SCHEMBL1991981

SCHEMBL1991981

CN(C)CCNC(=O)c1ccc(C(=O)O)c(C(=O)NCCN(C)C)c1C(=O)O

nearest known ligand 0.55

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
HTT P42858 1/20 0.55
SMN1; SMN2 Q16637 1/20 0.55
CYP1A2 P05177 2/20 0.48
MAPK1 P28482 1/20 0.44
CYP2D6 P10635 1/20 0.44
ALDH1A1 P00352 4/20 0.44
KDM4E B2RXH2 2/20 0.44
HSD17B10 Q99714 1/20 0.44
EGFR P00533 1/20 0.43
SRC P12931 1/20 0.43
CHEK1 O14757 1/20 0.43
MCHR1 Q99705 1/20 0.42
RAD52 P43351 2/20 0.42
HPGD P15428 1/20 0.41
ALOX12 P18054 1/20 0.41
POLR1A O95602 1/20 0.41
HTR2C P28335 1/20 0.41
AOX1 Q06278 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL771272 0.91 KDM4E (0.51) HTTSMN1; SMN2ALDH1A1KDM4EMCHR1
SCHEMBL771804 0.86 HTT (0.51) HTTSMN1; SMN2CYP1A2MAPK1CYP2D6
SCHEMBL772833 0.80 KMT2A (0.56) HTTSMN1; SMN2CYP1A2MAPK1ALDH1A1
SCHEMBL772102 0.79 HTT (0.58) HTTSMN1; SMN2CYP1A2MAPK1ALDH1A1
SCHEMBL21046542 0.79 HTT (0.66) HTTSMN1; SMN2CYP1A2MAPK1ALDH1A1
SCHEMBL6561072 0.78 HTT (0.54) HTTSMN1; SMN2CYP1A2MAPK1ALDH1A1
SCHEMBL2017654 0.78 HTT (0.61) HTTSMN1; SMN2CYP1A2MAPK1ALDH1A1
SCHEMBL2014524 0.77 HTT (0.52) HTTSMN1; SMN2ALDH1A1KDM4EHPGD
SCHEMBL18756856 0.76 ALDH1A1 (0.47) HTTSMN1; SMN2CYP1A2MAPK1CYP2D6
Dimethylaminoethanol SCHEMBL1131917 0.75 MAPT (0.46) HTTSMN1; SMN2CYP1A2MAPK1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2009074522-A1 PHOTORESIST COMPOSITIONS AND METHOD FOR MULTIPLE EXPOSURES WITH MULTIPLE LAYER RESIST SYSTEMS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2009-06-18 WO claimed
CN-118251759-A Multi-level selective patterning for stacked device creation 杰米纳蒂奥公司 2024-06-25 CN disclosed
CN-118215986-A Chemoselective adhesion and strength promoters in semiconductor patterning 杰米纳蒂奥公司 2024-06-18 CN disclosed
CN-117941028-A Self-aligned stacking method 杰米纳蒂奥公司 2024-04-26 CN disclosed
CN-117941029-A Self-aligned high-order patterning based on anti-spacer 杰米纳蒂奥公司 2024-04-26 CN disclosed
CN-117916852-A Assist feature placement in semiconductor patterning 杰米纳蒂奥公司 2024-04-19 CN disclosed
CN-117916851-A Enhanced field stitching with corrective chemistry 杰米纳蒂奥公司 2024-04-19 CN disclosed
CN-117916854-A Narrow line cutting mask method 杰米纳蒂奥公司 2024-04-19 CN disclosed
CN-117916853-A Formation of a multi-line etched substrate 杰米纳蒂奥公司 2024-04-19 CN disclosed
CN-117916855-A In-resist process for forming high density contacts 杰米纳蒂奥公司 2024-04-19 CN disclosed
WO-2009074522-A1 PHOTORESIST COMPOSITIONS AND METHOD FOR MULTIPLE EXPOSURES WITH MULTIPLE LAYER RESIST SYSTEMS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2009-06-18 WO disclosed
US-20090155715-A1 PHOTORESIST COMPOSITIONS AND METHOD FOR MULTIPLE EXPOSURES WITH MULTIPLE LAYER RESIST SYSTEMS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2009-06-18 US disclosed
US-20060057506-A1 Controlling resist profiles through substrate modification GOODNER MICHAEL D 2006-03-16 US disclosed
US-6991893-B2 Controlling resist profiles through substrate modification INTEL CORPORATION (US) 2006-01-31 US disclosed
US-20040086809-A1 Controlling resist profiles through substrate modification INTEL CORPORATION 2004-05-06 US disclosed
EP-0816419-B9 Ultraviolet-curable polysiloxane composition and method for the formation of cured patterns therefrom DOW CORNING ASIA LTD (JP) 2003-10-22 EP disclosed
EP-0816419-B1 Ultraviolet-curable polysiloxane composition and method for the formation of cured patterns therefrom DOW CORNING ASIA LTD (JP) 2003-03-12 EP disclosed
US-6258506-B1 USING BLEND OF BENZOIN ETHER AND FREE RADICAL POLYMERIZABLE SILICONE POLYMER DOW CORNING ASIA, LTD. (JP) 2001-07-10 US disclosed
US-6051625-A Ultraviolet-curable polysiloxane composition and method for the formation of cured patterns therefrom DOW CORNING ASIA, LTD. (JP) 2000-04-18 US disclosed
EP-0816419-A2 Ultraviolet-curable polysiloxane composition and method for the formation of cured patterns therefrom DOW CORNING ASIA, Ltd. (JP) 1998-01-07 EP disclosed