Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP2D6 | P10635 | 1/20 | 0.38 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.35 |
| ▸ | PDCD1 | Q15116 | 1/20 | 0.35 |
| ▸ | CD274 | Q9NZQ7 | 1/20 | 0.35 |
| ▸ | TAAR1 | Q96RJ0 | 2/20 | 0.34 |
| ▸ | TRPA1 | O75762 | 2/20 | 0.34 |
| ▸ | IDO1 | P14902 | 2/20 | 0.34 |
| ▸ | ADRA2A | P08913 | 1/20 | 0.33 |
| ▸ | ADRA2C | P18825 | 1/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.33 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.33 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.33 |
| ▸ | MC4R | P32245 | 1/20 | 0.33 |
| ▸ | TSHR | P16473 | 1/20 | 0.32 |
| ▸ | GAA | P10253 | 1/20 | 0.32 |
| ▸ | SCN1A | P35498 | 1/20 | 0.32 |
| ▸ | SCN2A | Q99250 | 1/20 | 0.32 |
| ▸ | SCN3A | Q9NY46 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19713147 | 0.78 | ACHE (0.38) | ALDH1A1 | |
| SCHEMBL733329 | 0.70 | CA4 (0.41) | CYP2D6ALDH1A1TRPA1LMNAKDM4E | |
| SCHEMBL9408948 | 0.65 | TDP1 (0.42) | CYP2D6L3MBTL1ALDH1A1TAAR1TRPA1 | |
| SCHEMBL5080032 | 0.65 | TDP1 (0.42) | CYP2D6L3MBTL1ALDH1A1TAAR1TRPA1 | |
| SCHEMBL733807 | 0.65 | LTA4H (0.45) | L3MBTL1ALDH1A1TAAR1TSHR | |
| SCHEMBL4392736 | 0.65 | LTA4H (0.37) | L3MBTL1ALDH1A1LMNATSHRSCN1A | |
| O-Xylene SCHEMBL28550624 | 0.65 | ACHE (0.50) | CYP2D6ALDH1A1PDCD1CD274LMNA | |
| Isopropylbenzene SCHEMBL27557730 | 0.64 | TAAR1 (0.48) | CYP2D6ALDH1A1TAAR1TRPA1ADRA2A | |
| Isopropylbenzene SCHEMBL7523872 | 0.64 | TAAR1 (0.48) | CYP2D6ALDH1A1TAAR1ADRA2AADRA2C | |
| SCHEMBL706394 | 0.63 | TAAR1 (0.38) | CYP2D6ALDH1A1TAAR1TRPA1ADRA2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-108026652-B | Metal foil, metal foil with release layer, laminate, printed wiring board, semiconductor package, electronic device, and method for manufacturing printed wiring board | ＪＸ金属株式会社 | 2019-10-25 | — | — | CN | disclosed |
| CN-110099518-A | The preparation method of resin base material, the preparation method of printing distributing board, the preparation method of the preparation method of printed circuit board and e-machine | JX日矿日石金属株式会社 | 2019-08-06 | — | — | CN | disclosed |
| CN-104685980-B | The manufacturing method and base substrate of multilayer printed wiring board | JX日矿日石金属株式会社 | 2018-11-23 | — | — | CN | disclosed |
| CN-108696988-A | The manufacturing method of attached release layer copper foil, laminate, the manufacturing method of printing distributing board and e-machine | ＪＸ金属株式会社 | 2018-10-23 | — | — | CN | disclosed |
| CN-108696998-A | The copper foil of attached release layer, the manufacturing method of laminate, the manufacturing method of printing distributing board and e-machine | ＪＸ金属株式会社 | 2018-10-23 | — | — | CN | disclosed |
| US-20180264783-A1 | Metal Foil, Metal Foil Having Release Layer, Laminated Material, Printed Wiring Board, Semiconductor Package, Electronic Device, And Method For Producing Printed Wiring Board | JX NIPPON MINING & METALS CORPORATION (JP) | 2018-09-20 | — | — | US | disclosed |
| CN-108401362-A | The manufacturing method of metal foil, laminate, printing distributing board, semiconductor packages, e-machine and printing distributing board | ＪＸ金属株式会社 | 2018-08-14 | — | — | CN | disclosed |
| CN-108026652-A | Metal foil, metal foil with release layer, laminate, printed wiring board, semiconductor package, electronic device, and method for manufacturing printed wiring board | ＪＸ金属株式会社 | 2018-05-11 | — | — | CN | disclosed |
| CN-107921749-A | Surface-treated metal foil, laminate, printed wiring board, semiconductor package, electronic device, and method for manufacturing printed wiring board | ＪＸ金属株式会社 | 2018-04-17 | — | — | CN | disclosed |
| CN-107710890-A | Method for manufacturing printed wiring board, surface-treated copper foil, laminate, printed wiring board, semiconductor package, and electronic device | ＪＸ金属株式会社 | 2018-02-16 | — | — | CN | disclosed |
| CN-107529282-A | The copper foil of attached release layer, laminate, the manufacture method of the manufacture method of printing distributing board and e-machine | ＪＸ金属株式会社 | 2017-12-29 | — | — | CN | disclosed |
| US-20170362733-A1 | COPPER FOIL WITH RELEASE LAYER, LAMINATED MATERIAL, METHOD FOR PRODUCING PRINTED WIRING BOARD, AND METHOD FOR PRODUCING ELECTRONIC APPARATUS | JX NIPPON MINING & METALS CORPORATION (JP) | 2017-12-21 | — | — | US | disclosed |
| CN-104943255-A | Surface-treated copper foil, copper-clad laminate, printed wiring board, electronic device, semiconductor package, and method for manufacturing printed wiring board | JX NIPPON MINING & METALS CORP | 2015-09-30 | — | — | CN | disclosed |
| CN-104685980-A | Production method for multilayer printed wiring board, and base material | JX NIPPON MINING & METALS CORP | 2015-06-03 | — | — | CN | disclosed |
| CN-104661810-A | Carrier-attached metal foil, laminate comprising resin plate-like carrier and metal foil, and use thereof | JX NIPPON MINING & AMP | 2015-05-27 | — | — | CN | disclosed |