SCHEMBL19970918

SCHEMBL19970918

CCCCCCCCCCCCc1ccc(S(=O)(=O)Nc2ccc(F)c([Ti](c3c(F)ccc(NS(=O)(=O)c4ccc(CCCCCCCCCCCC)cc4)c3F)(C3C=CC=C3)C3C=CC=C3)c2F)cc1

nearest known ligand 0.45

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
FFAR1 O14842 1/20 0.45
FFAR4 Q5NUL3 1/20 0.45
AKT1 P31749 11/20 0.43
GAB1 Q13480 3/20 0.43
PDPK1 O15530 1/20 0.43
ABCB11 O95342 1/20 0.43
AKT2 P31751 1/20 0.43
AKT3 Q9Y243 1/20 0.43
MOGAT2 Q3SYC2 2/20 0.42
LMNA P02545 1/20 0.41
HTT P42858 1/20 0.41
SMN1; SMN2 Q16637 1/20 0.41
KDM4E B2RXH2 1/20 0.41
IRS1 P35568 1/20 0.39
MCL1 Q07820 1/20 0.39
GHSR Q92847 1/20 0.39
CYP3A4 P08684 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28609943 0.82 CYP3A4 (0.46) CYP3A4
SCHEMBL23854478 0.82 CYP3A4 (0.46) CYP3A4
SCHEMBL23854463 0.82 KEAP1 (0.45) LMNAHTT
SCHEMBL21044952 0.80 FFAR1 (0.45) FFAR1FFAR4AKT1GAB1PDPK1
SCHEMBL482873 0.80 FFAR1 (0.43) FFAR1FFAR4AKT1GAB1PDPK1
SCHEMBL28608351 0.80 CYP2D6 (0.40)
SCHEMBL29104859 0.79 SLC40A1 (0.44) FFAR4HTTSMN1; SMN2
SCHEMBL20164072 0.79 CA2 (0.38) FFAR1FFAR4LMNAHTTSMN1; SMN2
SCHEMBL31385565 0.75 TSHR (0.33)
SCHEMBL29480067 0.75 EPHX2 (0.40) SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113168093-B Pattern forming method, photosensitive resin composition, cured film, laminate, and device 富士胶片株式会社 2024-04-30 CN disclosed
CN-113383273-B Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2023-11-14 CN disclosed
CN-113383273-A Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2021-09-10 CN disclosed
CN-113168093-A Pattern forming method, photosensitive resin composition, cured film, laminate, and device 富士胶片株式会社 2021-07-23 CN disclosed
EP-3295246-A1 METHOD FOR MAKING AN OBJECT Photocentric Limited (GB) 2018-03-21 EP disclosed