Known targets — ChEMBL curated mechanism
CACNA1CCACNA1DCACNA1FCACNA1SDPP4HTR1BHTR1D
The experimentally established mechanism targets of Tetraphenylphosphonium. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 3/20 | 0.58 |
| ▸ | DAO | P14920 | 1/20 | 0.58 |
| ▸ | NAPRT | Q6XQN6 | 1/20 | 0.58 |
| ▸ | CES2 | O00748 | 3/20 | 0.50 |
| ▸ | CES1 | P23141 | 3/20 | 0.50 |
| ▸ | SRD5A2 | P31213 | 2/20 | 0.50 |
| ▸ | CA2 | P00918 | 2/20 | 0.46 |
| ▸ | CA1 | P00915 | 1/20 | 0.46 |
| ▸ | TP53 | P04637 | 1/20 | 0.44 |
| ▸ | CA4 | P22748 | 1/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.41 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.41 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.40 |
| ▸ | CYP2C8 | P10632 | 1/20 | 0.40 |
| ▸ | KMO | O15229 | 1/20 | 0.39 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.39 |
| ▸ | HPGD | P15428 | 1/20 | 0.39 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Tetraphenylphosphonium SCHEMBL2000464 | 0.86 | CA2 (0.61) | TSHRDAONAPRTCES2CES1 | |
| Benzoic Acid SCHEMBL28946502 | 0.84 | TSHR (0.74) | TSHRDAONAPRTCES2CES1 | |
| Iodide SCHEMBL10901409 | 0.83 | TSHR (0.56) | TSHRDAONAPRTCES2CES1 | |
| Tetraphenylphosphonium SCHEMBL6567177 | 0.82 | HIF1A (0.41) | TSHRCA4ALDH1A1CYP1A2HPGD | |
| Tetraphenylphosphonium SCHEMBL4428554 | 0.82 | HIF1A (0.41) | TSHRCA4ALDH1A1CYP1A2HPGD | |
| Tetraphenylphosphonium SCHEMBL7172885 | 0.79 | HIF1A (0.39) | TSHRALDH1A1CYP1A2HPGDHSD17B10 | |
| Tetraphenylphosphonium SCHEMBL1032707 | 0.78 | CA2 (0.70) | TSHRDAONAPRTCES2CES1 | |
| Tetraphenylphosphonium SCHEMBL7172888 | 0.77 | CA4 (0.39) | TSHRCA2CA1CA4ALDH1A1 | |
| Tetraphenylphosphonium SCHEMBL4388860 | 0.77 | CA2 (0.46) | TSHRDAONAPRTCES2CES1 | |
| Benzoic Acid SCHEMBL975929 | 0.76 | TSHR (1.00) | TSHRDAONAPRTCES2CES1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9464163-B2 | Novolak resin containing hexafluoroisopropanol group, method for producing same, and composition of same | CENTRAL GLASS COMPANY, LIMITED (JP) | 2016-10-11 | — | — | US | disclosed |
| US-20150337077-A1 | Novolak Resin Containing Hexafluoroisopropanol Group, Method for Producing Same, and Composition of Same | CENTRAL GLASS COMPANY, LIMITED (JP) | 2015-11-26 | — | — | US | disclosed |
| EP-2515329-A1 | METHOD FOR PRODUCING ELECTRONIC DEVICE, ELECTRONIC DEVICE, METHOD FOR PRODUCING ELECTRONIC DEVICE PACKAGE, AND ELECTRONIC DEVICE PACKAGE | Sumitomo Bakelite Co., Ltd. (JP) | 2012-10-24 | — | — | EP | disclosed |
| EP-2506298-A1 | PRODUCTION METHOD FOR ELECTRONIC DEVICE, ELECTRONIC DEVICE, PRODUCTION METHOD FOR ELECTRONIC DEVICE PACKAGE, AND ELECTRONIC DEVICE PACKAGE | Sumitomo Bakelite Company Limited (JP) | 2012-10-03 | — | — | EP | disclosed |
| US-20120228782-A1 | METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE PACKAGE AND ELECTRONIC DEVICE PACKAGE | Sumitomo Bakelite Co, Ltd (JP) | 2012-09-13 | — | — | US | disclosed |
| CN-101223207-B | Epoxy resin composition and semiconductor device | SUMITOMO BAKELITE CO | 2012-02-29 | — | — | CN | disclosed |
| US-20110147954-A1 | SEMICONDUCTOR DEVICE, AND RESIN COMPOSITION USED FOR SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2011-06-23 | — | — | US | disclosed |
| US-7612458-B2 | blends contains a phenolic resin, a curing accelerator and an inorganic filler silicon dioxide and alumina; excellent flowability and an excellent moldability, solder reflow resistance | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2009-11-03 | — | — | US | disclosed |
| US-7605213-B2 | flame resistance, good fluidity and adequately higher solder-reflow resistance to allow for the use of a lead-free solder without a flame retardant; halogen-free | SUMITOMO BAKELITE CO., LTD. (JP) | 2009-10-20 | — | — | US | disclosed |
| CN-101223207-A | Epoxy resin composition and semiconductor device | SUMITOMO BAKELITE CO (JP) | 2008-07-16 | — | — | CN | disclosed |
| US-20070027273-A1 | flame resistance, good fluidity and adequately higher solder-reflow resistance to allow for the use of a lead-free solder without a flame retardant; halogen-free | SUMITOMO BAKELITE CO., LTD. (JP) | 2007-02-01 | — | — | US | disclosed |
| EP-1191062-B1 | Epoxy resin composition and semiconductor devices | SUMITOMO BAKELITE CO (JP) | 2006-11-15 | — | — | EP | disclosed |
| US-20060228561-A1 | blends contains a phenolic resin, a curing accelerator and an inorganic filler silicon dioxide and alumina; excellent flowability and an excellent moldability, solder reflow resistance | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2006-10-12 | — | — | US | disclosed |
| US-20060205896-A1 | Epoxy resin composition for semiconductor sealing and semiconductor device | SUMITOMO BAKELITE CO., LTD. (JP) | 2006-09-14 | — | — | US | disclosed |
| US-6376101-B1 | BLEND OF EPOXY RESIN, PHENOL RESIN AND FILLER; ENCAPSULATING SEMICONDUCTORS | SUMITOMO BAKELITE CO., LTD. (JP) | 2002-04-23 | — | — | US | disclosed |
| EP-1191062-A1 | Epoxy resin composition and semiconductor devices | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2002-03-27 | — | — | EP | disclosed |