Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.37 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.37 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.37 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.37 |
| ▸ | MEN1 | O00255 | 1/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.36 |
| ▸ | TSHR | P16473 | 3/20 | 0.35 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.35 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.35 |
| ▸ | ZDHHC20 | Q5W0Z9 | 1/20 | 0.35 |
| ▸ | ZDHHC2 | Q9UIJ5 | 1/20 | 0.35 |
| ▸ | THRB | P10828 | 1/20 | 0.32 |
| ▸ | ACACB | O00763 | 2/20 | 0.31 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.31 |
| ▸ | PKM | P14618 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3376906 | 0.82 | ALDH1A1 (0.38) | ALDH1A1CYP3A4CYP2C9CYP2C19MEN1 | |
| SCHEMBL2779247 | 0.78 | ALDH1A1 (0.41) | ALDH1A1CYP3A4CYP2C9CYP2C19MEN1 | |
| SCHEMBL2792549 | 0.77 | ALDH1A1 (0.40) | ALDH1A1CYP3A4CYP2C9CYP2C19MEN1 | |
| SCHEMBL4909167 | 0.75 | ALDH1A1 (0.44) | ALDH1A1CYP3A4CYP2C9CYP2C19MEN1 | |
| SCHEMBL28537745 | 0.74 | ALDH1A1 (0.35) | ALDH1A1CYP3A4CYP2C9CYP2C19MEN1 | |
| SCHEMBL3319888 | 0.74 | ALDH1A1 (0.40) | ALDH1A1CYP3A4CYP2C9CYP2C19MEN1 | |
| SCHEMBL8766001 | 0.73 | ALDH1A1 (0.42) | ALDH1A1CYP3A4CYP2C9CYP2C19MEN1 | |
| SCHEMBL460924 | 0.71 | ALDH1A1 (0.53) | ALDH1A1CYP3A4CYP2C9CYP2C19MEN1 | |
| SCHEMBL1907643 | 0.71 | ALDH1A1 (0.44) | ALDH1A1CYP3A4CYP2C9CYP2C19MEN1 | |
| SCHEMBL17350190 | 0.69 | ALDH1A1 (0.43) | ALDH1A1CYP3A4CYP2C9CYP2C19MEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8716413-B2 | Photocurable composition | HUNTSMAN ADVANCED MATERIALS AMERICAS LLC (US) | 2014-05-06 | — | — | US | disclosed |
| US-20110200950-A1 | PHOTOCURABLE COMPOSITION | HUNTSMAN INTERNATIONAL LLC (US) | 2011-08-18 | — | — | US | disclosed |
| EP-2331599-A1 | PHOTOCURABLE COMPOSITION | Huntsman Advanced Materials (Switzerland) GmbH (CH) | 2011-06-15 | — | — | EP | disclosed |
| WO-2010034531-A1 | PHOTOCURABLE COMPOSITION | HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GMBH (CH) | 2010-04-01 | — | — | WO | disclosed |
| EP-2168994-A1 | Photocurable composition | Huntsman Advanced Materials (Switzerland) GmbH (CH) | 2010-03-31 | — | — | EP | disclosed |
| EP-1651695-B1 | PHOTOCROSSLINKABLE POLYURETHANES | HUNTSMAN ADV MAT SWITZERLAND (CH) | 2009-01-21 | — | — | EP | disclosed |
| US-7476484-B2 | Photocrosslinkable polyurethanes | HUNTSMAN ADVANCED MATERIALS AMERICAS INC. (US) | 2009-01-13 | — | — | US | disclosed |
| US-7387812-B2 | Telechelic polymers; improved adhesion properties, chemical stability, electrical properties and resistance to rapid temperature ranges; for use as solder resists in production of circuit boards | HUNTSMAN ADVANCED MATERIALS AMERICAS INC. (US) | 2008-06-17 | — | — | US | disclosed |
| EP-1468041-B1 | RESIN COMPOSITION | HUNTSMAN ADV MAT SWITZERLAND (CH) | 2007-05-30 | — | — | EP | disclosed |
| US-20060204895-A1 | Photocrosslinkable polyurethanes | HUNTSMAN ADVANCED MATERIALS AMERICA INC. (US) | 2006-09-14 | — | — | US | disclosed |
| EP-1651695-A1 | PHOTOCROSSLINKABLE POLYURETHANES | Huntsman Advanced Materials (Switzerland) GmbH (CH) | 2006-05-03 | — | — | EP | disclosed |
| EP-1458794-B1 | HEAT-CURABLE RESIN COMPOSITION | HUNTSMAN ADV MAT SWITZERLAND (CH) | 2005-08-17 | — | — | EP | disclosed |
| WO-2005014682-A1 | PHOTOCROSSLINKABLE POLYURETHANES | HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GMBH (CH) | 2005-02-17 | — | — | WO | disclosed |
| US-20050032935-A1 | Telechelic polymers; improved adhesion properties, chemical stability, electrical properties and resistance to rapid temperature ranges; for use as solder resists in production of circuit boards | HUNTSMAN ADVANCED MATERIALS AMERICAS, INC. | 2005-02-10 | — | — | US | disclosed |
| US-20050032946-A1 | Resin composition | HUNTSMAN ADVANCED MATERIALS AMERICAS, INC. (US) | 2005-02-10 | — | — | US | disclosed |
| EP-1468041-A1 | RESIN COMPOSITION | Huntsman Advanced Materials (Switzerland) GmbH (CH) | 2004-10-20 | — | — | EP | disclosed |
| EP-1458794-A1 | HEAT-CURABLE RESIN COMPOSITION | Huntsman Advanced Materials (Switzerland) GmbH (CH) | 2004-09-22 | — | — | EP | disclosed |
| WO-2003048235-A1 | HEAT-CURABLE RESIN COMPOSITION | VANTICO AG (CH) | 2003-06-12 | — | — | WO | disclosed |
| WO-2003048234-A1 | RESIN COMPOSITION | VANTICO AG (CH) | 2003-06-12 | — | — | WO | disclosed |