Benzoic Acid

Benzoic Acid

SCHEMBL1969718

CCOCCOCC.O=C(O)c1ccccc1

nearest known ligand 0.58

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

CACNA1CCACNA1DCACNA1FCACNA1SDPP4HTR1BHTR1D

The experimentally established mechanism targets of Benzoic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
DAO P14920 1/20 0.58
TSHR P16473 1/20 0.58
NAPRT Q6XQN6 1/20 0.58
CES2 O00748 2/20 0.50
CES1 P23141 2/20 0.50
PKM P14618 1/20 0.50
LMNA P02545 1/20 0.50
SRD5A2 P31213 1/20 0.50
RARB P10826 2/20 0.48
RARA P10276 1/20 0.48
RARG P13631 1/20 0.48
KMT2A Q03164 2/20 0.47
SMN1; SMN2 Q16637 1/20 0.47
MEN1 O00255 1/20 0.47
TAAR1 Q96RJ0 1/20 0.47
ALDH1A1 P00352 1/20 0.47
MRGPRX4 Q96LA9 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Benzoic Acid SCHEMBL3384089 1.00 DAO (0.58) DAOTSHRNAPRTCES2CES1
Benzoic Acid SCHEMBL9460609 0.91 TSHR (0.64) DAOTSHRNAPRTCES2CES1
Benzoic Acid SCHEMBL931656 0.91 TSHR (0.64) DAOTSHRNAPRTCES2CES1
Benzoic Acid SCHEMBL5158457 0.90 ALDH1A1 (0.52) DAOTSHRNAPRTCES2CES1
Benzoic Acid SCHEMBL11650940 0.88 TSHR (0.58) DAOTSHRNAPRTCES2CES1
Benzoic Acid SCHEMBL2914560 0.87 TSHR (0.48) DAOTSHRNAPRTCES2CES1
Benzoic Acid SCHEMBL2321548 0.86 LMNA (0.58) DAOTSHRNAPRTCES2CES1
Benzoic Acid SCHEMBL6129434 0.86 LMNA (0.58) DAOTSHRNAPRTCES2CES1
Benzoic Acid SCHEMBL12981029 0.86 TP53 (0.61) TSHRRARB
Phthalic Acid SCHEMBL5078833 0.84 ALDH1A1 (0.54) DAOTSHRNAPRTCES2CES1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20220145617-A1 Corrugated Intumescent Composite Structure and a Method of Use 3M INNOVATIVE PROPERTIES COMPANY 2022-05-12 US disclosed
US-10683457-B2 Solid composite intumescent structures for fire protection 3M INNOVATIVE PROPERTIES COMPANY (US) 2020-06-16 US disclosed
US-20160272891-A1 SOLID COMPOSITE INTUMESCENT STRUCTURES FOR FIRE PROTECTION 3M INNOVATIVE PROPERTIES COMPANY 2016-09-22 US disclosed
US-20110262367-A1 INSECTICIDAL GASSING AGENT CONTAINING ACTIVE INGREDIENT IN THE FORM OF A GRANULATE BAYER CROPSCIENCE AG (DE) 2011-10-27 US disclosed
EP-2334171-A2 INSECTICIDAL GASSING AGENT CONTAINING ACTIVE INGREDIENT IN THE FORM OF A GRANULATE Bayer CropScience Aktiengesellschaft (DE) 2011-06-22 EP disclosed
WO-2010031507-A2 INSECTICIDAL GASSING AGENT CONTAINING ACTIVE INGREDIENT IN THE FORM OF A GRANULATE BAYER CROPSCIENCE AKTIENGESELLSCHAFT (DE) 2010-03-25 WO disclosed
WO-2010031508-A2 INSECTICIDAL GASSING AGENT CONTAINING ACTIVE INGREDIENT IN THE FORM OF WAX PARTICLES BAYER CROPSCIENCE AKTIENGESELLSCHAFT (DE) 2010-03-25 WO disclosed
US-7645823-B2 Resin composition, molded product from resin composition and method for preparing resin composition SONY CORPORATION (JP) 2010-01-12 US disclosed
US-20070270527-A1 Resin Composition, Molded Product From Resin Composition and Method for Preparing Resin Composition Lerner, David, Littenberg, Krumholz & Mentlik, LLP 2007-11-22 US disclosed
US-20070257239-A1 Resin Composition, Molded Product Obtained From Resin Composition and Method for Preparation of Resin Composition SONY CORPORATION (JP) 2007-11-08 US disclosed
EP-1698658-A1 RESIN COMPOSITION, SHAPED ARTICLE USING SUCH RESIN COMPOSITION AND METHOD FOR PRODUCING RESIN COMPOSITION Sony Corporation (JP) 2006-09-06 EP disclosed
EP-1690899-A1 RESIN COMPOSITION, MOLDING THEREOF AND PROCESS FOR PRODUCING THE RESIN COMPOSITION Sony Corporation (JP) 2006-08-16 EP disclosed
US-5645845-A CONTAINING PYRETHROID-TYPE COMPOUND BAYER AKTIENGESELLSCHAFT (DE) 1997-07-08 US disclosed
EP-0693254-A1 Gel formulations containing insecticides for vaporizer systems BAYER AG (DE) 1996-01-24 EP disclosed