SCHEMBL20164063

SCHEMBL20164063

O=S(=O)(Nc1ccc(F)c([Ti](c2c(F)ccc(NS(=O)(=O)c3ccc4ccccc4c3)c2F)(C2C=CC=C2)C2C=CC=C2)c1F)c1ccc2ccccc2c1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 5/20 0.44
KMT2A Q03164 5/20 0.44
GLO1 Q04760 1/20 0.42
TDP1 Q9NUW8 1/20 0.42
PLAU P00749 1/20 0.41
ATM Q13315 1/20 0.41
PKM P14618 2/20 0.40
TSHR P16473 1/20 0.40
L3MBTL1 Q9Y468 1/20 0.40
KAT6A Q92794 2/20 0.39
PGAM1 P18669 1/20 0.39
PKLR P30613 1/20 0.39
PGR P06401 1/20 0.39
KAT7 O95251 1/20 0.39
CYP3A4 P08684 1/20 0.39
CYP2D6 P10635 1/20 0.39
KCNH2 Q12809 1/20 0.39
KAT6B Q8WYB5 1/20 0.39
KAT5 Q92993 1/20 0.39
KAT8 Q9H7Z6 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29104859 0.86 SLC40A1 (0.44) CYP2D6SMN1; SMN2
SCHEMBL28608351 0.81 CYP2D6 (0.40) MEN1KMT2ATDP1CYP2D6
SCHEMBL23854463 0.81 KEAP1 (0.45) MEN1KMT2ATDP1TSHRL3MBTL1
SCHEMBL483125 0.77 MEN1 (0.43) MEN1KMT2AGLO1TDP1PLAU
SCHEMBL7267181 0.76 MEN1 (0.51) MEN1KMT2AGLO1TDP1PLAU
SCHEMBL20451206 0.76 CYP3A4 (0.36) GLO1CYP3A4KAT8
SCHEMBL17849571 0.70 KAT6A (0.59) MEN1KMT2AGLO1TDP1ATM
SCHEMBL10013445 0.70 MEN1 (0.60) MEN1KMT2AGLO1TDP1PLAU
SCHEMBL23854478 0.68 CYP3A4 (0.46) CYP3A4
SCHEMBL28327804 0.67 MEN1 (0.56) MEN1KMT2AGLO1TDP1PLAU

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113168093-B Pattern forming method, photosensitive resin composition, cured film, laminate, and device 富士胶片株式会社 2024-04-30 CN disclosed
CN-113383273-B Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2023-11-14 CN disclosed
CN-113383273-A Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2021-09-10 CN disclosed
CN-113168093-A Pattern forming method, photosensitive resin composition, cured film, laminate, and device 富士胶片株式会社 2021-07-23 CN disclosed
US-20180141268-A1 Method for Making an Object PHOTOCENTRIC LIMITED (GB) 2018-05-24 US disclosed