 CN claimed
CN-105867070-B Method for treating substrate by using thinner composition 东友精细化工有限公司 2021-05-28 CN claimed
US-10705424-B2 Negative-working photoresist compositions for laser ablation and use thereof MERCK PATENT GMBH (DE) 2020-07-07 US claimed
WO-2007043544-A1 CARBOXYL GROUP-CONTAINING POLYURETHANE AND HEAT-CURABLE POLYURETHANE RESIN COMPOSITION PREPARED THEREFROM SHOWA DENKO K.K. (JP) 2007-04-19 WO claimed
WO-2007004738-A1 CARBOXYL GROUP-CONTAINING POLYURETHANE AND USES THEREOF SHOWA DENKO K.K. (JP) 2007-01-11 WO claimed
WO-2006123804-A1 CARBOXYL GROUP-CONTAINING POLYURETHANE, HEAT-CURABLE RESIN COMPOSITION AND USES THEREOF SHOWA DENKO K.K. (JP) 2006-11-23 WO claimed
US-20050260523-A1 Photoresist composition for LCD light diffuse reflecting film EVERLIGHT USA, INC. (US) 2005-11-24 US claimed
CN-1700094-A Liquid crystal display element random layer optical resistance composition MINGDE INTERNAT WAREHOUSING & (CN) 2005-11-23 CN claimed
CN-1693322-A Manufacturing method of acrylic copolymer resin for layer insulation film for TFT-LCD DONGJIN SAEMIGUNG CO LTD (KR) 2005-11-09 CN claimed
EP-0948553-B1 FRACTIONATED NOVOLAK RESIN FROM CRESOL-FORMALDEHYDE REACTION MIXTURE AND PHOTORESIST COMPOSITION THEREFROM CLARIANT FINANCE BVI LTD (VG) 2001-04-11 EP claimed
EP-0211667-B1 RADIATION-SENSITIVE RESIN COMPOSITION JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1992-03-11 EP claimed
EP-0457367-A1 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1991-11-21 EP claimed
EP-0211667-A2 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1987-02-25 EP claimed