SCHEMBL1986279

SCHEMBL1986279

COC=CC(=O)OCCO

nearest known ligand 0.50

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.50
ATM Q13315 1/20 0.43
HCAR2 Q8TDS4 6/20 0.41
KEAP1 Q14145 1/20 0.33
NFE2L2 Q16236 1/20 0.33
ACHE P22303 1/20 0.33
MAPT P10636 1/20 0.33
RAB9A P51151 1/20 0.33
NPSR1 Q6W5P4 1/20 0.33
ALOX5 P09917 1/20 0.33
HPGD P15428 1/20 0.32
LMNA P02545 1/20 0.32
TDP1 Q9NUW8 1/20 0.32
ESR1 P03372 1/20 0.31
ALDH1A1 P00352 2/20 0.31
CYP3A4 P08684 1/20 0.31
TP53 P04637 1/20 0.31
HIF1A Q16665 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6824338 0.88 TSHR (0.44) TSHRATMHCAR2MAPTALDH1A1
SCHEMBL6826217 0.88 TSHR (0.44) TSHRATMHCAR2MAPTALDH1A1
SCHEMBL16164123 0.84 HCAR2 (0.47) TSHRATMHCAR2ACHEMAPT
SCHEMBL1879216 0.83 HCAR2 (0.61) TSHRATMHCAR2KEAP1NFE2L2
SCHEMBL1879214 0.83 HCAR2 (0.61) TSHRATMHCAR2KEAP1NFE2L2
SCHEMBL216328 0.81 TSHR (0.64) TSHRATMHCAR2KEAP1NFE2L2
SCHEMBL1455147 0.81 TSHR (0.64) TSHRATMHCAR2KEAP1NFE2L2
SCHEMBL608166 0.81 TSHR (0.64) TSHRATMHCAR2KEAP1NFE2L2
SCHEMBL2980459 0.80 HCAR2 (0.59) TSHRATMHCAR2KEAP1NFE2L2
SCHEMBL7262708 0.80 HCAR2 (0.59) TSHRATMHCAR2KEAP1NFE2L2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3257901-B1 PREPARATION METHOD AND APPLICATION OF ELECTRON BEAM CURABLE PAINT AND ELECTRON BEAM CURABLE COATING GUANGDONG TIANAN NEW MAT CO LTD (CN) 2020-05-06 EP disclosed
US-20180002549-A1 PREPARATION METHOD AND APPLICATION OF ELECTRON BEAM CURABLE PAINT AND ELECTRON BEAM CURABLE COATING Guangdong Tianan New Material Co., Ltd (CN) 2018-01-04 US disclosed
EP-3257901-A1 PREPARATION METHOD AND APPLICATION OF ELECTRON BEAM CURABLE PAINT AND ELECTRON BEAM CURABLE COATING Guangdong Tianan New Material Co., Ltd (CN) 2017-12-20 EP disclosed
US-20150329425-A1 SUPERPLASTICIZERS FOR CONCRETE AND CEMENT MATERIALS AND PROCESS FOR PRODUCING THE SAME MAPEI S.P.A. (IT) 2015-11-19 US disclosed
EP-2516344-B1 SUPERPLASTICIZERS FOR CONCRETE AND CEMENT MATERIALS AND PROCESS FOR PRODUCING THE SAME MAPEI SPA (IT) 2014-05-14 EP disclosed
US-20130065988-A1 SUPERPLASTICIZERS FOR CONCRETE AND CEMENT MATERIALS AND PROCESS FOR PRODUCING THE SAME MAPEI S.P.A. (IT) 2013-03-14 US disclosed
EP-2516344-A1 SUPERPLASTICIZERS FOR CONCRETE AND CEMENT MATERIALS AND PROCESS FOR PRODUCING THE SAME Mapei S.p.A. (IT) 2012-10-31 EP disclosed
WO-2011076655-A1 SUPERPLASTICIZERS FOR CONCRETE AND CEMENT MATERIALS AND PROCESS FOR PRODUCING THE SAME MAPEI S.P.A. (IT) 2011-06-30 WO disclosed
EP-2336094-A1 \"Superplasticizers for concrete and cement materials and process for producing the same\ Mapei S.p.A. (IT) 2011-06-22 EP disclosed
US-20100068480-A1 Negative-working photosensitive resin composition and photosensitive resin plate using the same CITICORP NORTH AMERICA, INC., AS AGENT 2010-03-18 US disclosed
US-20090068413-A1 Negative-working photosensitive resin composition and photosensitive resin plate using the same TAKANASHI HIROSHI 2009-03-12 US disclosed
US-20080070160-A1 Negative-working photosensitive resin composition and photosensitive resin plate using the same TAKANASHI HIROSHI 2008-03-20 US disclosed
US-20070111141-A1 Negative-working photosensitive resin composition and photosensitive resin plate using the same TAKANASHI HIROSHI 2007-05-17 US disclosed
US-20070065751-A1 Water-soluble photopolymer composition for flexographic printing and water-soluble photosensitive original printing plate for flexographic printing TOKYO OHKA KOGYO CO., LTD. (JP) 2007-03-22 US disclosed
EP-1764651-A2 Water-soluble photopolymer composition for flexographic printing and water-developable photosensitive original printing plate for flexographic printing TOKYO OHKA KOGYO CO., LTD. (JP) 2007-03-21 EP disclosed
US-20060275702-A1 Negative-working photosensitive resin composition and photosensitive resin plate using the same TAKANASHI HIROSHI 2006-12-07 US disclosed
US-20060147838-A1 Negative-working photosensitive resin composition and photosensitive resin plate using the same TAKANASHI HIROSHI 2006-07-06 US disclosed
US-20060057495-A1 Negative-working photosensitive resin composition and photosensitive resin plate using the same TAKANASHI HIROSHI 2006-03-16 US disclosed
US-20010019811-A1 Negative-working photosensitive resin composition and photosensitive resin plate using the same TAKANASHI HIROSHI (JP) 2001-09-06 US disclosed
US-20010010893-A1 Negative-working photosensitive resin composition and photosensitive resin plate using the same TOKYO OHKA KOGYO CO., LTD. (JP) 2001-08-02 US disclosed