SCHEMBL2898646

SCHEMBL2898646

CC(C#N)N1CCN=C1c1ccccc1

nearest known ligand 0.44

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
POLB P06746 1/20 0.41
GAA P10253 1/20 0.39
ALDH1A1 P00352 1/20 0.38
RECQL P46063 1/20 0.38
PTAFR P25105 2/20 0.36
LMNA P02545 2/20 0.36
THRB P10828 1/20 0.35
NPC1 O15118 1/20 0.35
CA1 P00915 1/20 0.35
CA2 P00918 1/20 0.35
CA4 P22748 1/20 0.35
CA7 P43166 1/20 0.35
MEN1 O00255 1/20 0.35
KMT2A Q03164 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL124028 0.82 POLB (0.46) POLBGAAALDH1A1RECQLPTAFR
SCHEMBL10365363 0.79 POLB (0.44) POLBGAAALDH1A1RECQLPTAFR
SCHEMBL9207857 0.79 POLB (0.47) POLBGAAALDH1A1RECQLPTAFR
SCHEMBL522530 0.77 CYP19A1 (0.41) POLBGAAALDH1A1RECQLPTAFR
Benzene SCHEMBL28157385 0.75 CYP1A2 (0.48) ALDH1A1LMNA
SCHEMBL10046459 0.74 PTAFR (0.42) POLBGAAALDH1A1RECQLPTAFR
SCHEMBL10046467 0.73 ALDH1A1 (0.42) POLBGAAALDH1A1RECQLPTAFR
SCHEMBL1971535 0.72 ALDH1A1 (0.31) ALDH1A1
SCHEMBL10046463 0.72 OPRD1 (0.50) LMNAMEN1KMT2A
SCHEMBL521671 0.71 PTAFR (0.45) POLBGAAALDH1A1RECQLPTAFR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118256135-A Coating composition and method for forming coating film 日涂汽车涂料有限公司 2024-06-28 CN disclosed
US-12011787-B2 Flux, solder paste, and electronic circuit board HARIMA CHEMICALS, INCORPORATED (JP) 2024-06-18 US disclosed
CN-113677814-B Flux, solder paste, and electronic circuit board 哈利玛化成株式会社 2022-09-13 CN disclosed
US-20220193834-A1 FLUX, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD HARIMA CHEMICALS, INCORPORATED (JP) 2022-06-23 US disclosed
EP-3954796-A1 FLUX, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD Harima Chemicals, Incorporated (JP) 2022-02-16 EP disclosed
CN-113677814-A Flux, solder paste, and electronic circuit board 哈利玛化成株式会社 2021-11-19 CN disclosed
US-20210047539-A1 COATING COMPOSITION AND METHOD FOR FORMING COATING FILM NIPPON PAINT AUTOMOTIVE COATINGS CO., LTD. (JP) 2021-02-18 US disclosed
CN-111655808-A Coating composition and method for forming coating film 日涂汽车涂料有限公司 2020-09-11 CN disclosed
WO-2019150776-A1 COATING COMPOSITION AND METHOD FOR FORMING COATING FILM 日本ペイント・オートモーティブコーティングス株式会社 2019-08-08 WO disclosed
US-9169403-B2 Powder coating composition for PC strand coating, coating method, and coating film NIPPON PAINT CO., LTD. (JP) 2015-10-27 US disclosed
EP-2186865-B1 POWDER COATING COMPOSITION FOR PC STRAND COATING, COATING METHOD, AND COATING FILM SUMITOMO SEI STEEL WIRE CORP (JP) 2013-10-02 EP disclosed
US-20100233478-A1 POWDER COATING COMPOSITION FOR PC STRAND COATING, COATING METHOD, AND COATING FILM SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) 2010-09-16 US disclosed
EP-2186865-A1 POWDER COATING COMPOSITION FOR PC STRAND COATING, COATING METHOD, AND COATING FILM Sumitomo (Sei) Steel Wire Corp. (JP) 2010-05-19 EP disclosed