SCHEMBL20185146

SCHEMBL20185146

NC(=O)Cc1ccc([N+](=O)[O-])c(C(=O)O)c1

nearest known ligand 0.54

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
DTYMK P23919 1/20 0.54
CASP6 P55212 2/20 0.44
TSHR P16473 2/20 0.41
ALDH1A1 P00352 2/20 0.41
TDP1 Q9NUW8 2/20 0.41
CA2 P00918 1/20 0.41
LMNA P02545 1/20 0.41
CTSD P07339 1/20 0.41
CYP3A4 P08684 1/20 0.41
ALOX15 P16050 1/20 0.41
CDC25B P30305 1/20 0.40
RCE1 Q9Y256 1/20 0.40
CYP19A1 P11511 1/20 0.40
KMT2A Q03164 2/20 0.39
CYP1A2 P05177 1/20 0.39
MEN1 O00255 1/20 0.38
TTR P02766 1/20 0.38
PPOX P50336 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7649559 0.87 DTYMK (0.57) DTYMKCASP6TSHRALDH1A1TDP1
SCHEMBL16692788 0.84 DTYMK (0.57) DTYMKCASP6TSHRALDH1A1TDP1
SCHEMBL4684043 0.83 CASP6 (0.49) CASP6TSHRALDH1A1TDP1CA2
SCHEMBL6390864 0.82 DTYMK (0.58) DTYMKCASP6TSHRALDH1A1TDP1
SCHEMBL27538558 0.81 DTYMK (0.54) DTYMKCASP6TSHRALDH1A1TDP1
SCHEMBL4101251 0.81 CA2 (0.43) CASP6TSHRALDH1A1CA2LMNA
SCHEMBL5184754 0.81 GPR35 (0.51) TSHRALDH1A1TDP1CA2LMNA
SCHEMBL10653362 0.81 DTYMK (0.57) DTYMKCASP6TSHRALDH1A1TDP1
SCHEMBL15895080 0.81 DTYMK (0.57) DTYMKCASP6TSHRALDH1A1TDP1
SCHEMBL14473128 0.81 DTYMK (0.57) DTYMKCASP6TSHRALDH1A1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3964594-B1 FLUX AND SOLDER PASTE KOKI KK (JP) 2024-04-17 EP disclosed
US-11806818-B2 Flux and solder paste KOKI COMPANY LIMITED (JP) 2023-11-07 US disclosed
US-10933495-B2 Solder paste containing solder powder and flux KOKI COMPANY LIMITED (JP) 2021-03-02 US disclosed
EP-3369522-A1 FLUX AND SOLDER COMPOSITION Koki Company Limited (JP) 2018-09-05 EP disclosed
US-20180147675-A1 Flux and Solder Composition KOKI COMPANY LIMITED (JP) 2018-05-31 US disclosed
CN-107614190-A Scaling powder and solder composition 株式会社弘辉 2018-01-19 CN disclosed