SCHEMBL2013741

SCHEMBL2013741

Cc1ccsc1C(=O)C(C)(C)N1CCOCC1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.52
SMN1; SMN2 Q16637 4/20 0.52
GLA P06280 1/20 0.52
MAPK1 P28482 3/20 0.49
TSHR P16473 1/20 0.49
LMNA P02545 1/20 0.41
GSK3B P49841 1/20 0.41
PKM P14618 2/20 0.40
MAPT P10636 1/20 0.39
NPC1 O15118 1/20 0.39
TP53 P04637 1/20 0.39
HPGD P15428 1/20 0.39
NFKB1 P19838 1/20 0.39
RAB9A P51151 1/20 0.39
NFKB2 Q00653 1/20 0.39
RELA Q04206 1/20 0.39
KMT2A Q03164 1/20 0.38
POLB P06746 1/20 0.38
CA12 O43570 1/20 0.38
CA1 P00915 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29175534 0.79 SMN1; SMN2 (0.49) ALDH1A1SMN1; SMN2GLAMAPK1TSHR
SCHEMBL29256745 0.79 ALDH1A1 (0.55) ALDH1A1SMN1; SMN2GLAMAPK1TSHR
SCHEMBL324878 0.77 ALDH1A1 (0.63) ALDH1A1SMN1; SMN2GLALMNAHPGD
SCHEMBL9681149 0.75 ALDH1A1 (0.52) ALDH1A1SMN1; SMN2GLAMAPK1TSHR
SCHEMBL12666536 0.73 GSK3B (0.53) ALDH1A1SMN1; SMN2LMNAGSK3BPKM
SCHEMBL701448 0.72 MAPK1 (0.70) ALDH1A1SMN1; SMN2MAPK1TSHRLMNA
SCHEMBL9679519 0.72 SMN1; SMN2 (0.61) ALDH1A1SMN1; SMN2MAPK1TSHRLMNA
SCHEMBL44793 0.71 ALDH1A1 (0.50) ALDH1A1SMN1; SMN2GLAMAPK1LMNA
SCHEMBL57063 0.71 ALDH1A1 (0.46) ALDH1A1SMN1; SMN2MAPK1TSHRLMNA
SCHEMBL10941442 0.70 ALDH1A1 (0.72) ALDH1A1SMN1; SMN2MAPK1TSHRLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0626354-B1 Hot-stamping glass REVLON CONSUMER PROD CORP (US) 1997-08-06 EP claimed
US-5039715-A Photocurable acrylate adhesive containing perester/tautomeric acid adhesion promoter DYMAX CORPORATION (US) 1991-08-13 US claimed
US-4964938-A Bonding method using photocurable acrylate adhesive containing perester/tautomeric acid adhesion promoter DYMAX CORPORATION (US) 1990-10-23 US claimed
EP-0290147-A2 Radiation-cured adhesive system containing perester/tautomeric acid adhesion promoter DYMAX CORPORATION (US) 1988-11-09 EP claimed
WO-2023132214-A1 CURABLE COMPOSITION AND CURED PRODUCT 株式会社カネカ 2023-07-13 WO disclosed
CN-110651336-B Conductive paste composition, electrode device comprising same, and method for producing conductive paste composition 株式会社钟化 2022-05-17 CN disclosed
US-11066509-B2 Conductive paste composition, device comprising electrode formed from same, and method for producing conductive paste composition KANEKA CORPORATION (JP) 2021-07-20 US disclosed
EP-2572243-B1 POLYMERIZABLE COMPOSITION FUJIFILM CORP (JP) 2021-04-07 EP disclosed
WO-2020196802-A1 TRANSFER FILM FOR SILVER CONDUCTIVE MATERIAL PROTECTIVE FILM, PRODUCTION METHOD OF PATTERNED SILVER CONDUCTIVE MATERIAL, LAMINATE BODY AND TOUCH PANEL 富士フイルム株式会社 2020-10-01 WO disclosed
US-20200095370-A1 CONDUCTIVE PASTE COMPOSITION, DEVICE COMPRISING ELECTRODE FORMED FROM SAME, AND METHOD FOR PRODUCING CONDUCTIVE PASTE COMPOSITION KANEKA CORPORATION (JP) 2020-03-26 US disclosed
EP-1724322-B1 ACTINIC RADIATION-CURABLE COMPOSITION FOR FORMED-IN- PLACE GASKETS AND FORMED-IN-PLACE GASKETS KANEKA CORP (JP) 2015-07-29 EP disclosed
EP-2832553-A1 INKJET RECORDING METHOD AND PRINTED MATTER FUJIFILM Corporation (JP) 2015-02-04 EP disclosed
WO-2012080146-A1 UV-CURABLE INK SIEGWERK BENELUX SA (BE) 2012-06-21 WO disclosed
EP-2463346-A1 UV-curable ink Siegwerk Benelux SA (BE) 2012-06-13 EP disclosed
WO-2011071133-A1 BLACK CURABLE COMPOSITION, LIGHT-SHIELDING COLOR FILTER, LIGHT-SHIELDING FILM AND METHOD FOR MANUFACTURING THE SAME, WAFER LEVEL LENS, AND SOLID-STATE IMAGING DEVICE FUJIFILM CORPORATION (JP) 2011-06-16 WO disclosed
US-7781494-B2 Active energy curing type composition for in-place shaping gasket and in-place shaped gasket KANEKA CORPORATION (JP) 2010-08-24 US disclosed
US-20070203296-A1 Active Energy Curing Type Composition For In-Place Shaping Gasket And In-Place Shaped Gasket KANEKA CORPORATION (JP) 2007-08-30 US disclosed
EP-1724322-A1 ACTINIC RADIATION-CURABLE COMPOSITION FOR FORMED-IN- PLACE GASKETS AND FORMED-IN-PLACE GASKETS KANEKA CORPORATION (JP) 2006-11-22 EP disclosed
EP-0626354-B1 Hot-stamping glass REVLON CONSUMER PROD CORP (US) 1997-08-06 EP disclosed
EP-0499483-A1 Anaerobic adhesive composition THREE BOND CO., LTD. (JP) 1992-08-19 EP disclosed