SCHEMBL19973247

SCHEMBL19973247

CC(C)N([SiH2]O[SiH3])C(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19973236 0.73
SCHEMBL16668175 0.65 LMNA (0.30)
SCHEMBL19973244 0.65
SCHEMBL15845255 0.62
SCHEMBL19628254 0.60
SCHEMBL17041925 0.60
SCHEMBL17041920 0.58
SCHEMBL19101208 0.58
SCHEMBL19984963 0.58
SCHEMBL17041921 0.58

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3516089-B1 COMPOSITIONS AND METHODS FOR THE DEPOSITION OF SILICON OXIDE FILMS VERSUM MAT US LLC (US) 2023-12-20 EP claimed
US-11584854-B2 Compositions and methods for the deposition of silicon oxide films VERSUM MATERIALS US, LLC (US) 2023-02-21 US claimed
CN-113403605-A Compositions and methods for depositing silicon oxide films 弗萨姆材料美国有限责任公司 2021-09-17 CN claimed
US-20200308416-A1 Compositions And Methods For The Deposition Of Silicon Oxide Films VERSUM MATERIALS US, LLC (US) 2020-10-01 US claimed
US-20200040192-A9 Compositions and Methods for the Deposition of Silicon Oxide Films VERSUM MATERIALS US, LLC (US) 2020-02-06 US claimed
EP-3516089-A1 COMPOSITIONS AND METHODS FOR THE DEPOSITION OF SILICON OXIDE FILMS Versum Materials US, LLC (US) 2019-07-31 EP claimed
US-20180127592-A1 Compositions and Methods for the Deposition of Silicon Oxide Films VERSUM MATERIALS US, LLC (US) 2018-05-10 US claimed
WO-2018053129-A1 COMPOSITIONS AND METHODS FOR THE DEPOSITION OF SILICON OXIDE FILMS VERSUM MATERIALS US, LLC (US) 2018-03-22 WO claimed
WO-2025029888-A1 METHODS TO IMPROVE THERMAL STABILITY AND FILM CRACKING MARGIN FOR LOW TEMPERATURE HIGH TENSILE SILICON NITRIDE THIN FILMS LAM RESEARCH CORPORATION (US) 2025-02-06 WO disclosed
CN-119343744-A Single wafer reactor and low temperature thermal silicon nitride deposition 朗姆研究公司 2025-01-21 CN disclosed
WO-2024254272-A1 METHODS TO PROVIDE VOID FREE TRENCH FILL FOR LOGIC AND MEMORY APPLICATIONS LAM RESEARCH CORPORATION (US) 2024-12-12 WO disclosed
WO-2024102763-A1 A ROBUST ICEFILL METHOD TO PROVIDE VOID FREE TRENCH FILL FOR LOGIC AND MEMORY APPLICATIONS LAM RESEARCH CORPORATION (US) 2024-05-16 WO disclosed
EP-4367709-A1 PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF SILICON-CONTAINING FILMS Lam Research Corporation (US) 2024-05-15 EP disclosed
EP-3516089-B1 COMPOSITIONS AND METHODS FOR THE DEPOSITION OF SILICON OXIDE FILMS VERSUM MAT US LLC (US) 2023-12-20 EP disclosed
WO-2023114401-A1 ATOMIC LAYER DEPOSITION PULSE SEQUENCE ENGINEERING FOR IMPROVED CONFORMALITY FOR LOW TEMPERATURE PRECURSORS LAM RESEARCH CORPORATION (US) 2023-06-22 WO disclosed
WO-2023076524-A1 ATOMIC LAYER DEPOSITION SEAM REDUCTION LAM RESEARCH CORPORATION (US) 2023-05-04 WO disclosed
US-11584854-B2 Compositions and methods for the deposition of silicon oxide films VERSUM MATERIALS US, LLC (US) 2023-02-21 US disclosed
WO-2023283144-A1 PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF SILICON-CONTAINING FILMS LAM RESEARCH CORPORATION (US) 2023-01-12 WO disclosed
CN-113403605-A Compositions and methods for depositing silicon oxide films 弗萨姆材料美国有限责任公司 2021-09-17 CN disclosed
US-20200308416-A1 Compositions And Methods For The Deposition Of Silicon Oxide Films VERSUM MATERIALS US, LLC (US) 2020-10-01 US disclosed