Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DHFR | P00374 | 1/20 | 0.38 |
| ▸ | HTT | P42858 | 2/20 | 0.35 |
| ▸ | POLB | P06746 | 1/20 | 0.35 |
| ▸ | NOS3 | P29474 | 1/20 | 0.35 |
| ▸ | NOS1 | P29475 | 1/20 | 0.35 |
| ▸ | NOS2 | P35228 | 1/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.35 |
| ▸ | TSHR | P16473 | 2/20 | 0.35 |
| ▸ | ELANE | P08246 | 2/20 | 0.34 |
| ▸ | GPR84 | Q9NQS5 | 1/20 | 0.33 |
| ▸ | PRKCI | P41743 | 1/20 | 0.33 |
| ▸ | ACHE | P22303 | 1/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.32 |
| ▸ | GABRP | O00591 | 1/20 | 0.31 |
| ▸ | GABRD | O14764 | 1/20 | 0.31 |
| ▸ | GABRA1 | P14867 | 1/20 | 0.31 |
| ▸ | GABRB1 | P18505 | 1/20 | 0.31 |
| ▸ | GABRG2 | P18507 | 1/20 | 0.31 |
| ▸ | GABRB3 | P28472 | 1/20 | 0.31 |
| ▸ | GABRA5 | P31644 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL396696 | 0.86 | DHFR (0.43) | DHFRHTTPOLBNOS3NOS1 | |
| SCHEMBL30259832 | 0.86 | NOS3 (0.39) | DHFRHTTPOLBNOS3NOS1 | |
| SCHEMBL1004953 | 0.86 | NOS3 (0.39) | DHFRHTTPOLBNOS3NOS1 | |
| SCHEMBL10432144 | 0.80 | DHFR (0.36) | DHFRHTTPOLBNOS3NOS1 | |
| SCHEMBL11437484 | 0.78 | DHFR (0.39) | DHFRHTTPOLBNOS3NOS1 | |
| SCHEMBL20012880 | 0.78 | NOS3 (0.41) | DHFRHTTPOLBNOS3NOS1 | |
| SCHEMBL13756240 | 0.78 | AOC3 (0.32) | DHFRHTTPOLBNOS3NOS1 | |
| SCHEMBL2154314 | 0.78 | GPR84 (0.39) | HTTPOLBNOS3NOS1NOS2 | |
| SCHEMBL33574 | 0.78 | HTT (0.54) | HTTPOLBNOS3NOS1NOS2 | |
| SCHEMBL652984 | 0.77 | PRKCI (0.41) | DHFRHTTPOLBALDH1A1TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 68 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12077644-B2 | Amide acid oligomer process for molding polyimide composites | KANEKA AMERICAS HOLDING, INC. (US) | 2024-09-03 | — | — | US | claimed |
| CN-112888726-B | Novel amic acid oligomer process for molding polyimide composites | 钟化美洲控股公司 | 2023-10-03 | — | — | CN | claimed |
| US-20210340344-A1 | Novel Amide Acid Oligomer Process For Molding Polyimide Composites | KANEKA AMERICAS HOLDING, INC. (US) | 2021-11-04 | — | — | US | claimed |
| EP-3841152-A1 | A NOVEL AMIDE ACID OLIGOMER PROCESS FOR MOLDING POLYIMIDE COMPOSITES | Kaneka Americas Holding, Inc. (US) | 2021-06-30 | — | — | EP | claimed |
| CN-112888726-A | Novel amic acid oligomer process for molding polyimide composites | 钟化美洲控股公司 | 2021-06-01 | — | — | CN | claimed |
| US-10815390-B2 | Polyimide resin composition and varnish produced from terminal-modified imide oligomer prepared using 2-phenyl-4,4′-diaminodiphenyl ether and thermoplastic aromatic polyimide prepared using oxydiphthalic acid, polyimide resin composition molded article and prepreg having excellent heat resistance and mechanical characteristic, and fiber-reinforced composite material thereof | KANEKA CORPORATION (JP) | 2020-10-27 | — | — | US | claimed |
| WO-2020072639-A1 | A NOVEL AMIDE ACID OLIGOMER PROCESS FOR MOLDING POLYIMIDE COMPOSITES | KANEKA AMERICAS HOLDING, INC. (US) | 2020-04-09 | — | — | WO | claimed |
