Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NOS3 | P29474 | 2/20 | 0.39 |
| ▸ | NOS2 | P35228 | 2/20 | 0.39 |
| ▸ | NOS1 | P29475 | 1/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.35 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.35 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.35 |
| ▸ | CASP7 | P55210 | 1/20 | 0.35 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.35 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.35 |
| ▸ | TSHR | P16473 | 1/20 | 0.35 |
| ▸ | DHFR | P00374 | 1/20 | 0.34 |
| ▸ | HTT | P42858 | 2/20 | 0.33 |
| ▸ | MAPT | P10636 | 1/20 | 0.33 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.31 |
| ▸ | POLB | P06746 | 1/20 | 0.31 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.31 |
| ▸ | MEN1 | O00255 | 1/20 | 0.31 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.31 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.31 |
| ▸ | THRA | P10827 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30259832 | 1.00 | NOS3 (0.39) | NOS3NOS2NOS1ALDH1A1CYP1A2 | |
| SCHEMBL20012880 | 0.89 | NOS3 (0.41) | NOS3NOS2NOS1ALDH1A1CYP1A2 | |
| SCHEMBL2031885 | 0.86 | DHFR (0.38) | NOS3NOS2NOS1ALDH1A1CYP1A2 | |
| SCHEMBL940286 | 0.81 | ALDH1A1 (0.45) | ALDH1A1CYP1A2ALOX15CASP7HIF1A | |
| SCHEMBL396696 | 0.79 | DHFR (0.43) | NOS3NOS2NOS1ALDH1A1TSHR | |
| SCHEMBL11412026 | 0.79 | ALDH1A1 (0.43) | NOS3NOS2NOS1ALDH1A1CYP1A2 | |
| SCHEMBL12964261 | 0.77 | NOS3 (0.42) | NOS3NOS2NOS1ALDH1A1CYP1A2 | |
| SCHEMBL5158799 | 0.77 | ALDH1A1 (0.52) | NOS3NOS2NOS1ALDH1A1CYP1A2 | |
| SCHEMBL17058864 | 0.76 | IMPDH2 (0.33) | NOS3NOS2NOS1CYP1A2ALOX15 | |
| SCHEMBL7601632 | 0.76 | ALDH1A1 (0.46) | NOS3NOS2NOS1ALDH1A1CYP1A2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 96 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12077644-B2 | Amide acid oligomer process for molding polyimide composites | KANEKA AMERICAS HOLDING, INC. (US) | 2024-09-03 | — | — | US | claimed |
| CN-112888726-B | Novel amic acid oligomer process for molding polyimide composites | 钟化美洲控股公司 | 2023-10-03 | — | — | CN | claimed |
| US-20210340344-A1 | Novel Amide Acid Oligomer Process For Molding Polyimide Composites | KANEKA AMERICAS HOLDING, INC. (US) | 2021-11-04 | — | — | US | claimed |
| EP-3841152-A1 | A NOVEL AMIDE ACID OLIGOMER PROCESS FOR MOLDING POLYIMIDE COMPOSITES | Kaneka Americas Holding, Inc. (US) | 2021-06-30 | — | — | EP | claimed |
| CN-112888726-A | Novel amic acid oligomer process for molding polyimide composites | 钟化美洲控股公司 | 2021-06-01 | — | — | CN | claimed |
| US-10815390-B2 | Polyimide resin composition and varnish produced from terminal-modified imide oligomer prepared using 2-phenyl-4,4′-diaminodiphenyl ether and thermoplastic aromatic polyimide prepared using oxydiphthalic acid, polyimide resin composition molded article and prepreg having excellent heat resistance and mechanical characteristic, and fiber-reinforced composite material thereof | KANEKA CORPORATION (JP) | 2020-10-27 | — | — | US | claimed |
| WO-2020072639-A1 | A NOVEL AMIDE ACID OLIGOMER PROCESS FOR MOLDING POLYIMIDE COMPOSITES | KANEKA AMERICAS HOLDING, INC. (US) | 2020-04-09 | — | — | WO | claimed |
| US-20180273798-A1 | POLYIMIDE RESIN COMPOSITION AND VARNISH PRODUCED FROM TERMINAL-MODIFIED IMIDE OLIGOMER PREPARED USING 2-PHENYL-4,4'-DIAMINODIPHENYL ETHER AND THERMOPLASTIC AROMATIC POLYIMIDE PREPARED USING OXYDIPHTHALIC ACID, POLYIMIDE RESIN COMPOSITION MOLDED ARTICLE AND PREPREG HAVING EXCELLENT HEAT RESISTANCE AND MECHANICAL CHARACTERISTIC, AND FIBER-REINFORCED COMPOSITE MATERIAL THEREOF | KANEKA CORPORATION (JP) | 2018-09-27 | — | — | US | claimed |
| US-10017666-B2 | Polyimide resin composition and varnish produced from terminal-modified imide oligomer prepared using 2-phenyl-4,4′-diaminodiphenyl ether and thermoplastic aromatic polyimide prepared using oxydiphthalic acid, polyimide resin composition molded article and prepreg having excellent heat resistance and mechanical characteristic, and fiber-reinforced composite material thereof | KANEKA CORPORATION (JP) | 2018-07-10 | — | — | US | claimed |
| US-12590184-B2 | Polyimide resin molded body and production method for same | TOYO SEIKAN GROUP HOLDINGS, LTD. (JP) | 2026-03-31 | — | — | US | disclosed |
| EP-3892672-B1 | FIBER-REINFORCED POLYIMIDE RESIN MOLDING PRECURSOR AND METHOD FOR PRODUCING SAME | TOYO SEIKAN GROUP HOLDINGS LTD (JP) | 2025-06-25 | — | — | EP | disclosed |
| US-12305003-B2 | Polyamic acid having specific composition, varnish, cured product, and composite material | KANEKA CORPORATION (JP) | 2025-05-20 | — | — | US | disclosed |
| US-12221517-B2 | Fiber-reinforced polyimide resin molding precursor and method for producing the same | TOYO SEIKAN GROUP HOLDINGS, LTD. (JP) | 2025-02-11 | — | — | US | disclosed |
| US-12077644-B2 | Amide acid oligomer process for molding polyimide composites | KANEKA AMERICAS HOLDING, INC. (US) | 2024-09-03 | — | — | US | disclosed |
| EP-0379131-A2 | Thermosetting resin composition | UBE INDUSTRIES, LTD. (JP) | 1990-07-25 | — | — | EP | disclosed |
| EP-0371154-A1 | Prepreg of reinforced imide oligomer | UBE INDUSTRIES, LTD. (JP) | 1990-06-06 | — | — | EP | disclosed |
| US-4921745-A | Honeycomb structure of aromatic polyimide | UBE INDUSTRIES, LTD. (JP) | 1990-05-01 | — | — | US | disclosed |
| EP-0357367-A2 | Terminal-modified aromatic imide oligomer composition | UBE INDUSTRIES, LTD. (JP) | 1990-03-07 | — | — | EP | disclosed |
| EP-0304913-A2 | Terminal-modified imide oligomer and solution composition of the same | UBE INDUSTRIES, LTD. (JP) | 1989-03-01 | — | — | EP | disclosed |
| EP-0254230-A2 | Heat-resistant photoresist film | Asahi Kasei Kogyo Kabushiki Kaisha (JP) | 1988-01-27 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12590184-B2 | Polyimide resin molded body and production method for same | PBRM1, FGB, PF4 | NOS3 2816/4885NOS2 2580/4885NOS1 2778/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.