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Tetraphenylphosphonium

Tetraphenylphosphonium

SCHEMBL2000464

O=C([O-])c1ccccc1.O=C([O-])c1ccccc1.O=C([O-])c1ccccc1.O=C([O-])c1ccccc1.[O-]B([O-])[O-].c1ccc([P+](c2ccccc2)(c2ccccc2)c2ccccc2)cc1.c1ccc([P+](c2ccccc2)(c2ccccc2)c2ccccc2)cc1.c1ccc([P+](c2ccccc2)(c2ccccc2)c2ccccc2)cc1.c1ccc([P+](c2ccccc2)(c2ccccc2)c2ccccc2)cc1.c1ccc([P+](c2ccccc2)(c2ccccc2)c2ccccc2)cc1.c1ccc([P+](c2ccccc2)(c2ccccc2)c2ccccc2)cc1.c1ccc([P+](c2ccccc2)(c2ccccc2)c2ccccc2)cc1

nearest known ligand 0.61

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

CACNA1CCACNA1DCACNA1FCACNA1SDPP4HTR1BHTR1D

The experimentally established mechanism targets of Tetraphenylphosphonium. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ CA2 P00918 11/20 0.61
▸ CA4 P22748 2/20 0.61
▸ TSHR P16473 3/20 0.39
▸ CES2 O00748 2/20 0.39
▸ CES1 P23141 2/20 0.39
▸ DAO P14920 1/20 0.39
▸ NAPRT Q6XQN6 1/20 0.39
▸ ALDH1A1 P00352 1/20 0.39
▸ CA1 P00915 10/20 0.39
▸ TDP1 Q9NUW8 2/20 0.37
▸ L3MBTL1 Q9Y468 2/20 0.37
▸ POLB P06746 1/20 0.37
▸ CYP3A4 P08684 1/20 0.37
▸ PARP1 P09874 1/20 0.37
▸ MAPT P10636 1/20 0.37
▸ CYP2C19 P33261 1/20 0.37
▸ RECQL P46063 1/20 0.37
▸ BLM P54132 1/20 0.37
▸ PMP22 Q01453 1/20 0.37
▸ HSD17B10 Q99714 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Tetraphenylphosphonium SCHEMBL1032707 0.94 CA2 (0.70) CA2CA4TSHRCES2CES1
Tetraphenylphosphonium SCHEMBL21957806 0.90 CA2 (0.62) CA2CA4TSHRCES2CES1
Tetraphenylphosphonium SCHEMBL2000466 0.86 TSHR (0.58) CA2CA4TSHRCES2CES1
Benzoic Acid SCHEMBL9860901 0.85 CA2 (0.76) CA2CA4TSHRCES2CES1
Tetraphenylphosphonium SCHEMBL7616105 0.85 CA2 (0.57) CA2CA4TSHRCES2CES1
Tetraphenylphosphonium SCHEMBL11233696 0.84 CA2 (0.56) CA2CA4TSHRCES2CES1
Tetraphenylphosphonium SCHEMBL7614263 0.82 CA2 (0.53) CA2CA4TSHRCES2CES1
Benzoic Acid SCHEMBL7872905 0.81 CA2 (0.57) CA2CA4CES2CES1ALDH1A1
Tetraphenylphosphonium SCHEMBL4388860 0.80 CA2 (0.46) CA2CA4TSHRCES2CES1
Benzoic Acid SCHEMBL11789341 0.80 CA2 (0.94) CA2CA4TSHRCES2CES1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8921461-B2 Epoxy resin composition and semiconductor device SUMITOMO BAKELITE CO., LTD (JP) 2014-12-30 — — US disclosed
US-8697803-B2 Epoxy resin composition and semiconductor device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2014-04-15 — — US disclosed
US-8519067-B2 Epoxy resin composition and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2013-08-27 — — US disclosed
US-20130134610-A1 EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2013-05-30 — — US disclosed
US-20130119564-A1 EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2013-05-16 — — US disclosed
US-20130113122-A1 EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2013-05-09 — — US disclosed
US-8324326-B2 Epoxy resin composition and semiconductor device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2012-12-04 — — US disclosed
EP-2515329-A1 METHOD FOR PRODUCING ELECTRONIC DEVICE, ELECTRONIC DEVICE, METHOD FOR PRODUCING ELECTRONIC DEVICE PACKAGE, AND ELECTRONIC DEVICE PACKAGE Sumitomo Bakelite Co., Ltd. (JP) 2012-10-24 — — EP disclosed
CN-101223207-B Epoxy resin composition and semiconductor device SUMITOMO BAKELITE CO 2012-02-29 — — CN disclosed
US-20110147954-A1 SEMICONDUCTOR DEVICE, AND RESIN COMPOSITION USED FOR SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2011-06-23 — — US disclosed
US-20090096114-A1 Epoxy Resin Composition and Semiconductor Device KOTANI TAKAHIRO 2009-04-16 — — US disclosed
CN-101223207-A Epoxy resin composition and semiconductor device SUMITOMO BAKELITE CO (JP) 2008-07-16 — — CN disclosed
US-20070216040-A1 containing an epoxy resin, a phenol resin, an inorganic filler, a curing accelerator, a glycerol tri-fatty acid ester produced by dehydration condensation reaction of glycerol and a saturated fatty acid with a carbon atom content of 24-36, and a hydrotalcite compound; excellent mold releasability SUMITOMO BAKELITE CO., LTD. (JP) 2007-09-20 — — US disclosed
US-20070027273-A1 flame resistance, good fluidity and adequately higher solder-reflow resistance to allow for the use of a lead-free solder without a flame retardant; halogen-free SUMITOMO BAKELITE CO., LTD. (JP) 2007-02-01 — — US disclosed
EP-1191062-B1 Epoxy resin composition and semiconductor devices SUMITOMO BAKELITE CO (JP) 2006-11-15 — — EP disclosed
US-20060205896-A1 Epoxy resin composition for semiconductor sealing and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2006-09-14 — — US disclosed
US-20060157872-A1 Epoxy resin composition and semiconductor device KOTANI TAKAHIRO 2006-07-20 — — US disclosed
US-20060154079-A1 Epoxy resin composition and semiconductor device SUMITOMO BAKELITE COMPANY LIMITED (JP) 2006-07-13 — — US disclosed
US-6376101-B1 BLEND OF EPOXY RESIN, PHENOL RESIN AND FILLER; ENCAPSULATING SEMICONDUCTORS SUMITOMO BAKELITE CO., LTD. (JP) 2002-04-23 — — US disclosed
EP-1191062-A1 Epoxy resin composition and semiconductor devices SUMITOMO BAKELITE COMPANY LIMITED (JP) 2002-03-27 — — EP disclosed