| US-20180273798-A1 | POLYIMIDE RESIN COMPOSITION AND VARNISH PRODUCED FROM TERMINAL-MODIFIED IMIDE OLIGOMER PREPARED USING 2-PHENYL-4,4'-DIAMINODIPHENYL ETHER AND THERMOPLASTIC AROMATIC POLYIMIDE PREPARED USING OXYDIPHTHALIC ACID, POLYIMIDE RESIN COMPOSITION MOLDED ARTICLE AND PREPREG HAVING EXCELLENT HEAT RESISTANCE AND MECHANICAL CHARACTERISTIC, AND FIBER-REINFORCED COMPOSITE MATERIAL THEREOF | KANEKA CORPORATION (JP) | 2018-09-27 | — | — | US | claimed |
| US-10017666-B2 | Polyimide resin composition and varnish produced from terminal-modified imide oligomer prepared using 2-phenyl-4,4′-diaminodiphenyl ether and thermoplastic aromatic polyimide prepared using oxydiphthalic acid, polyimide resin composition molded article and prepreg having excellent heat resistance and mechanical characteristic, and fiber-reinforced composite material thereof | KANEKA CORPORATION (JP) | 2018-07-10 | — | — | US | claimed |
| US-12305003-B2 | Polyamic acid having specific composition, varnish, cured product, and composite material | KANEKA CORPORATION (JP) | 2025-05-20 | — | — | US | disclosed |
| US-12077644-B2 | Amide acid oligomer process for molding polyimide composites | KANEKA AMERICAS HOLDING, INC. (US) | 2024-09-03 | — | — | US | disclosed |
| US-12049545-B2 | Uncured laminate, reinforcing fiber composite material, method for producing uncured laminate, and method for producing reinforcing fiber composite material | KANEKA CORPORATION (JP) | 2024-07-30 | — | — | US | disclosed |
| EP-3144338-B1 | VARNISH INCLUDING 2-PHENYL-4,4'-DIAMINODIPHENYL ETHER, IMIDE RESIN COMPOSITION HAVING EXCELLENT MOLDABILITY, CURED RESIN MOLDED ARTICLE HAVING EXCELLENT BREAKING ELONGATION, PREPREG THEREOF, IMIDE PREPREG THEREOF, AND FIBER-REINFORCED MATERIAL THEREOF HAVING HIGH HEAT RESISTANCE AND EXCELLENT MECHANICAL STRENGTH | KANEKA CORP (JP) | 2023-10-25 | — | — | EP | disclosed |
| CN-112888726-B | Novel amic acid oligomer process for molding polyimide composites | 钟化美洲控股公司 | 2023-10-03 | — | — | CN | disclosed |
| US-4921745-A | Honeycomb structure of aromatic polyimide | UBE INDUSTRIES, LTD. (JP) | 1990-05-01 | — | — | US | disclosed |
| EP-0357367-A2 | Terminal-modified aromatic imide oligomer composition | UBE INDUSTRIES, LTD. (JP) | 1990-03-07 | — | — | EP | disclosed |
| US-4894403-A | USING ETHYLENICALLY UNSATURATED AROMATIC MONOMER | THE DOW CHEMICAL COMPANY (US) | 1990-01-16 | — | — | US | disclosed |
| EP-0304913-A2 | Terminal-modified imide oligomer and solution composition of the same | UBE INDUSTRIES, LTD. (JP) | 1989-03-01 | — | — | EP | disclosed |
| EP-0302271-A1 | Polyisocyanate compositions containing rigid compounds or polymers, and polyurethanes prepared therefrom | THE DOW CHEMICAL COMPANY (US) | 1989-02-08 | — | — | EP | disclosed |
| WO-1989000597-A1 | POLYISOCYANATE COMPOSITIONS CONTAINING RIGID COMPOUNDS OR POLYMERS, AND POLYURETHANES PREPARED THEREFROM | THE DOW CHEMICAL COMPANY (US) | 1989-01-26 | — | — | WO | disclosed |