SCHEMBL20164072

SCHEMBL20164072

CCCCCCCCCCCCc1ccc(S(=O)(=O)N(C)c2ccc(F)c([Ti](c3c(F)ccc(N(C)S(=O)(=O)c4ccc(CCCCCCCCCCCC)cc4)c3F)(C3C=CC=C3)C3C=CC=C3)c2F)cc1

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA2 P00918 3/20 0.38
NMT1 P30419 4/20 0.36
MLNR O43193 1/20 0.36
CA12 O43570 1/20 0.35
CA1 P00915 1/20 0.35
CA9 Q16790 1/20 0.35
KEAP1 Q14145 1/20 0.35
NFE2L2 Q16236 1/20 0.35
PSEN1 P49768 2/20 0.34
PSEN2 P49810 2/20 0.34
APH1B Q8WW43 2/20 0.34
NCSTN Q92542 2/20 0.34
APH1A Q96BI3 2/20 0.34
PSENEN Q9NZ42 2/20 0.34
SMN1; SMN2 Q16637 2/20 0.34
LMNA P02545 1/20 0.34
HTT P42858 1/20 0.34
THRA P10827 2/20 0.33
THRB P10828 2/20 0.33
CNR2 P34972 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL482718 0.80 MLNR (0.36) CA2NMT1MLNRCA12CA1
SCHEMBL19970918 0.79 FFAR1 (0.45) SMN1; SMN2LMNAHTTFFAR1FFAR4
SCHEMBL19970894 0.78 PSEN1 (0.42) KEAP1NFE2L2PSEN1PSEN2APH1B
SCHEMBL20291431 0.71 PSEN1 (0.34) CA9KEAP1NFE2L2PSEN1PSEN2
SCHEMBL27496337 0.70 CA2 (0.44) CA2NMT1MLNRCA12CA1
SCHEMBL12040860 0.68 CA2 (0.62) CA2CA12CA1CA9SMN1; SMN2
SCHEMBL7856535 0.68 CA2 (0.62) CA2CA12CA1CA9SMN1; SMN2
SCHEMBL21044975 0.67 ALDH1A1 (0.33)
SCHEMBL21044981 0.65 RIPK1 (0.37)
SCHEMBL21044993 0.65 RIPK1 (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113168093-B Pattern forming method, photosensitive resin composition, cured film, laminate, and device 富士胶片株式会社 2024-04-30 CN disclosed
CN-113383273-B Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2023-11-14 CN disclosed
CN-113383273-A Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2021-09-10 CN disclosed
CN-113168093-A Pattern forming method, photosensitive resin composition, cured film, laminate, and device 富士胶片株式会社 2021-07-23 CN disclosed
US-20180141268-A1 Method for Making an Object PHOTOCENTRIC LIMITED (GB) 2018-05-24 US disclosed