SCHEMBL4392736

SCHEMBL4392736

CCO[Al](OCC)c1ccccc1

nearest known ligand 0.37

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LTA4H P09960 1/20 0.37
TP53 P04637 1/20 0.36
PSIP1 O75475 1/20 0.36
LMNA P02545 1/20 0.34
POLB P06746 1/20 0.34
CHRNA7 P36544 3/20 0.33
CHRNB2 P17787 2/20 0.33
CHRNB4 P30926 2/20 0.33
CHRNA3 P32297 2/20 0.33
CHRNA4 P43681 2/20 0.33
RELA Q04206 1/20 0.33
NPSR1 Q6W5P4 1/20 0.33
TSHR P16473 1/20 0.33
L3MBTL1 Q9Y468 2/20 0.32
SCN1A P35498 1/20 0.32
SCN2A Q99250 1/20 0.32
SCN3A Q9NY46 1/20 0.32
KCNH2 Q12809 1/20 0.32
GLA P06280 1/20 0.32
ALDH1A1 P00352 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28010084 0.89 GLA (0.33) LTA4HTP53PSIP1LMNAPOLB
SCHEMBL6151730 0.80 LTA4H (0.37) LTA4HTP53CHRNA7CHRNB2CHRNB4
SCHEMBL19713205 0.78 ACHE (0.38) ALDH1A1
SCHEMBL733329 0.70 CA4 (0.41) LTA4HLMNAPOLBTSHRSCN1A
SCHEMBL10879171 0.67 LTA4H (0.43) LTA4HTP53LMNACHRNA7CHRNB2
Toluene SCHEMBL28958652 0.65 LMNA (0.48) LTA4HTP53LMNAPOLBRELA
SCHEMBL733807 0.65 LTA4H (0.45) LTA4HCHRNA7CHRNB2CHRNB4CHRNA3
SCHEMBL149837 0.65 TP53 (0.41) TP53PSIP1LMNACHRNA7CHRNB2
SCHEMBL148658 0.65 TP53 (0.41) TP53PSIP1LMNACHRNA7CHRNB2
SCHEMBL19713142 0.65 CYP2D6 (0.38) LMNATSHRL3MBTL1SCN1ASCN2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20180264783-A1 Metal Foil, Metal Foil Having Release Layer, Laminated Material, Printed Wiring Board, Semiconductor Package, Electronic Device, And Method For Producing Printed Wiring Board JX NIPPON MINING & METALS CORPORATION (JP) 2018-09-20 US disclosed
US-20170362733-A1 COPPER FOIL WITH RELEASE LAYER, LAMINATED MATERIAL, METHOD FOR PRODUCING PRINTED WIRING BOARD, AND METHOD FOR PRODUCING ELECTRONIC APPARATUS JX NIPPON MINING & METALS CORPORATION (JP) 2017-12-21 US disclosed
CN-104943255-A Surface-treated copper foil, copper-clad laminate, printed wiring board, electronic device, semiconductor package, and method for manufacturing printed wiring board JX NIPPON MINING & METALS CORP 2015-09-30 CN disclosed
CN-104685980-A Production method for multilayer printed wiring board, and base material JX NIPPON MINING & METALS CORP 2015-06-03 CN disclosed
US-8227390-B2 Binder resin for friction material, binder resin composition for friction material, composite material for friction material containing the same, friction material and production method thereof AKEBONO BRAKE INDUSTRY CO., LTD. (JP) 2012-07-24 US disclosed
US-20090137434-A1 BINDER RESIN FOR FRICTION MATERIAL, BINDER RESIN COMPOSITION FOR FRICTION MATERIAL, COMPOSITE MATERIAL FOR FRICTION MATERIAL CONTAINING THE SAME, FRICTION MATERIAL AND PRODUCTION METHOD THEREOF AKEBONO BRAKE INDUSTRY CO., LTD (JP) 2009-05-28 US disclosed